Super lightweight microwave circuits

Abstract

Abstract An extremely lightweight microwave circuit comprising stripline printed circuitry which is highly efficient, inexpensive, and suitable for use in electronics systems for space and military applications. The microwave circuit is formed by printing on a very thin substrate such as Mylar or alumina approximately 0.005 inches thick. The circuit is assembled between two thin sheets of a foam material approximately 0.040 to 0.050 inches thick. This assembly forms a sandwich which has its outer surface copperplated. The thin sheet of material containing the circuitry and the lightweight dielectric foam sheets on each side of the circuit are bonded together with a low loss adhesive. Holes are drilled into the assembly and these holes are also plated throughout for additional mechanical support. In addition, these holes, properly located, provide mode suppression and thus, reduce the amount of radiation of electromagnetic energy. Thick film or printed circuit techniques are used to provide the electrical paths on the thin substrate. The conductive metallic surface on the outside of the sandwich is appositioned by the use of electroless copper-plating techniques. The connectors for the electrical paths of the circuit are secured to the assembly by means of a conductive epoxy or adhesive.

Inventors

• 👤 H Jones
• 👤 R Norris

Bibliographic Details