Micro-patch antenna connected to circuits chips

Claim 2

An antenna apparatus comprising: a first chip having: a substrate; a ground film on said substrate; a dielectric film on said ground film; a micro-patch antenna on said dielectric film; an interconnection microstrip line, on said dielectric film, coupled to and extending from said micro-patch antenna; and an input/output microstrip line on said dielectric film at a predetermined position; a second chip having a circuit portion therein, including input and output terminals on a surface of the second chip, for effecting a predetermined operation with said micro-patch antenna; and connecting means, including bumps, for fixing said second chip to said first chip by providing mechanical and electrical connection between said circuit portion and said interconnection microstrip line and between said circuit portion and said input/output microstrip line through said input and output terminals and said bumps.

Claim 3

An antenna apparatus as claimed in claim 1, wherein said substrate comprises a silicon substrate.

Claim 4

An antenna apparatus as claimed in claim 1, wherein said substrate comprises a GaAs substrate.

Claim 5

An antenna apparatus as claimed in claim 1, wherein said substrate comprises a dielectric substrate.

Claim 6

An antenna apparatus as claimed in claim 1, wherein said second chip further comprises a GaAs substrate.

Claim 7

An antenna apparatus as claimed in claim 1, wherein said circuit portion comprises a detection circuit for detecting, a radio signal from radiowaves received by said microstrip patch antenna.

Claim 8

An antenna apparatus as claimed in claim 1, wherein said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

Claim 9

An antenna apparatus comprising: a first chip having: a substrate; a ground film on said substrate; a dielectric film on said ground film; an interconnection microstrip line on said dielectric film at a first predetermined position; and an input/output microstrip line on said dielectric film at a second predetermined position; a second chip having: a dielectric substrate having a through. hole; a micro-patch antenna on a first surface of said dielectric substrate; and a feeding terminal on a second surface of said. dielectric substrate, said first surface being opposite to said. second surface, said through hole electrically connecting said. micro-patch antenna to said feeding terminal; first connecting means, having a first bump, for fixing said second chip to said first chip by providing a first mechanical and electrical connection between said feeding terminal and said interconnection microstrip line through said first bump; and a third chip having a circuit portion therein, including input. and output terminals on a surface of the second chip, for effecting a predetermined operation with said micro-patch antenna; and second connecting means, having second bumps, for fixing said third chip to said first chip by providing second mechanical and electrical connections between said circuit portion and said interconnection microstrip line and between said circuit portion and said input/output microstrip line through said input and output: terminals and said second bumps.

Claim 10

An antenna apparatus comprising: a first chip having: a substrate; a ground film on said substrate; a dielectric film on said ground film; an interconnection microstrip line on said dielectric film at a first predetermined position; and an input/output microstrip line on said dielectric film at a second predetermined position; a second chip having: a dielectric substrate having a through. hole; a micro-patch antenna on a first surface of said dielectric substrate; and a feeding terminal on a second surface of said. dielectric substrate, said first surface being opposite to said. second surface, said through hole electrically connecting said. micro-patch antenna to said feeding terminal; first connecting means, having a first bump, for fixing said second chip to said first chip by providing a first mechanical and electrical connection between said feeding terminal and said interconnection microstrip line through said first bump; and a third chip having a circuit portion therein, including input. and output terminals on a surface of the second chip, for effecting a predetermined operation with said micro-patch antenna; and second connecting means, having second bumps, for fixing said third chip to said first chip by providing second mechanical and electrical connections between said circuit portion and said interconnection microstrip line and between said circuit portion and said input/output microstrip line through said input and output: terminals and said second bumps.

Claim 11

An antenna apparatus as claimed in claim 8, wherein said. substrate comprises a silicon substrate.

Claim 12

An antenna apparatus as claimed in claim 8, wherein said substrate comprises a GaAs substrate.

Claim 13

An antenna apparatus as claimed in claim 8, wherein said substrate comprises a dielectric substrate.

Claim 14

An antenna apparatus as claimed in claim 8, wherein said second chip further comprises a GaAs substrate.

Claim 15

An antenna apparatus as claimed in claim 8, wherein said circuit portion comprises a detection circuit for detecting a radio signal from radiowaves received by said microstrip patch antenna.

Claim 16

An antenna apparatus as claimed in claim 8, wherein said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

Claim 17

An antenna apparatus comprising: a first chip having: a dielectric substrate having a salient portion and a hollow portion having a flat area and a slope portion connecting said salient portion to said flat area on a first surface of said dielectric substrate; a ground conductor film on a second surface of said dielectric substrate which is opposite to said first surface; a microstrip line, on said first surface, extending from said salient portion to said flat area via said slope portion; and an input/output strip line, on said first surface, extending from said salient portion to said flat area via said slope portion and electrically insulated from said microstrip line; a second chip having: a second dielectric substrate having a through hole; a micro-patch antenna on a first surface of said second dielectric substrate; and a feeding terminal on a second surface of said second dielectric substrate which is opposite to said first surface of said second dielectric substrate, said through hole electrically connecting said micro-patch antenna to said feeding terminal; first connecting means, having a first bump for fixing said second chip to said first chip by providing first mechanical and electrical connection between said feeding terminal and said microstrip line on said salient portion through said first bump; a third chip, arranged in said hollow portion, having: a circuit portion therein for effecting a predetermined operation with said micro-patch antenna; and first and second terminals on a surface of said third chip; and second connecting means, having second bumps, for fixing said third chip to said first chip by providing second mechanical and electrical connections between said circuit portion and said microstrip line and between said circuit portion and said input/output microstrip line through said second bumps.

Claim 18

An antenna apparatus comprising: a first chip having: a dielectric substrate having a salient portion and a hollow portion having a flat area and a slope portion connecting said salient portion to said flat area on a first surface of said dielectric substrate; a ground conductor film on a second surface of said dielectric substrate which is opposite to said first surface; a microstrip line, on said first surface, extending from said salient portion to said flat area via said slope portion; and an input/output strip line, on said first surface, extending from said salient portion to said flat area via said slope portion and electrically insulated from said microstrip line; a second chip having: a second dielectric substrate having a through hole; a micro-patch antenna on a first surface of said second dielectric substrate; and a feeding terminal on a second surface of said second dielectric substrate which is opposite to said first surface of said second dielectric substrate, said through hole electrically connecting said micro-patch antenna to said feeding terminal; first connecting means, having a first bump for fixing said second chip to said first chip by providing first mechanical and electrical connection between said feeding terminal and said microstrip line on said salient portion through said first bump; a third chip, arranged in said hollow portion, having: a circuit portion therein for effecting a predetermined operation with said micro-patch antenna; and first and second terminals on a surface of said third chip; and second connecting means, having second bumps, for fixing said third chip to said first chip by providing second mechanical and electrical connections between said circuit portion and said microstrip line and between said circuit portion and said input/output microstrip line through said second bumps.

Claim 19

An antenna apparatus as claimed in claim 15, wherein. said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

Claim 20

An antenna apparatus as claimed in claim 15, wherein said circuit portion comprises a detection circuit for detecting a radio signal from radiowaves received by said microstrip patch antenna.

Claim 21

An antenna apparatus as claimed in claim 15, wherein said second chip further comprises a GaAs substrate.

Claim 22

An antenna apparatus comprising: a first chip having: a dielectric substrate; a ground conductor film on a first surface of said substrate having a slot; a dielectric film on said ground conductor film, said dielectric film being connected to said dielectric substrate through said slot; a microstrip line on said dielectric film at a first predetermined position; an input/output microstrip line on said dielectric film at a second predetermined position; and a micro-patch antenna on a second surface of said dielectric substrate which is opposite to said first surface; a second chip having a circuit portion therein, including input and output terminals on a surface of the second chip, for effecting a predetermined operation with said micro-patch antenna; and connecting means, having bumps, for fixing said second chip to said first chip by providing mechanical and electrical connections between said circuit portion and said interconnection microstrip line and between said circuit portion and said input/output microstrip line through said input and output terminals and said bumps, wherein said micro-patch antenna, said slot, and said microstrip line are arranged such that said micro-patch antenna and said microstrip line are electromagnetically coupled through said slot; wherein radiowaves received by said micro-patch antenna are directly coupled to said microstrip line through said slot.

Claim 23

An antenna apparatus comprising: a first chip having: a dielectric substrate; a ground conductor film on a first surface of said substrate having a slot; a dielectric film on said ground conductor film, said dielectric film being connected to said dielectric substrate through said slot; a microstrip line on said dielectric film at a first predetermined position; an input/output microstrip line on said dielectric film at a second predetermined position; and a micro-patch antenna on a second surface of said dielectric substrate which is opposite to said first surface; a second chip having a circuit portion therein, including input and output terminals on a surface of the second chip, for effecting a predetermined operation with said micro-patch antenna; and connecting means, having bumps, for fixing said second chip to said first chip by providing mechanical and electrical connections between said circuit portion and said interconnection microstrip line and between said circuit portion and said input/output microstrip line through said input and output terminals and said bumps, wherein said micro-patch antenna, said slot, and said microstrip line are arranged such that said micro-patch antenna and said microstrip line are electromagnetically coupled through said slot; wherein radiowaves received by said micro-patch antenna are directly coupled to said microstrip line through said slot.

Claim 24

An antenna apparatus as claimed in claim 19, wherein said second chip further comprises a GaAs substrate.

Claim 25

An antenna apparatus as claimed in claim 19, wherein said circuit portion comprises a detection circuit for detecting a radio signal from radiowaves received by said microstrip patch antenna.

Claim 26

An antenna apparatus as claimed in claim 19, wherein said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

Claim 27

An antenna apparatus comprising: a first chip having: a dielectric substrate; a ground conductor film on a first surface of said substrate having a slot; a dielectric film on said ground conductor film, said dielectric film being connected to said dielectric substrate through said slot; an input/output microstrip line on said dielectric film at a predetermined position; and a micro-patch antenna on a second surface of said dielectric substrate which is opposite to said first surface; a second chip having a circuit portion therein, including a terminal and a microstrip line on a surface of said second chip connected to said circuit, for effecting a predetermined operation with said micro-patch antenna; and connecting means, having bumps, for fixing said second chip to said first chip by providing a connection between said circuit portion and said input/output microstrip line through said terminal and said bumps, wherein said micro-patch antenna, said slot, and said microstrip line are arranged such that said micro-patch antenna and said microstrip line are electromagnetically coupled through said slot; wherein radiowaves received by said micro-patch antenna are directly coupled to said microstrip line through said slot.

Claim 28

An antenna apparatus comprising: a first chip having: a dielectric substrate; a ground conductor film on a first surface of said substrate having a slot; a dielectric film on said ground conductor film, said dielectric film being connected to said dielectric substrate through said slot; an input/output microstrip line on said dielectric film at a predetermined position; and a micro-patch antenna on a second surface of said dielectric substrate which is opposite to said first surface; a second chip having a circuit portion therein, including a terminal and a microstrip line on a surface of said second chip connected to said circuit, for effecting a predetermined operation with said micro-patch antenna; and connecting means, having bumps, for fixing said second chip to said first chip by providing a connection between said circuit portion and said input/output microstrip line through said terminal and said bumps, wherein said micro-patch antenna, said slot, and said microstrip line are arranged such that said micro-patch antenna and said microstrip line are electromagnetically coupled through said slot; wherein radiowaves received by said micro-patch antenna are directly coupled to said microstrip line through said slot.

Claim 29

An antenna apparatus as claimed in claim 23, wherein said second chip further comprises a GaAs substrate.

Claim 30

An antenna apparatus as claimed in claim 23, wherein said circuit portion comprises a detection circuit for detecting a radio signal from radiowaves received by said microstrip patch antenna.

Claim 31

An antenna apparatus as claimed in claim 23, wherein said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

Claim 32

An antenna apparatus comprising: a first chip having: a substrate; a ground film on said substrate; a dielectric film on said ground film; a microstrip patch antenna on a first surface of said dielectric film; an input/output microstrip line on said first surface of said dielectric film at a predetermined position; a plurality of second chips, each having: a respective dielectric substrate; and a respective active circuit for effecting a predetermined operation; and respective connecting means, having corresponding bumps, for fixing said plurality of second chips to said first chip by providing mechanical and electrical connections between said microstrip patch antenna and said active circuit of at least one of said plurality of second chips, mechanical and electrical connections between said active circuits of said plurality of second chips, and a mechanical and electrical connection between at least one of said plurality of second chips and said input/output microstrip line through said bumps, wherein said active circuits of said plurality of second chips comprise at least two different kinds of semiconductor structures.

Claim 33

An antenna apparatus comprising: a first chip having: a substrate; a ground film on said substrate; a dielectric film on said ground film; a microstrip patch antenna on a first surface of said dielectric film; an input/output microstrip line on said first surface of said dielectric film at a predetermined position; a plurality of second chips, each having: a respective dielectric substrate; and a respective active circuit for effecting a predetermined operation; and respective connecting means, having corresponding bumps, for fixing said plurality of second chips to said first chip by providing mechanical and electrical connections between said microstrip patch antenna and said active circuit of at least one of said plurality of second chips, mechanical and electrical connections between said active circuits of said plurality of second chips, and a mechanical and electrical connection between at least one of said plurality of second chips and said input/output microstrip line through said bumps, wherein said active circuits of said plurality of second chips comprise at least two different kinds of semiconductor structures.