US4959008A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Pre-patterned circuit board device-attach adhesive transfer system
Assignee: National Starch and Chemical Investment Holding Corp
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Filing: 1984-04-30
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Granted: 1990-09-25
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Expires: 2004-04-30
Abstract
Abstract A pre-patterned circuit board device-attach transfer tape is described which allows a one step mounting of adhesive patterns on a circuit board in the desired configuration for later mounting of surface mounted devices (e.g., semiconductor dies) thereon. The tape product contains the adhesive pattern in a mirror image to that desired on the exposed surface of the circuit board. The product of the present invention is utilized by bringing the tape product into contact with the circuit board so that the adhesive on the carrier film bonds to the desired surface of the circuit board thereby bringing the adhesive patterns into the desired configuration desired on the circuit board. The use of pressure and, possibly, heat preferentially bonds the adhesive to the circuit board and allows for later stripping of the support film from the support film/adhesive/circuit board composite. This step leaves behind the desired adhesive configuration on the circuit board and allows for later bonding of appropriate surface mounted devices to the circuit board.
Inventors
- 👤 William M. Wasulko
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:36
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/20; H05K3/207; H10; H10W; H10W72/00; H10W72/01; H10W72/013; H05K3/30; H05K3/32; H05K3/321; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K1/18; H05K1/181; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0156; H05K2203/03; H05K2203/0338; H05K2203/05; H05K2203/0502; H05K2203/0537; H10W72/011; H10W72/0113; H10W72/01331; H10W72/01336; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/14; Y10T428/1424; Y10T428/1429; Y10T428/24; Y10T428/24802; Y10T428/24851; Y10T428/24868; Y10T428/24876; Y10T428/24917; Y10T428/24942; Y10T428/2495; Y10T428/24967; Y10T428/24975; Y10T428/25
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
66 words
A circuit board device attach tape which comprises: (a) a support film; and (b) a pattern of curable conductive adhesive releasably affixed to one side of support film, the adhesive pattern being of a size and shape so that when brought into contact with a circuit board, the adhesive is in a pattern suitable for later attachment thereon of surface mounted devices to the circuit board.
Claim 2
Dependent Claim
66 words
A circuit board device attach tape which comprises: (a) a support film; and (b) a pattern of curable conductive adhesive releasably affixed to one side of support film, the adhesive pattern being of a size and shape so that when brought into contact with a circuit board, the adhesive is in a pattern suitable for later attachment thereon of surface mounted devices to the circuit board.
Claim 3
Dependent Claim
18 words
A tape as claimed in claim 1 in which the support film is formed of a polyolefin polymer.
Claim 4
Dependent Claim
13 words
A tape as claimed in claim 1 wherein the support film is polyethylene.
Claim 5
Dependent Claim
23 words
A tape as claimed in claim 1 wherein the support film has a thickness of from about 12 microns to about 250 microns.
Claim 6
Dependent Claim
23 words
A tape as claimed in claim 1 which further comprises a release layer on the film between the support film and the adhesive.
Claim 7
Dependent Claim
15 words
A tape as claimed in claim 5 wherein the release layer comprises a silicone composition.
Claim 8
Dependent Claim
15 words
A tape as claimed in claim 5 wherein the release layer comprises a fluorocarbon composition.
Claim 9
Dependent Claim
23 words
A tape as claimed in claim 1 wherein the conductive adhesive has a thickness of from about 5 microns to about 75 microns.
Claim 10
Dependent Claim
25 words
A tape as claimed in claim 1 wherein the conductive adhesive contains an effective amount for conductivity of a conductive metal in an adhesive matrix.
Claim 11
Dependent Claim
22 words
A tape as claimed in claim 2 wherein the support film has a thickness of about 12 microns to about 250 microns.
Claim 12
Dependent Claim
27 words
A tape as claimed in claim 9 which has a release layer on the film between it and the adhesive, said release layer comprising a silicone composition.
Claim 13
Dependent Claim
41 words
A tape as claimed in claim 11 having a conductive adhesive of a thickness of from about 5 microns to about 75 microns and wherein the adhesive contains an effective amount for conductivity of a conductive metal in an adhesive matrix.
Claim 14
Dependent Claim
19 words
A tape as claimed in claim 1 which also has a release liner over the pattern of conductive adhesive.
Claim 15
Dependent Claim
19 words
A film as claimed in claim 12 which also has a release liner over the pattern of conductive adhesive.
Claim 16
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 1.
Claim 17
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 2.
Claim 18
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 3.
Claim 19
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 4.
Claim 20
Dependent Claim
12 words
In combination, a circuit board the the tape product of claim 5.
Claim 21
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 6.
Claim 22
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 7.
Claim 23
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 8.
Claim 24
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 9.
Claim 25
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 10.
Claim 26
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 11.
Claim 27
Dependent Claim
12 words
In combination, a circuit board and the tape product of claim 12.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-09-24 | 1994-03-26 | 1994-09-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-09-24 | 1998-03-26 | 1998-09-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-09-24 | 2002-03-26 | 2002-09-25 | $7700.00 | Window Closed / Lapsed |