US4908694A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Fujitsu Ltd
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Filing: 1983-04-26
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Granted: 1990-03-13
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Expires: 2003-04-26
Abstract
Abstract A semiconductor device including a metal base, a metal case and a through-passage connecting the inside and outside of the metal case, an electric terminal which provides a bridge selectively deposited on an insulator base allowing formation of conductive layer thereon. The insulator base and the conductive layer are integrated with the insulator base and the combination is insertingly engaged with the through-passage of the metal base. A semiconductor element is fixed in the metal case, in which a pseudo-coaxial line structure is formed by the conductive layer, the insulator base, the insulator bridge and the metal case. Accordingly a device of the present invention is capable of stably operating even at a frequency of 10 GHz or higher.
Inventors
- 👤 Norio Hidaka
- 👤 Shigeyuki Yamamura
- 👤 Masumi Fukuta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 11:05
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/658; H10W44/203; H10W44/209; H10W44/212; H10W70/654; H10W70/655
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
137 words
A device for an electronic device, comprising: a solid metal base having a solid metal case and a throughpassage connecting the inside and outside of said metal case, the metal case for accommodating the electronic device; an electric terminal in the through hole, said electric terminal comprising: an insulator base having a planar surface; a strip line conductor layer formed on the planar surface of said insulator base; and an insulator piece abutting part of the planar surface of said insulator base, an upper surface of said strip line conductor layer being exposed on both sides of said insulator piece and the exposed portion being provided on the inside and outside of said metal case, and the electronic device being connectable to the exposed portion of said strip line conductor on the inside of said metal case.
Claim 2
Independent Claim
137 words
A device for an electronic device, comprising: a solid metal base having a solid metal case and a throughpassage connecting the inside and outside of said metal case, the metal case for accommodating the electronic device; an electric terminal in the through hole, said electric terminal comprising: an insulator base having a planar surface; a strip line conductor layer formed on the planar surface of said insulator base; and an insulator piece abutting part of the planar surface of said insulator base, an upper surface of said strip line conductor layer being exposed on both sides of said insulator piece and the exposed portion being provided on the inside and outside of said metal case, and the electronic device being connectable to the exposed portion of said strip line conductor on the inside of said metal case.
Claim 3
Dependent Claim
27 words
A semiconductor device according to claim 1, wherein a pseudo-coaxial line is formed comprising said conductive layer, said insulator base, said insulator bridge and said metal case.
Claim 4
Dependent Claim
19 words
A semiconductor device according to claim 1, wherein said insulator base and said insulator bridge comprise a ceramic material.
Claim 5
Dependent Claim
135 words
(THREE TIMES AMENDED) A semiconductor package for an electronic device, comprising: a solid metal case for holding the electronic device and having a through hole; and a laminated electric terminal in the through hole, said laminated electric terminal comprising: an insulator base having a planar surface; a strip line conductor layer formed on the planar surface of said insulator base; and an insulator piece abutting part of the planar surface of said insulator base and said strip line conductor layer, an upper surface of said strip line conductor layer being exposed on both sides of said insulator piece and the exposed portion being provided on the inside and outside of said metal case, and the electronic device being connectable to the exposed portion of said strip line conductor on the inside of said metal case.
Claim 6
Dependent Claim
135 words
(THREE TIMES AMENDED) A semiconductor package for an electronic device, comprising: a solid metal case for holding the electronic device and having a through hole; and a laminated electric terminal in the through hole, said laminated electric terminal comprising: an insulator base having a planar surface; a strip line conductor layer formed on the planar surface of said insulator base; and an insulator piece abutting part of the planar surface of said insulator base and said strip line conductor layer, an upper surface of said strip line conductor layer being exposed on both sides of said insulator piece and the exposed portion being provided on the inside and outside of said metal case, and the electronic device being connectable to the exposed portion of said strip line conductor on the inside of said metal case.
Claim 7
Dependent Claim
21 words
A semiconductor package according to claim 4, further comprising a metal film deposited on the outside of said laminated electric terminal.
Claim 8
Dependent Claim
137 words
A semiconductor device, comprising: a semiconductor element; a solid metal base having a solid metal case and a throughpassage connecting the inside and outside of said metal case, the metal case for accommodating said semiconductor element; an electric terminal in the through hole, said electric terminal comprising: an insulator base having a planar surface; a strip line conductor layer formed on the planar surface of said insulator base; and an insulator piece abutting part of the planar surface of said insulator base, an upper surface of said strip line conductor layer being exposed on both sides of said insulator piece and the exposed portion being provided on the inside and outside of said metal case, and said semiconductor element being connected to the exposed portion of said strip line conductor on the inside of said metal case.
Claim 9
Dependent Claim
137 words
A semiconductor device, comprising: a semiconductor element; a solid metal base having a solid metal case and a throughpassage connecting the inside and outside of said metal case, the metal case for accommodating said semiconductor element; an electric terminal in the through hole, said electric terminal comprising: an insulator base having a planar surface; a strip line conductor layer formed on the planar surface of said insulator base; and an insulator piece abutting part of the planar surface of said insulator base, an upper surface of said strip line conductor layer being exposed on both sides of said insulator piece and the exposed portion being provided on the inside and outside of said metal case, and said semiconductor element being connected to the exposed portion of said strip line conductor on the inside of said metal case.
Claim 10
Dependent Claim
131 words
A semiconductor package, comprising: a semiconductor element; a solid metal case for holding said semiconductor element and having a through hole; and a laminated electric terminal in the through hole, said laminated electric terminal comprising: an insulator base having a planar surface; a strip line conductor layer formed on the planar surface of said insulator base; and an insulator piece abutting part of the planar surface of said insulator base and said strip line conductor layer, an upper surface of said strip line conductor layer being exposed on both sides of said insulator piece and the exposed portion being provided on the inside and outside of said metal case, and said semiconductor element being connected to the exposed portion of said strip line conductor on the inside of said metal case.
Claim 11
Dependent Claim
131 words
A semiconductor package, comprising: a semiconductor element; a solid metal case for holding said semiconductor element and having a through hole; and a laminated electric terminal in the through hole, said laminated electric terminal comprising: an insulator base having a planar surface; a strip line conductor layer formed on the planar surface of said insulator base; and an insulator piece abutting part of the planar surface of said insulator base and said strip line conductor layer, an upper surface of said strip line conductor layer being exposed on both sides of said insulator piece and the exposed portion being provided on the inside and outside of said metal case, and said semiconductor element being connected to the exposed portion of said strip line conductor on the inside of said metal case.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-12 | 1993-09-11 | 1994-03-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-12 | 1997-09-11 | 1998-03-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-12 | 2001-09-11 | 2002-03-13 | $7700.00 | Window Closed / Lapsed |