EP0248314A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Soldering of electronic components
Assignee: AT&T Inc
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Filing: 1987-05-25
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Granted: —
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Expires: 2007-05-25
Abstract
Abstract Disclosed is a technique for providing solder bumps (15, 16, 17) to electronic components (10), such as silicon chips, chip carriers, and circuit boards, so as to achieve large stand-off heights. The component is covered with a mask (14), such as a photoresist, leaving exposed the solder pads (11,12,13) on the component. Solder is applied to the surface along with ultrasonic energy so that the solder wets the exposed pads. The mask acts as a mold for the solder, thereby producing. large solder bump heights.
Inventors
- 👤 William Michael Sherry
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 12:10
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K2203/00; H05K2203/02; H05K2203/0285; H05K2203/04; H05K2203/044; H05K3/3452; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/01251; H10W72/01255; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49204; Y10T29/49224
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
101 words
A method of soldering together electronic components having bonding pads formed on a major surface including depositing solder mounds on at least one of said components comprising the steps of: covering at least one of said components with a mask so as to expose the bonding pads; applying solder to the component; and removing the mask while leaving the solder in the forms of mounds on the pad; characterized in that the solder (15, 16, 17) is applied to the component (10) while also applying ultrasonic energy to the solder so that the solder wets the surface of the exposed pads.
Claim 2
Independent Claim
101 words
A method of soldering together electronic components having bonding pads formed on a major surface including depositing solder mounds on at least one of said components comprising the steps of: covering at least one of said components with a mask so as to expose the bonding pads; applying solder to the component; and removing the mask while leaving the solder in the forms of mounds on the pad; characterized in that the solder (15, 16, 17) is applied to the component (10) while also applying ultrasonic energy to the solder so that the solder wets the surface of the exposed pads.
Claim 3
Dependent Claim
17 words
The method according to claim 1 wherein the pads are less than 250,000 pm 2 in area.
Claim 4
Dependent Claim
13 words
The method according to claim 1 wherein the mask comprises a photoresist material.
Claim 5
Dependent Claim
17 words
The method according to claim 1 wherein the said one of the components is a semiconductor chip.
Claim 6
Dependent Claim
18 words
The method according to claim 1 wherein the solder is applied by immersing the component in molten solder.
Claim 7
Dependent Claim
15 words
The method according to claim 5 wherein the solder is propelled toward the immersed component.
Claim 8
Dependent Claim
16 words
The method according to claim 5 wherein the component is immersed for less than 5 sec.
Claim 9
Dependent Claim
16 words
The method according to claim 1 wherein the solder mounds are at least 25 µm high.
Claim 10
Dependent Claim
18 words
The method according to claim 1 wherein the ultrasonic energy lies within the range 50 - 300 watts.
Claim 11
Dependent Claim
33 words
The method according to claim 1 further comprising the step of bonding the one of said components to the other component so as to produce a stand-off height of at least 25 pm.
References Cited (Backward Citations)
No citation records indexed.
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