US5130779A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder mass having conductive encapsulating arrangement
Assignee: International Business Machines Corp
•
Filing: 1990-06-19
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Granted: 1992-07-14
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Expires: 2010-06-19
Abstract
Abstract The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.
Inventors
- 👤 Birendra N. Agarwala
- 👤 Aziz M. Ahsan
- 👤 Arthur Bross
- 👤 Mark F. Chadurjian
- 👤 Nicholas G. Koopman
- 👤 Li-Chung Lee
- 👤 Karl J. Puttlitz
- 👤 Sudipta K. Ray
- 👤 James G. Ryan
- 👤 Joseph G. Schaefer
- 👤 Kamalesh K. Srivastava
- 👤 Paul A. Totta
- 👤 Erick G. Walton
- 👤 Adolf E. Wirsing
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 00:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/20; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3465; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/221; H10W72/222; H10W72/223; H10W72/224; H10W72/231; H10W72/234; H10W72/251; H10W72/252; H10W72/255; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 53
Claim 1
Independent Claim
82 words
A solder interconnection comprising: a) a site for a solder mass, b) a first solder mass on said site, c) a material substantially encapsulating said solder mass, wherein said encapsulating material is an electrical conductor, said electrical conductor is either a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru, or alloys thereof, or a non-solder wettable material selected from a group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 2
Dependent Claim
82 words
A solder interconnection comprising: a) a site for a solder mass, b) a first solder mass on said site, c) a material substantially encapsulating said solder mass, wherein said encapsulating material is an electrical conductor, said electrical conductor is either a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru, or alloys thereof, or a non-solder wettable material selected from a group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 3
Dependent Claim
17 words
The solder interconnection of claim 1, wherein said electronic component is either a chip or a substrate.
Claim 4
Dependent Claim
61 words
The solder interconnection of claim 1, wherein said encapsulating material is an electrical conductor, said electrical conductor is either a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru or alloys thereof, or a non-solder wettable material selected from a group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 5
Dependent Claim
117 words
A solder interconnection comprising: a) a site for a solder mass, b) a solder mass on said site, and c) a material substantially encapsulating said solder mass, wherein said encapsulating material is an electrical conductor comprising of a multi-layer stack X/Y/X, X/Y/Z, X/Y or X/Z, wherein said layer X or Z is a material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, and wherein said layer Y is either a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, or a non-solder wettable material selected from the group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 6
Dependent Claim
117 words
A solder interconnection comprising: a) a site for a solder mass, b) a solder mass on said site, and c) a material substantially encapsulating said solder mass, wherein said encapsulating material is an electrical conductor comprising of a multi-layer stack X/Y/X, X/Y/Z, X/Y or X/Z, wherein said layer X or Z is a material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, and wherein said layer Y is either a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, or a non-solder wettable material selected from the group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 7
Dependent Claim
17 words
The solder interconnection of claim 1, wherein said site for said solder mass comprises a barrier material.
Claim 8
Dependent Claim
18 words
The solder interconnection of claim 1, wherein said solder interconnection has an aspect ratio of greater than 0.50.
Claim 9
Dependent Claim
46 words
A solder interconnection comprising: a) a site for a first solder mass, b) a first solder mass on said site, c) a first electrically conductive material substantially encapsulating said first solder mass, and d) at least a second solder mass on said first electrically conductive material.
Claim 10
Dependent Claim
46 words
A solder interconnection comprising: a) a site for a first solder mass, b) a first solder mass on said site, c) a first electrically conductive material substantially encapsulating said first solder mass, and d) at least a second solder mass on said first electrically conductive material.
Claim 11
Dependent Claim
26 words
The solder interconnection of claim 7, wherein the melting point of said first solder mass is different than the melting point of said second solder mass.
Claim 12
Dependent Claim
27 words
The solder interconnection of claim 7, wherein the melting point of said first solder mass is the same as the melting point of said second solder mass.
Claim 13
Dependent Claim
22 words
The solder interconnection of claim 7, wherein said site for said solder mass is on an active or a passive electronic component.
Claim 14
Dependent Claim
17 words
The solder interconnection of claim 10, wherein said electronic component is either a chip or a substrate.
Claim 15
Dependent Claim
94 words
A solder interconnection comprising: a) a site for a first solder mass, b) a first solder mass on said site, c) a first electrically conductive material substantially encapsulating said first solder mass, and d) at least a second solder mass on said first electrically conductive material; wherein said electrically conductive material is a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru or alloys thereof, or a non-solder wettable material selected from a group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 16
Dependent Claim
94 words
A solder interconnection comprising: a) a site for a first solder mass, b) a first solder mass on said site, c) a first electrically conductive material substantially encapsulating said first solder mass, and d) at least a second solder mass on said first electrically conductive material; wherein said electrically conductive material is a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru or alloys thereof, or a non-solder wettable material selected from a group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 17
Dependent Claim
132 words
A solder interconnection comprising: a) a site for a first solder mass, b) a first solder mass on said site, c) a first electrically conductive material substantially encapsulating said first solder mass, and d) at least a second solder mass on said first electrically conductive material; wherein said electrically conductive material comprises a multilayer stack X/Y/X, X/Y/Z, X/Y or X/Z, wherein said layer X or Z is a material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, and wherein said layer Y is either a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, or a non-solder wettable material selected from the group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 18
Dependent Claim
132 words
A solder interconnection comprising: a) a site for a first solder mass, b) a first solder mass on said site, c) a first electrically conductive material substantially encapsulating said first solder mass, and d) at least a second solder mass on said first electrically conductive material; wherein said electrically conductive material comprises a multilayer stack X/Y/X, X/Y/Z, X/Y or X/Z, wherein said layer X or Z is a material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, and wherein said layer Y is either a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, or a non-solder wettable material selected from the group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 19
Dependent Claim
18 words
The solder interconnection of claim 7, wherein said site for said first solder mass comprises a barrier material.
Claim 20
Dependent Claim
18 words
The solder interconnection of claim 7, wherein the site for said second solder mass comprises a barrier material.
Claim 21
Dependent Claim
29 words
The solder interconnection of claim 7, wherein the base cross-sectional area for said first solder mass is the same as the base cross-sectional area for said second solder mass.
Claim 22
Dependent Claim
28 words
The solder interconnection of claim 7, wherein the base cross-sectional area for said first solder mass is different than the base cross-sectional area for said second solder mass.
Claim 23
Dependent Claim
18 words
The solder interconnection of claim 7, wherein said solder interconnection has an aspect ratio of greater than 0.50.
Claim 24
Dependent Claim
73 words
A solder interconnection comprising: a) a site for a first solder mass, b) a first solder mass on said site, c) a first electrically conductive material substantially encapsulating said first solder mass, and d) at least a second solder mass on said first electrically conductive material; wherein a second electrically conductive material substantially encapsulates said second solder mass, and at least a third solder mass is formed on said second electrically conductive material.
Claim 25
Dependent Claim
73 words
A solder interconnection comprising: a) a site for a first solder mass, b) a first solder mass on said site, c) a first electrically conductive material substantially encapsulating said first solder mass, and d) at least a second solder mass on said first electrically conductive material; wherein a second electrically conductive material substantially encapsulates said second solder mass, and at least a third solder mass is formed on said second electrically conductive material.
Claim 26
Dependent Claim
26 words
The solder interconnection of claim 19 wherein the melting point of said third solder mass is different than the melting point of said second solder mass.
Claim 27
Dependent Claim
27 words
The solder interconnection of claim 19, wherein the melting point of said second solder mass is the same as the melting point of said third solder mass.
Claim 28
Dependent Claim
54 words
The solder interconnection of claim 19, wherein said electrically conductive material is a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru or alloys thereof, or a non-solder wettable material selected from a group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 29
Dependent Claim
93 words
The solder interconnection of claim 19, wherein said electrically conductive material comprises of a multi-layer stack X/Y/X, X/Y/Z, X/Y or X/Z, wherein said layer X or Z is a material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, and wherein said layer Y is either a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, or a non-solder wettable material selected from the group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
Claim 30
Dependent Claim
14 words
The solder interconnection of claim 1, wherein said solder interconnection is on a decal.
Claim 31
Dependent Claim
23 words
The solder interconnection of claim 24, wherein said solder interconnection is transfered from said decal onto an active or a passive electronic component.
Claim 32
Dependent Claim
17 words
The solder interconnection of claim 25, wherein said electronic component is either a chip or a substrate.
Claim 33
Dependent Claim
14 words
The solder interconnection of claim 7, wherein said solder interconnection is on a decal.
Claim 34
Dependent Claim
23 words
The solder interconnection of claim 27, wherein said solder interconnection is transfered from said decal onto an active or a passive electronic component.
Claim 35
Dependent Claim
17 words
The solder interconnection of claim 2, wherein said electronic component is either a chip or a substrate.
Claim 36
Dependent Claim
26 words
The solder interconnection of claim 27, wherein the melting point of said first solder mass is different than the melting point of said second solder mass.
Claim 37
Dependent Claim
27 words
The solder interconnection of claim 27, wherein the melting point of said first solder mass is the same as the melting point of said second solder mass.
Claim 38
Dependent Claim
14 words
The solder interconnection of claim 19, wherein said solder interconnection is on a decal.
Claim 39
Dependent Claim
23 words
The solder interconnection of claim 32, wherein said solder interconnection is transfered from said decal onto an active or a passive electronic component.
Claim 40
Dependent Claim
17 words
The solder interconnection of claim 33, wherein said electronic component is either a chip or a substrate.
Claim 41
Dependent Claim
26 words
The solder interconnection of claim 32, wherein the melting point of said third solder mass is different than the melting point of said second solder mass.
Claim 42
Dependent Claim
27 words
The solder interconnection of claim 32, wherein the melting point of said second solder mass is the same as the melting point of said third solder mass.
Claim 43
Dependent Claim
22 words
The solder interconnection of claim 1, wherein a portion of said encapsulating material is a sidewall spacer comprising of an insulative material.
Claim 44
Dependent Claim
30 words
The solder interconnection of claim 37, wherein said sidewall spacer is comprised of a material selected from the group comprising silicon oxide, silicon nitride, silicon oxy-nitride or a polymeric material.
Claim 45
Dependent Claim
26 words
The solder interconnection of claim 37, wherein said sidewall spacer is made of a material that does not deform during subsequent heating of said solder mass.
Claim 46
Dependent Claim
20 words
The solder interconnection of claim 37, wherein the upper surface of said first solder mass has a second solder mass.
Claim 47
Dependent Claim
22 words
The solder interconnection of claim 40, wherein at least a portion of said second solder mass is surrounded by a sidewall spacer.
Claim 48
Dependent Claim
31 words
The solder interconnection of claim 41, wherein at least one of said sidewall spacer is formed of at least layer of conductive material and at least one layer of insulative material.
Claim 49
Dependent Claim
25 words
The solder interconnection of claim 40, wherein between said first solder mass and said second solder mass there is at least one electrically conductive layer.
Claim 50
Dependent Claim
20 words
The solder interconnection of claim 40, wherein the upper surface of said second solder mass has a third solder mass.
Claim 51
Dependent Claim
29 words
The solder interconnection of claim 7, having a peripheral ring over the upper surface of said electrically conductive material to prevent the running down of said second solder mass.
Claim 52
Dependent Claim
20 words
The solder interconnection of claim 1, wherein a signal carrier is located between at least two of said solder interconnections.
Claim 53
Dependent Claim
26 words
The solder interconnection of claim 46, wherein said signal carrier is an electrical wire or an optical fiber or a solder link or a conductive paste.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-07-14 | 1996-01-13 | 1996-07-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-07-14 | 2000-01-13 | 2000-07-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-07-14 | 2004-01-13 | 2004-07-14 | $7700.00 | Window Closed / Lapsed |