US5847453A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microwave circuit package
Assignee: Honda Motor Co Ltd
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Filing: 1997-03-19
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Granted: 1998-12-08
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Expires: 2017-03-19
Abstract
Abstract A microwave circuit package includes a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits (MMICs) and a spacer, made of a dielectric material, separating the MMICs from each other, and the MMICs and spacer are sealed in the package. The provision of the spacer substantially reduces the volume of the interior space of the package. A dielectric substrate having generally the same height as substrates of the MMICs may also be mounted on the metallic base plate, and a strip conductor may be provided on the dielectric substrate so as to form a microstrip line thereon.
Inventors
- 👤 Hiroshi Uematsu
- 👤 Hiroshi Kudoh
- 👤 Masanobu Urabe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:44
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W42/00; H10W42/20; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/132; H10W72/00; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/751; H10W90/753; H10W90/754
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
65 words
A microwave circuit package comprising: a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; and at least one spacer mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said spacer being made of a dielectric material, wherein said monolithic microwave integrated circuits and spacer are sealed in said package.
Claim 2
Dependent Claim
65 words
A microwave circuit package comprising: a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; and at least one spacer mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said spacer being made of a dielectric material, wherein said monolithic microwave integrated circuits and spacer are sealed in said package.
Claim 3
Dependent Claim
75 words
A microwave circuit package comprising: a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; a dielectric substrate mounted on said metallic base plate and having substantially the same height as substrates of said monolithic microwave integrated circuits; and a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon, wherein said monolithic microwave integrated circuits and dielectric substrate are sealed in said package.
Claim 4
Dependent Claim
75 words
A microwave circuit package comprising: a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; a dielectric substrate mounted on said metallic base plate and having substantially the same height as substrates of said monolithic microwave integrated circuits; and a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon, wherein said monolithic microwave integrated circuits and dielectric substrate are sealed in said package.
Claim 5
Dependent Claim
17 words
A microwave circuit package as claimed in claim 2 wherein said microstrip line forms a circuit element.
Claim 6
Dependent Claim
23 words
A microwave circuit package as claimed in claim 2 wherein said microstrip line and monolithic microwave integrated circuits are interconnected via beam leads.
Claim 7
Dependent Claim
106 words
A microwave circuit package comprising: a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; at least one spacer mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said spacer being made of a dielectric material; a dielectric substrate mounted on said metallic base plate and having substantially the same height as substrates of said monolithic microwave integrated circuits; and a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon, wherein said monolithic microwave integrated circuits, spacer and dielectric substrate are sealed in said package.
Claim 8
Dependent Claim
106 words
A microwave circuit package comprising: a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; at least one spacer mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said spacer being made of a dielectric material; a dielectric substrate mounted on said metallic base plate and having substantially the same height as substrates of said monolithic microwave integrated circuits; and a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon, wherein said monolithic microwave integrated circuits, spacer and dielectric substrate are sealed in said package.
Claim 9
Dependent Claim
17 words
A microwave circuit package as claimed in claim 5 wherein said microstrip line forms a circuit element.
Claim 10
Dependent Claim
23 words
A microwave circuit package as claimed in claim 5 wherein said microstrip line and monolithic microwave integrated circuits are interconnected via beam leads.
Claim 11
Dependent Claim
89 words
A microwave circuit package comprising: a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; a dielectric substrate mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said dielectric substrate having substantially the same height as substrates of said monolithic microwave integrated circuits; and a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon, wherein said monolithic microwave integrated circuits and dielectric substrate are sealed in said package.
Claim 12
Dependent Claim
89 words
A microwave circuit package comprising: a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; a dielectric substrate mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said dielectric substrate having substantially the same height as substrates of said monolithic microwave integrated circuits; and a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon, wherein said monolithic microwave integrated circuits and dielectric substrate are sealed in said package.
Claim 13
Dependent Claim
17 words
A microwave circuit package as claimed in claim 8 wherein said microstrip line forms a circuit element.
Claim 14
Dependent Claim
23 words
A microwave circuit package as claimed in claim 8 wherein said microstrip line and monolithic microwave integrated circuits are interconnected via beam leads.
Claim 15
Dependent Claim
135 words
A microwave circuit package comprising: a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; and at least one spacer mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said spacer being made of a dielectric material, wherein said monolithic microwave integrated circuits, and spacer are sealed in said package, and further comprising a frame mounted on a periphery of said metallic base plate and an upper lid mounted on a top of said frame so that said monolithic microwave integrated circuits and spacer are sealed in said package by said frame and upper lid, and wherein said spacer is greater in height than substrates of said monolithic microwave integrated circuits and is made of a same material as said frame.
Claim 16
Dependent Claim
135 words
A microwave circuit package comprising: a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; and at least one spacer mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said spacer being made of a dielectric material, wherein said monolithic microwave integrated circuits, and spacer are sealed in said package, and further comprising a frame mounted on a periphery of said metallic base plate and an upper lid mounted on a top of said frame so that said monolithic microwave integrated circuits and spacer are sealed in said package by said frame and upper lid, and wherein said spacer is greater in height than substrates of said monolithic microwave integrated circuits and is made of a same material as said frame.
Claim 17
Dependent Claim
122 words
A microwave circuit package comprising: a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; a dielectric substrate mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said dielectric substrate having substantially the same height as substrates of said monolithic microwave integrated circuits; and a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon, wherein said monolithic microwave integrated circuits, and dielectric substrate are sealed in said package, and said dielectric substrate is a T-shaped substrate having a stem portion separating said monolithic microwave integrated circuits from each other and a flange portion located along one end of each said integrated circuit.
Claim 18
Dependent Claim
122 words
A microwave circuit package comprising: a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; a dielectric substrate mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said dielectric substrate having substantially the same height as substrates of said monolithic microwave integrated circuits; and a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon, wherein said monolithic microwave integrated circuits, and dielectric substrate are sealed in said package, and said dielectric substrate is a T-shaped substrate having a stem portion separating said monolithic microwave integrated circuits from each other and a flange portion located along one end of each said integrated circuit.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-12-07 | 2002-06-08 | 2002-12-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-07 | 2006-06-08 | 2006-12-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-07 | 2010-06-08 | 2010-12-08 | $7700.00 | Window Closed / Lapsed |