Substrate for an electrical circuit system and a circuit system using that substrate

Claim 2

A substrate for mounting electrical components including semiconductor devices comprising an electrically conductive circuit layer, a base layer comprising an aluminum material, and an electrically insulating hard coating dielectric layer of amorphous aluminum oxide having a dielectric strength on the order of at least 1000 volts/mil directly adherent to the aluminum material of the base layer mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer in heat-transfer relation to the base layer.

Claim 3

A substance according to claim 1 wherein the base layer comprises an aluminum metal alloy substantially free of iron and copper constituents, and the electrically insulating hard coating layer of amorphous aluminum oxide is substantially free of iron and copper inclusions therein for mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base layer in said heat-transfer relation to the base layer.

Claim 4

A substrate according to claim 2 wherein the base layer material is selected from the group of aluminum metal alloys consisting of the 1000, 5000 and 6000 Series of Aluminum Alloys.

Claim 5

A substrate according to claim 1 having an additional layer adhesively securing the electrically conductive circuit layer to the electrically insulating hard coating layer of amorphous aluminum oxide for cooperating with the electrically insulating hard coating layer of amorphous aluminum oxide in mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base layer.

Claim 6

A substrate according to claim 4 wherein the additional layer comprises a layer of an electrically insulating organic polymer material having a selected thickness for cooperating with the electrically insulating hard coating layer of amorphous aluminum oxide in mounting the electrically conductive circuit layer in said electrically insulated relation to the base layer.

Claim 7

A substrate according to claim 5 wherein the organic polymer material has adhesive properties for securing the electrically conductive circuit layer to the electrically insulating hard coating layer of amorphous aluminum oxide.

Claim 8

A substrate according to claim 4 wherein the additional layer comprises a supplemental layer of an electrically insulating material of selected thickness having adhesive material thereon, the supplemental layer and said adhesive material having a selected thickness for mounting the electrically conductive circuit layer in said electrically insulated relation to the base layer.

Claim 9

A substrate according to claim 7 wherein the supplemental layer comprises an electrically insulating organic polymer.

Claim 10

A substrate according to claim 8 wherein the organic polymer material has inclusions of electrically insulating inorganic material improving the thermal conductivity of the supplemental layer.

Claim 11

A substrate according to claim 7 wherein the supplemental layer comprises an electrically insulating inorganic material.

Claim 12

A substrate according to claim 1 wherein the electrically insulating hard coating layer of amorphous aluminum oxide comprises a multiplicity of sections of said hard coating of amorphous aluminum oxide with spacings therebetween, the sections being adherent to the base layer, and an electrically insulating adhesive material is disposed on and between said sections of amorphous aluminum oxide to cooperate with the sections of the hard coating layer of amorphous aluminum oxide for mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base layer with said heat-transfer relation to the base layer.

Claim 13

A substrate according to claim 11 wherein the base layer comprises an aluminum metal alloy substantially free of iron and copper constituents, and the electrically insulating hard coating layer of amorphous aluminum oxide is substantially free of iron and copper inclusions therein for mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base in said heat-transfer relation to the base layer.

Claim 14

A substrate according to claim 1 wherein the base metal layer comprises a composite metal material having at least one layer of metal of relatively low coefficient of thermal expansion metallurgically bonded to outer layers of an aluminum metal material for providing the base metal layer with a selected, effective coefficient of thermal expansion relatively lower than that of the aluminum metal material itself.

Claim 15

A substrate for mounting electrical components including semiconductor devices comprising an electrically conductive circuit layer, a base layer of aluminum metal material, an electrically insulating layer comprising a multiplicity of sections of a coating of aluminum oxide adherent to the base layer and having spacings between sections, and an electrically insulating adhesive material disposed on and between said sections of the coating of aluminum oxide adhered to said sections and to the base layer between said sections for cooperating with said sections of said coating layer of aluminum oxide and mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer in heat-transfer relation to the base layer.

Claim 16

A substrate for mounting electrical components including semiconductor devices comprising an electrically conductive circuit layer, a base layer of aluminum metal material, an electrically insulating layer comprising a multiplicity of sections of a coating of aluminum oxide adherent to the base layer and having spacings between sections, and an electrically insulating adhesive material disposed on and between said sections of the coating of aluminum oxide adhered to said sections and to the base layer between said sections for cooperating with said sections of said coating layer of aluminum oxide and mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer in heat-transfer relation to the base layer.

Claim 17

An electrical circuit system comprising an electrical component and an insulated metal substrate, the insulated metal substrate comprising an electrically conductive circuit layer electrically and thermally connected to the component, a base layer of an aluminum material, and an electrically insulating hard coating dielectric layer of amorphous aluminum oxide having a dielectric strength on the order of at least 1000 volts/mil directly adherent to the aluminum material of the base layer mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer and in heat-transfer relation to the base layer.

Claim 18

An electrical circuit system comprising an electrical component and an insulated metal substrate, the insulated metal substrate comprising an electrically conductive circuit layer electrically and thermally connected to the component, a base layer of an aluminum material, and an electrically insulating hard coating dielectric layer of amorphous aluminum oxide having a dielectric strength on the order of at least 1000 volts/mil directly adherent to the aluminum material of the base layer mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer and in heat-transfer relation to the base layer.

Claim 19

An electrical circuit system according to claim 15 wherein the base layer comprises an aluminum metal alloy substantially free of iron and copper constituents and the electrically insulating hard coating layer of amorphous aluminum oxide is substantially free of iron and copper inclusions therein.

Claim 20

An electrical circuit system according to claim 16 wherein the electrically insulating hard coating layer of amorphous oxide comprises a multiplicity of sections of said hard coating of amorphous aluminum oxide with spaces therebetween adherent to the base layer, and an electrically insulating adhesive material is disposed on and between said sections of the hard coating of amorphous oxide to cooperate with the sections for mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base layer with said heat-transfer relation to the base layer.

Claim 21

A substrate for mounting electrical components including semiconductor devices comprises an electrically conductive circuit layer, a base layer comprising an aluminum material, and an electrically insulating hard coating dielectric layer of amorphous aluminum oxide formed in situ on the aluminum base layer in an amorphous aluminum oxide hard coating process to be of high density having dielectric strength on the order of at least 1000 volts/mil to be directly adherent to the aluminum material of the base layer mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer in heat-transfer relation to the base layer.

Claim 22

A substrate for mounting electrical components including semiconductor devices comprises an electrically conductive circuit layer, a base layer comprising an aluminum material, and an electrically insulating hard coating dielectric layer of amorphous aluminum oxide formed in situ on the aluminum base layer in an amorphous aluminum oxide hard coating process to be of high density having dielectric strength on the order of at least 1000 volts/mil to be directly adherent to the aluminum material of the base layer mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer in heat-transfer relation to the base layer.

Claim 23

A substrate according to claim 18 wherein the base layer comprises an aluminum metal alloy substantially free of iron and copper constituents, and the electrically insulating hard coating layer of amorphous aluminum oxide is substantially free of iron and copper inclusions therein for mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base layer in said heat-transfer relation to the base layer.

Claim 24

A substrate according to claim 19 wherein the base layer material is selected from the group of aluminum metal alloys consisting of 1000, 5000 and 6000 Series of Aluminum Alloys.

Claim 25

A substrate according to claim 18 having an additional layer adhesively securing the electrically conductive circuit layer to the electrically insulating hard coating layer of amorphous aluminum oxide for cooperating with the electrically insulating hard coating layer of amorphous aluminum oxide in mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base layer.

Claim 26

A substrate according to claim 21 wherein the additional layer comprises a layer of an electrically insulating organic polymer material having a selected thickness for cooperating with the electrically insulating hard coating layer of amorphous aluminum oxide in mounting the electrically conductive circuit layer in said electrically insulated relation to the base layer.

Claim 27

A substrate according to claim 22 wherein the organic polymer material has adhesive properties for securing the electrically conductive circuit layer to the electrically insulating hard coating layer of amorphous aluminum oxide.

Claim 28

A substrate according to claim 21 wherein the additional layer comprises a supplemental layer of an electrically insulating material of selected thickness having adhesive material thereon, the supplemental layer and said adhesive material having a selected thickness for mounting the electrically conductive circuit layer in said electrically insulated relation to the base layer.

Claim 29

A substrate according to claim 24 wherein the supplemental layer comprises an electrically insulating organic polymer.

Claim 30

A substrate according to claim 25 wherein the organic polymer material has inclusions of electrically insulating inorganic material improving the thermal conductivity of the supplemental layer.

Claim 31

A substrate according to claim 24 wherein the supplemental layer comprises an electrically insulating inorganic material.

Claim 32

A substrate according to claim 18 wherein the electrically insulating hard coating layer of amorphous aluminum oxide comprises a multiplicity of sections of said hard coating of amorphous aluminum oxide with spacings therebetween, the sections being adherent to the base layer, and a electrically insulating adhesive material is disposed on and between said sections of amorphous aluminum oxide to cooperate with the sections of the hard coating layer of amorphous oxide for mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base layer with said heat-transfer relation to the base layer.

Claim 33

A substrate according to claim 28 wherein the base layer comprises an aluminum metal alloy substantially free of iron and copper constituents, and the electrically insulating hard coating layer of amorphous aluminum oxide is substantially free of iron and copper inclusions therein for mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base layer in said heat-transfer relation to the base layer.

Claim 34

A substrate according to claim 18 wherein the base metal layer comprises a composite metal material having at least one layer of metal of relatively low coefficient of thermal expansion metallurgically bonded to outer layers of an aluminum metal material for providing the base metal layer with a selected, effective coefficient of thermal expansion relatively lower than that of the aluminum metal material itself.

Claim 35

A substrate for mounting electrical components including semiconductor devices comprising an electrically conductive circuit layer, a base layer of aluminum metal material, an electrically insulating layer comprising a multiplicity of sections of said hard coating of amorphous aluminum coating oxide formed in situ on the aluminum base layer in an amorphous aluminum oxide hard coating process to be of high density having a dielectric strength on the order of at least 1000 volts/mil. to be adherent to the base layer and having spacings between said sections, and an electrically insulating adhesive material disposed on and between said sections of hard coating of aluminum oxide adhered to said sections and to the base layer between said sections for cooperating with said sections of said hard coating layer of aluminum oxide for mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer in heat-transfer relation to the base layer.

Claim 36

A substrate for mounting electrical components including semiconductor devices comprising an electrically conductive circuit layer, a base layer of aluminum metal material, an electrically insulating layer comprising a multiplicity of sections of said hard coating of amorphous aluminum coating oxide formed in situ on the aluminum base layer in an amorphous aluminum oxide hard coating process to be of high density having a dielectric strength on the order of at least 1000 volts/mil. to be adherent to the base layer and having spacings between said sections, and an electrically insulating adhesive material disposed on and between said sections of hard coating of aluminum oxide adhered to said sections and to the base layer between said sections for cooperating with said sections of said hard coating layer of aluminum oxide for mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer in heat-transfer relation to the base layer.

Claim 37

An electrical circuit system comprising an electrical component and an insulated metal substrate, the insulated metal substrate comprising an electrically conductive circuit layer electrically and thermally connected to the component, a base layer of an aluminum material, and an electrically insulated hard coating dielectric layer of amorphous aluminum oxide formed in situ on the aluminum base layer in an amorphous aluminum oxide hard coating process to be of high density having a dielectric strength on the order of at least 1000 volts/mil to be directly adherent to the aluminum material of the base layer mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer and in heat-transfer relation to the base layer.

Claim 38

An electrical circuit system comprising an electrical component and an insulated metal substrate, the insulated metal substrate comprising an electrically conductive circuit layer electrically and thermally connected to the component, a base layer of an aluminum material, and an electrically insulated hard coating dielectric layer of amorphous aluminum oxide formed in situ on the aluminum base layer in an amorphous aluminum oxide hard coating process to be of high density having a dielectric strength on the order of at least 1000 volts/mil to be directly adherent to the aluminum material of the base layer mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer and in heat-transfer relation to the base layer.

Claim 39

An electrical circuit system according to claim 32 wherein the base layer comprises an aluminum metal alloy substantially free of iron and copper constituents and the electrically insulating hard coating layer of amorphous aluminum oxide is substantially free of iron and copper inclusions therein.

Claim 40

An electrical circuit system according to claim 33 wherein the electrically insulating hard coating layer of amorphous aluminum oxide comprises a multiplicity of sections of said hard coating of amorphous aluminum oxide with spaces therebetween adherent to the base layer, and an electrically insulating adhesive material is disposed on and between said sections of the hard coating of amorphous aluminum oxide to cooperate with the sections for mounting the electrically conductive circuit layer in said selected electrically insulated relation to the base layer with said heat-transfer relation to the base layer.