US5612257A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making flip-chip microwave integrated circuit
Assignee: Texas Instruments Inc
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Filing: 1995-06-07
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Granted: 1997-03-18
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Expires: 2015-06-07
Abstract
Abstract A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active devices have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.
Inventors
- 👤 Hua Q. Tserng
- 👤 Paul Saunier
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:17
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/482; H10W20/483; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W44/00; H10W44/20; H10W44/226; H10W44/234; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W90/00; H10W44/203; H10W44/216; H10W44/251; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/531; H10W72/536; H10W72/851; H10W72/874; H10W72/879; H10W72/884; H10W90/20; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
71 words
A method of fabricating an integrated circuit, comprising the steps of: (a) forming at least one transistor at a frontside surface of a substrate, said transistor comprising an airbridge over said frontside transistor; (b) forming at least one passive component at said frontside surface; (c) forming dielectric over said passive component such that a surface of said dielectric is substantially planar with said airbridge; (d) contacting a heatsink with said airbridge.
Claim 2
Independent Claim
71 words
A method of fabricating an integrated circuit, comprising the steps of: (a) forming at least one transistor at a frontside surface of a substrate, said transistor comprising an airbridge over said frontside transistor; (b) forming at least one passive component at said frontside surface; (c) forming dielectric over said passive component such that a surface of said dielectric is substantially planar with said airbridge; (d) contacting a heatsink with said airbridge.
Claim 3
Dependent Claim
32 words
The method of claim 1 further comprising the step of bonding a backside of a second integrated circuit to a backside of said substrate, said backside of said substrate opposite said frontside.
Claim 4
Dependent Claim
25 words
The method of claim 2 wherein said step of bonding includes applying a thermoplastic between said backside of said substrate and said second integrated circuit.
Claim 5
Dependent Claim
21 words
The method of claim 2 further comprising the step of forming a transistor on a frontside of said second integrated circuit.
Claim 6
Dependent Claim
31 words
The method of claim 2 further comprising the step of forming a passive component covered with polyimide between said backside of said substrate and said backside of said second integrated circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-17 | 2000-09-16 | 2001-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-17 | 2004-09-16 | 2005-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-17 | 2008-09-16 | 2009-03-18 | $7700.00 | Window Closed / Lapsed |