US4268803A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Periodic lid for integrated circuit
Assignee: Comsat Corp
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Filing: 1979-05-24
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Granted: 1981-05-19
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Expires: 1999-05-24
Abstract
Abstract Periodic fins are provided on the lid of a microwave integrated circuit (MIC) package in order to reactively suppress specified bands of frequency and thereby increase the permissible dimensions of the MIC package.
Inventors
- 👤 William H. Childs
- 👤 Peter A. Carlton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 20:06
CPC Classifications
H; H01; H01P; H01P1/00; H01P1/20; H01P1/201; H01P1/203; H01P1/2039
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
84 words
In a microwave integrated circuit (MIC) package of the type having a substrate, a conductive pattern on the upper surface of said substrate and a conductive enclosure containing said substrate, the interior of said conductive enclosure having a width a and a height b the improvement comprising a plurality of regularly spaced conductive members extending from the upper surface of said enclosure toward the substrate for converting said enclosure into a periodic structure and thereby suppressing a band of resonant frequencies within said enclosure.
Claim 2
Dependent Claim
84 words
In a microwave integrated circuit (MIC) package of the type having a substrate, a conductive pattern on the upper surface of said substrate and a conductive enclosure containing said substrate, the interior of said conductive enclosure having a width a and a height b the improvement comprising a plurality of regularly spaced conductive members extending from the upper surface of said enclosure toward the substrate for converting said enclosure into a periodic structure and thereby suppressing a band of resonant frequencies within said enclosure.
Claim 3
Dependent Claim
19 words
A MIC package as defined in claim 1, wherein said conductive members are fins disposed transversely in said enclosure.
Claim 4
Dependent Claim
48 words
A MIC package as defined claims 1 or 2, wherein the distance between said conductive members is L and the distance between the lower end of each conductive member and the substrate is d and L, and the ratio (d/b) are chosen to suppress a desired frequency band.
Claim 5
Dependent Claim
45 words
A MIC package as defined in claim 3, wherein the distance L is given by ##EQU12## where F U is the upper edge of said suppressed frequency band and F 10 is the frequency at which the TE 10 mode will resonate within said enclosure.
Claim 6
Dependent Claim
53 words
A MIC package according to claim 3 wherein the ratio (d/b) is given by: d/b=2x/π where x is determined by iteratively solving the equation ##EQU13## in which F=C.sub.1 ln cscx+C.sub.2 cos.sup.4 x-B ##EQU14## C.sub.1 =4βb/π ##EQU15## B=the required susceptance at lower edge of the suppressed frequency band β=the wavenumber of the periodic structure.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-05-18 | 1984-11-17 | 1985-05-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-05-18 | 1988-11-17 | 1989-05-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-05-18 | 1992-11-17 | 1993-05-19 | $7700.00 | Window Closed / Lapsed |