Anodic passivating processes for integrated circuits
Abstract
Abstract ANODIC OXIDATION IS EMPLOYED IN THE FABRICATION OF INTEGRATED CIRCUITS TO PROVIDE PASSIVATION AND PROTECTION FROM ABRASION. IN ONE RESPECT OF THE INVENTION THE ANODIZED PASSIVATING LAYER IS SELECTIVELY ETCHED TO EXPOSE BONDNG PADS AND SCRIBE LINE AREAS. IN A DIFFERENT ASPECT OF THE INVENTION A METHOD FOR FABRICATING A MULTILEVEL INTERCONNECTED INTEGRATED CIRCUIT IS PROVIDED WHEREIN A LAYER OF ANOIDIC OXIDE IS FORMED TO COVER THE FIRST LEVEL OF INTERCONNECTS. A LAYER OF INSULATINNG MATERIAL IS THEN DEPOSTED OVER THE ANODIC OXIDE LAYER TO ADVANTAGEOUSLY REDUCE INTERLEVEL CAPACITANCE. FIRST LEVEL BONDING PADS AND SCRIBE LINE AREAS ARE EXPOSED. A CONDUCTIVE LAYER IS THEN DEPOSITED AND PATTERNED TO FORM THE SECOND LEVEL INTERCONNECTED PATTERN. THIS SECOND LEVEL INTERCONNECT MAY ALSO BE PROTECTED BY AN ANODIC OXIDATION OVERLAYER, IF DESIRED.
Inventors
- 👤 A Paddock
- 👤 W Morrison
- 👤 R Bracken
- 👤 J Harper
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-03-18 | 1977-09-17 | 1978-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-03-18 | 1981-09-17 | 1982-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-03-18 | 1985-09-17 | 1986-03-19 | $7700.00 | Window Closed / Lapsed |