US6300673B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Edge connectable metal package
Assignee: Advanced Technology Interconnect Inc
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Filing: 1995-05-05
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Granted: 2001-10-09
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Expires: 2015-05-05
Abstract
Abstract There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected to an encased semiconductor device. The opposing end of the interconnection means extends to the package perimeter for interconnection to a socket or brazing to external leads.
Inventors
- 👤 Paul R. Hoffman
- 👤 James M. Popplewell
- 👤 Jeffrey S. Braden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:34
CPC Classifications
H; H10; H10W; H10W72/00; H10W70/00; H10W70/40; H10W70/464; H10W70/466; H10W70/468; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60; H10W90/00; H10W90/811; H10W70/682; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/075; H10W72/07551; H10W72/07554; H10W72/30; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/381; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
72 words
A package for encasing one or more electronic devices, comprising: a base component having a first perimeter; a cover component having a second perimeter of a size less than said first perimeter; and a leadframe disposed between and bonded to the base component and the cover component, said leadframe having an external portion that extends beyond said second perimeter, terminates adjacent to said first perimeter and rigidly adheres to said base component.
Claim 2
Dependent Claim
72 words
A package for encasing one or more electronic devices, comprising: a base component having a first perimeter; a cover component having a second perimeter of a size less than said first perimeter; and a leadframe disposed between and bonded to the base component and the cover component, said leadframe having an external portion that extends beyond said second perimeter, terminates adjacent to said first perimeter and rigidly adheres to said base component.
Claim 3
Dependent Claim
22 words
The package of claim 1 wherein said base component is selected from the group consisting of metals, metal alloys and metal compounds.
Claim 4
Dependent Claim
18 words
The package of claim 2 wherein said base component is aluminum, an aluminum alloy or an aluminum compound.
Claim 5
Dependent Claim
18 words
The package of claim 2 wherein said base component is at least partially coated with a dielectric layer.
Claim 6
Dependent Claim
18 words
The package of claim 3 wherein said base component is at least partially coated with an anodization layer.
Claim 7
Dependent Claim
42 words
The package of claim 5 wherein the combined thickness of said base component, said external portion of said leadframe and a dielectric sealant bonding said base component to said leadframe is that effective to electrically interconnect said package to an external socket.
Claim 8
Dependent Claim
65 words
A package for encasing one or more electronic devices, comprising: a base component at least partially coated with an in situ dielectric layer; a cover component; a leadframe disposed between and bonded to the base component and the cover component; and one or more circuit traces directly on said in situ dielectric layer and electrically interconnected to both said electronic devices and to said leadframe.
Claim 9
Dependent Claim
65 words
A package for encasing one or more electronic devices, comprising: a base component at least partially coated with an in situ dielectric layer; a cover component; a leadframe disposed between and bonded to the base component and the cover component; and one or more circuit traces directly on said in situ dielectric layer and electrically interconnected to both said electronic devices and to said leadframe.
Claim 10
Dependent Claim
25 words
The package of claim 7 wherein said base is aluminum, an aluminum alloy or an aluminum compound and said dielectric layer is an anodization layer.
Claim 11
Dependent Claim
23 words
The package of claim 8 wherein said circuit traces are selected from the group consisting of metallizations, silver filled polymers and conductive inks.
Claim 12
Dependent Claim
94 words
A package for encasing one or more electronic devices, comprising: an aluminum alloy base component at least partially coated with an in situ anodization dielectric layer and having a first perimeter; a cover component bonded to said aluminum alloy base component having a second perimeter with said first perimeter being greater than said second perimeter; and one or more circuit traces directly adhered to said dielectric layer over the entire length of said circuit traces, an external portion of said circuit traces extending from beyond said second perimeter to up to said first perimeter.
Claim 13
Dependent Claim
94 words
A package for encasing one or more electronic devices, comprising: an aluminum alloy base component at least partially coated with an in situ anodization dielectric layer and having a first perimeter; a cover component bonded to said aluminum alloy base component having a second perimeter with said first perimeter being greater than said second perimeter; and one or more circuit traces directly adhered to said dielectric layer over the entire length of said circuit traces, an external portion of said circuit traces extending from beyond said second perimeter to up to said first perimeter.
Claim 14
Dependent Claim
22 words
The package of claim 10 wherein said base component is selected from the group consisting of metals, metal alloys and metal compounds.
Claim 15
Dependent Claim
32 words
The package of claim 10 wherein said circuit traces are selected from the group consisting of copper metallization, tungsten metallization, palladium-nickel alloy metallizations, chromium/cooper/chromium laminar metallizations, silver filled polymers and conductive inks.
Claim 16
Dependent Claim
21 words
The package of claim 12 wherein a leadframe is soldered to the edges of said circuit traces adjacent said first perimeter.
Claim 17
Dependent Claim
15 words
The package of claim 13 wherein said first perimeter is equal to said second perimeter.
Claim 18
Dependent Claim
14 words
The package of claim 5 wherein said external portion terminates at said first perimeter.
Claim 19
Dependent Claim
10 words
The package of claim 10 being a ball grid array.
Claim 20
Dependent Claim
10 words
The package of claim 12 being a ball grid array.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-10-08 | 2005-04-09 | 2005-10-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-10-08 | 2009-04-09 | 2009-10-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-10-08 | 2013-04-09 | 2013-10-09 | $7700.00 | Window Closed / Lapsed |