Abstract A monolithic flip chip microwave integrated circuit module formed using titanium coated copper circuitry and a processing method. A dam is formed on a substrate by forming a thin protective layer such as titanium or other metal on a copper layer formed on a surface of the substrate to which a monolithic microwave integrated circuit is to be attached. The protective layer is oxidized upon exposure to air. Vias or openings are then formed in the oxidized protective layer. Solder is disposed in the openings in the oxidized protective layer, and is confined to the openings while solder is reflowed to attach the integrated circuit to the substrate. The oxidized protective layer serves a dual function that provides both a solder dam and a protective coating for the underlying copper circuitry. Copper surfaces not covered by the oxidized protective layer may be environmentally protected by depositing a thin layer containing electroless plated nickel and electroless plated gold.
Flip chip monolithic microwave integrated circuit apparatus comprising: a microwave assembly substrate onto which an integrated circuit is connected comprising a layer of copper disposed on a surface that has a metallization pattern that forms a circuit that is to be connected to the integrated circuit, an oxidized protective layer disposed on the layer of copper, the protective layer selected from a group of metals consisting of titanium, titanium/tungsten, chromium and aluminum, and openings disposed in the oxidized protective layer in predefined areas designated for solder patterns; and an integrated circuit having a plurality of plated solder caps disposed on thermal bumps that are soldered to the substrate at the predefined areas designated for solder patterns.
Claim 2
Dependent Claim
116 words
Flip chip monolithic microwave integrated circuit apparatus comprising: a microwave assembly substrate onto which an integrated circuit is connected comprising a layer of copper disposed on a surface that has a metallization pattern that forms a circuit that is to be connected to the integrated circuit, an oxidized protective layer disposed on the layer of copper, the protective layer selected from a group of metals consisting of titanium, titanium/tungsten, chromium and aluminum, and openings disposed in the oxidized protective layer in predefined areas designated for solder patterns; and an integrated circuit having a plurality of plated solder caps disposed on thermal bumps that are soldered to the substrate at the predefined areas designated for solder patterns.
Claim 3
Dependent Claim
30 words
The apparatus of claim 1 further comprising a thin layer of nickel and a thin layer of gold deposited on the predefined areas not covered by the oxidized protective layer.
Claim 4
Dependent Claim
18 words
The apparatus of claim 2 wherein the layer of titanium has a thickness between 200 to 1000 Angstroms.