Process for preparing epoxy laminates for additive plating

Claim 3

The process of claim 1 wherein the insulating base is impregnated with epoxy.

Claim 4

The process of claim 2 wherein the adhesive is applied to the transfer material from a volatile solvent carrier, and the solvent is evaporated therefrom prior to bringing the coated surface into contact with the insulating base surface.

Claim 5

The process of claim 3 wherein the solvent carrier comprises methyl ethyl ketone or methyl isobutyl ketone.

Claim 6

The process of claim 2 wherein the insulating base comprises glass fiber cloth.

Claim 7

The process of claim 2 wherein the adhesive is coated on the transfer material to about a 0.0003-0.0006 inch thick layer.

Claim 8

The process of claim 2 wherein the transfer material is a coated paper, a plastic sheet or a metallic foil.

Claim 9

The process of claim 7 wherein the plastic sheet is polyethylene, poly (vinyl chloride), poly (vinyl fluoride), polyester, polypropylene or polyoxymethylene.

Claim 10

The process of claim 8 wherein the plastic sheet is poly (vinyl fluoride).

Claim 11

The process of claim 2 wherein the transfer material is peeled from the adhesive surface.

Claim 12

The process of claim 2 wherein the transfer material is etched from the adhesive surface.

Claim 13

The process of claim 2 wherein, after removing the transfer material, a resist pattern is applied to the adhesive surface prior to the metal plating.

Claim 14

The process of claim 12 wherein the adhesive surface is chemically etched and seeded after removal of the transfer material but prior to applying the resist pattern.

Claim 15

An electroless plated insulating base made by the process of claim 1.

Claim 16

In a process for manufacturing a printed circuit board wherein a metal is electrolessly deposited on the surface of an epoxy-impregnated fiber glass cloth prepreg, the improvement to increase the adherence of the metal to the prepreg which comprises, prior to the metal deposition, (A) forming a coating of a substantially solvent-free, uncured nitrile rubber/phenolic thermosetting resin adhesive, wherein the nitrile rubber consists essentially of an acrylonitrile/butadiene copolymer or an acrylonitrile/butadiene/styrene copolymer, on a removable transfer material, (B) bringing the coated surface into contact with a surface of the prepreg wherein the epoxy is still substantially uncured to form a composite, (C) heating the composite under conditions to simultaneously cure the adhesive and the epoxy so that the adhesive becomes an integral part of the epoxy-impregnated prepreg, with said adhesive not being subjected to a temperature above about 150° F. prior to step (C) and (D) removing the transfer material.

Claim 17

In a process for manufacturing a printed circuit board wherein a metal is electrolessly deposited on the surface of an epoxy-impregnated fiber glass cloth prepreg, the improvement to increase the adherence of the metal to the prepreg which comprises, prior to the metal deposition, (A) forming a coating of a substantially solvent-free, uncured nitrile rubber/phenolic thermosetting resin adhesive, wherein the nitrile rubber consists essentially of an acrylonitrile/butadiene copolymer or an acrylonitrile/butadiene/styrene copolymer, on a removable transfer material, (B) bringing the coated surface into contact with a surface of the prepreg wherein the epoxy is still substantially uncured to form a composite, (C) heating the composite under conditions to simultaneously cure the adhesive and the epoxy so that the adhesive becomes an integral part of the epoxy-impregnated prepreg, with said adhesive not being subjected to a temperature above about 150° F. prior to step (C) and (D) removing the transfer material.

Claim 18

The process of claim 15 wherein the adhesive is coated on the transfer material to about a 0.0003-0.0006 inch thick layer.

Claim 19

The process of claim 15 wherein the transfer material is a poly (vinyl fluoride) sheet.

Claim 20

A printed circuit board made by the process of claim 17.