Patent US6326697B1 successfully refreshed from Google Patents.
US6326697B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetically sealed chip scale packages formed by wafer level fabrication and assembly
Assignee: Round Rock Research LLC
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Filing: 1998-12-10
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Granted: 2001-12-04
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Expires: 2018-12-10
Abstract
Abstract Integrated circuit devices produced by a method in which devices are formed and packaged at the wafer scale. The integrated circuit device includes bond pads on a first side thereof, a layer of glass adhesively affixed to the first side, a layer of sealant covering the second side and edges thereof, and a metallization pattern on the layer of glass connected via an array of contact holes to the bond pads on the integrated circuit device. The device is advantageously formed with an etchable glass package and palladium metallization pattern.
Inventors
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:25
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/0198; H10W70/00; H10W70/01; H10W70/05; H10W70/08; H10W70/09; H10W70/099; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W74/00; H10W74/10; H10W74/111; H10W99/00; H10W72/013; H10W72/01331; H10W72/071; H10W72/073; H10W72/90; H10W72/941; H10W72/9413; H10W90/00; H10W90/701; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
142 words
A semiconductor device, comprising: a semiconductor die having first and second sides, a peripheral edge, and a circuit therein connected to an array of bond pads on said first side; a first layer of glass comprising a plate of photo-etchable glass attached with adhesive to said first side; an array of conductor filled contact holes extending through said first layer of glass from said array of bond pads to an exterior surface of said first layer of glass; a metallization pattern on said exterior surface of said first layer of glass, said metallization pattern including a plurality of conductive interconnections, each said conductive interconnection comprising a lead connected to at least one of said conductor filled contact holes, said metallization pattern comprising one of palladium and a palladium alloy; an insulative sealant layer covering said second side and edge of said die.
Claim 2
Dependent Claim
142 words
A semiconductor device, comprising: a semiconductor die having first and second sides, a peripheral edge, and a circuit therein connected to an array of bond pads on said first side; a first layer of glass comprising a plate of photo-etchable glass attached with adhesive to said first side; an array of conductor filled contact holes extending through said first layer of glass from said array of bond pads to an exterior surface of said first layer of glass; a metallization pattern on said exterior surface of said first layer of glass, said metallization pattern including a plurality of conductive interconnections, each said conductive interconnection comprising a lead connected to at least one of said conductor filled contact holes, said metallization pattern comprising one of palladium and a palladium alloy; an insulative sealant layer covering said second side and edge of said die.
Claim 3
Dependent Claim
18 words
The semiconductor device of claim 1 , wherein said insulative sealant layer comprises a hardened layer of spin-on-glass.
Claim 4
Dependent Claim
17 words
The semiconductor device of claim 1 , wherein said insulative sealant layer comprises a polymeric sealant material.
Claim 5
Dependent Claim
26 words
The semiconductor device of claim 1 , wherein said insulative sealant layer comprises a plate of glass adhesively attached to said second side of said die.
Claim 6
Dependent Claim
16 words
The semiconductor device of claim 1 , wherein said conductor filled contact holes are substantially linear.
Claim 7
Dependent Claim
23 words
The semiconductor device of claim 1 , further comprising a coat of silicon nitride applied to portions of said device for sealing thereof.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-12-03 | 2005-06-04 | 2005-12-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-12-03 | 2009-06-04 | 2009-12-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-12-03 | 2013-06-04 | 2013-12-04 | $7700.00 | Window Closed / Lapsed |