Patent US6204093B1 successfully refreshed from Google Patents.
US6204093B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for applying viscous materials to a lead frame
Assignee: Micron Technology Inc
•
Filing: 1997-08-21
•
Granted: 2001-03-20
•
Expires: 2017-08-21
Abstract
Abstract The invention is directed to the application of viscous materials, such as the adhesives used in LOC die attach processes, to a lead frame by forming a film of viscous material and then bringing a portion of the lead frame and the film of viscous material into contact with one another. In one exemplary embodiment of the method of the invention, the viscous material is drop dispensed, sprayed, pumped or otherwise placed on a carrier surface, the material is spread to a uniform film thickness and then brought into contact with the die attach portion of the lead frame. One embodiment of the apparatus for applying the viscous material includes (1) a carrier surface, (2) a plurality of orifices in fluid communication with the carrier surface, and (3) a pump for pumping the viscous material through the orifices to the carrier surface. The apparatus may also include a metering blade for spreading the material to a uniform film thickness over the carrier surface.
Inventors
- 👤 Syed Sajid Ahmad
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:57
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/417; H10W70/415; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/075; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/865; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
67 words
A method for applying flowable material to a lead frame, comprising forming a film of flowable material on a carrier surface, bringing a portion of the lead frame and the film of flowable material into contact with one another, separating the portion of the lead frame from the film of flowable material on the carrier surface, and leaving flowable material on the portion of the lead frame.
Claim 2
Independent Claim
67 words
A method for applying flowable material to a lead frame, comprising forming a film of flowable material on a carrier surface, bringing a portion of the lead frame and the film of flowable material into contact with one another, separating the portion of the lead frame from the film of flowable material on the carrier surface, and leaving flowable material on the portion of the lead frame.
Claim 3
Dependent Claim
40 words
A method according to claim 1 , wherein the step of bringing a portion of the lead frame and the film of flowable material into contact with one another comprises biasing the lead frame against the film of flowable material.
Claim 4
Dependent Claim
40 words
A method according to claim 1 , wherein the step of bringing a portion of the lead frame and the film of flowable material into contact with one another comprises biasing the film of flowable material against the lead frame.
Claim 5
Dependent Claim
40 words
A method according to claim 2 , wherein the step of biasing the lead frame against the film of flowable material comprises offsetting the portion of the lead frame contacting the flowable material from other portions of the lead frame.
Claim 6
Independent Claim
72 words
A method for applying flowable material to a lead frame, comprising: placing flowable material on a surface; forming a film of the flowable material on the surface; bringing a portion of the lead frame and the film of flowable material into contact with one another; separating the portion of the lead frame from the film of flowable material on the surface; and leaving flowable material on the portion of the lead frame.
Claim 7
Independent Claim
72 words
A method for applying flowable material to a lead frame, comprising: placing flowable material on a surface; forming a film of the flowable material on the surface; bringing a portion of the lead frame and the film of flowable material into contact with one another; separating the portion of the lead frame from the film of flowable material on the surface; and leaving flowable material on the portion of the lead frame.
Claim 8
Dependent Claim
29 words
A method according to claim 5 , further comprising placing an excess of the flowable material onto the surface and spreading the flowable material to a uniform film thickness.
Claim 9
Dependent Claim
29 words
A method according to claim 5 , further comprising placing an excess of the flowable material onto the surface and blading the flowable material to a uniform film thickness.
Claim 10
Independent Claim
54 words
A method for applying flowable material to a lead frame, comprising: providing a carrier surface and an array of orifices in fluid communication with the surface; feeding a flowable material through the orifices on to the surface; and bringing a portion of the lead frame and the flowable material into contact with one another.
Claim 11
Independent Claim
54 words
A method for applying flowable material to a lead frame, comprising: providing a carrier surface and an array of orifices in fluid communication with the surface; feeding a flowable material through the orifices on to the surface; and bringing a portion of the lead frame and the flowable material into contact with one another.
Claim 12
Dependent Claim
22 words
A method according to claim 8 , further comprising spreading the flowable material to a uniform film thickness on the carrier surface.
Claim 13
Dependent Claim
39 words
A method according to claim 8 , further comprising monitoring a height of the flowable material above the carrier surface and controlling the feeding of the flowable material through the orifices according to the height of the flowable material.
Claim 14
Independent Claim
58 words
A method for applying viscous material to lead fingers on a lead frame, comprising: dispensing adhesive material on to a surface; spreading the adhesive material to a uniform thickness; bringing the lead fingers material into contact with one another; separating the lead fingers from the adhesive material on the surface; and leaving adhesive material on the lead fingers.
Claim 15
Independent Claim
58 words
A method for applying viscous material to lead fingers on a lead frame, comprising: dispensing adhesive material on to a surface; spreading the adhesive material to a uniform thickness; bringing the lead fingers material into contact with one another; separating the lead fingers from the adhesive material on the surface; and leaving adhesive material on the lead fingers.
Claim 16
Independent Claim
84 words
A method for applying adhesive material to lead fingers on a lead frame, comprising: placing adhesive material on to a surface; spreading the adhesive material to a uniform thickness; offsetting at least a portion of the lead fingers from other portions of the lead frame; dipping the offset portions of the lead fingers in the adhesive material; removing the offset portions of the lead fingers from the adhesive material on the surface; and leaving adhesive material on the offset portions of the lead fingers.
Claim 17
Independent Claim
84 words
A method for applying adhesive material to lead fingers on a lead frame, comprising: placing adhesive material on to a surface; spreading the adhesive material to a uniform thickness; offsetting at least a portion of the lead fingers from other portions of the lead frame; dipping the offset portions of the lead fingers in the adhesive material; removing the offset portions of the lead fingers from the adhesive material on the surface; and leaving adhesive material on the offset portions of the lead fingers.
Claim 18
Independent Claim
104 words
A method for attaching a semiconductor die to a lead frame having a plurality of lead fingers configured to extend across a surface of the die, the method comprising: forming a film of adhesive material on a carrier surface; bringing a die attach portion of the lead fingers and the film of adhesive material into contact with one another; separating the die attach portion of the lead fingers from the film of adhesive material on the carrier surface; leaving adhesive material on the die attach portion of the lead fingers; and pressing the die and the die attach portion of the lead fingers together.
Claim 19
Independent Claim
104 words
A method for attaching a semiconductor die to a lead frame having a plurality of lead fingers configured to extend across a surface of the die, the method comprising: forming a film of adhesive material on a carrier surface; bringing a die attach portion of the lead fingers and the film of adhesive material into contact with one another; separating the die attach portion of the lead fingers from the film of adhesive material on the carrier surface; leaving adhesive material on the die attach portion of the lead fingers; and pressing the die and the die attach portion of the lead fingers together.
Claim 20
Independent Claim
113 words
A method for attaching a semiconductor die to a lead frame having a plurality of lead fingers configured to extend across a surface of the die, the method comprising: offsetting a die attach portion of the lead fingers from the other portions of the lead frame forming a film of adhesive material on a carrier surface; dipping the die attach portion of the lead fingers in the film of adhesive material; removing the offset portions of the lead fingers from the adhesive material on the carrier surface; leaving adhesive material on the die attach portion of the lead fingers; and pressing the die and the die attach portion of the lead fingers together.
Claim 21
Independent Claim
113 words
A method for attaching a semiconductor die to a lead frame having a plurality of lead fingers configured to extend across a surface of the die, the method comprising: offsetting a die attach portion of the lead fingers from the other portions of the lead frame forming a film of adhesive material on a carrier surface; dipping the die attach portion of the lead fingers in the film of adhesive material; removing the offset portions of the lead fingers from the adhesive material on the carrier surface; leaving adhesive material on the die attach portion of the lead fingers; and pressing the die and the die attach portion of the lead fingers together.
References Cited (Backward Citations)
US4045863A
Cited
US4355463A
Cited
US5049434A
Cited
US4959008A
Cited
US4862245A
Cited
US5030308A
Cited
US4876221A
Cited
US5066614A
Cited
US5140404A
Cited
US5304842A
Cited
US5256598A
Cited
US5739053A
Cited
US5409863A
Cited
US5563443A
Cited
US5286679A
Cited
US5548160A
Cited
US5773322A
Cited
US5696033A
Cited
US5923957A
Cited
US5733800A
Cited
US5834062A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-03-19 | 2004-09-18 | 2005-03-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-03-19 | 2008-09-18 | 2009-03-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-03-19 | 2012-09-18 | 2013-03-20 | $7700.00 | Window Closed / Lapsed |