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Patent US5612257A successfully refreshed from Google Patents.
US5612257A
Expired / Lapsed
US
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Method of making flip-chip microwave integrated circuit
Assignee: Texas Instruments Inc
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Filing: 1995-06-07
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Granted: 1997-03-18
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Expires: 2015-06-07
Abstract
Abstract A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active devices have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.
Inventors
- 👤 Hua Q. Tserng
- 👤 Paul Saunier
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:34
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/482; H10W20/483; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W44/00; H10W44/20; H10W44/226; H10W44/234; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W90/00; H10W44/203; H10W44/216; H10W44/251; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/531; H10W72/536; H10W72/851; H10W72/874; H10W72/879; H10W72/884; H10W90/20; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
71 words
A method of fabricating an integrated circuit, comprising the steps of: (a) forming at least one transistor at a frontside surface of a substrate, said transistor comprising an airbridge over said frontside transistor; (b) forming at least one passive component at said frontside surface; (c) forming dielectric over said passive component such that a surface of said dielectric is substantially planar with said airbridge; (d) contacting a heatsink with said airbridge.
Claim 2
Independent Claim
71 words
A method of fabricating an integrated circuit, comprising the steps of: (a) forming at least one transistor at a frontside surface of a substrate, said transistor comprising an airbridge over said frontside transistor; (b) forming at least one passive component at said frontside surface; (c) forming dielectric over said passive component such that a surface of said dielectric is substantially planar with said airbridge; (d) contacting a heatsink with said airbridge.
Claim 3
Dependent Claim
32 words
The method of claim 1 further comprising the step of bonding a backside of a second integrated circuit to a backside of said substrate, said backside of said substrate opposite said frontside.
Claim 4
Dependent Claim
25 words
The method of claim 2 wherein said step of bonding includes applying a thermoplastic between said backside of said substrate and said second integrated circuit.
Claim 5
Dependent Claim
21 words
The method of claim 2 further comprising the step of forming a transistor on a frontside of said second integrated circuit.
Claim 6
Dependent Claim
31 words
The method of claim 2 further comprising the step of forming a passive component covered with polyimide between said backside of said substrate and said backside of said second integrated circuit.
References Cited (Backward Citations)
US4959705A
Cited
US5319237A
Cited
US5202752A
Cited
US5268315A
Cited
US5373185A
Cited
US5352998A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-17 | 2000-09-16 | 2001-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-17 | 2004-09-16 | 2005-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-17 | 2008-09-16 | 2009-03-18 | $7700.00 | Window Closed / Lapsed |