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US3948701A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for manufacturing base material for printed circuits

Assignee: AEG Isolier und Kunststoff GmbH
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Filing: 1974-10-02
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Granted: 1976-04-06
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Expires: 1994-10-02
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Abstract

Abstract In a process for making a printed circuit, a method of forming a base for the circuit, including coating a cover foil with a decomposable film, then bonding the film to a carrier, and then removing the cover foil from the film. A protected base useful for making printed circuits, comprising a synthetic-resin-based carrier, a decomposable adhesive film bonded to the carrier, and a removable cover foil bonded to the film, the adhesive film containing catalyst effective for the electroless deposition of metal conductors.

Inventors

  • 👤 Helmut Fasbender
  • 👤 Horst Hirschfeld

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 01:03
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/002; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/38; H05K3/386; H05K3/387; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0236; H05K2201/20; H05K2201/2081; H05K2203/00; H05K2203/06; H05K2203/066; H05K2203/11; H05K2203/1152; H05K2203/13; H05K2203/1377; H05K2203/1388; H05K3/0011; H05K3/0044; H05K3/0047; H05K3/40; H05K3/42; H05K3/425; H05K3/426; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T156/1057; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31688; Y10T428/31692; Y10T428/31699

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 129 words
In the manufacture of base material for printed circuits comprising a resin impregnated carrier material and a chemically decomposable heat-hardenable resinous adhesive film on a surface of said carrier, the improvement comprising coating an aluminum foil with an adhesive film of an acrylonitrile-butadiene copolymer in combination with a phenolic resin as said decomposable heat-hardenable resinous adhesive film, placing the film side of the thus-coated foil on a surface of the resin impregnated carrier material, bonding said film to said carrier material by applying heat and pressure thereto to form a pressed base material having a foil which can be etched away to expose an adhesive surface which is substantially free of impurities and etching away metal foil from the film before a circuit is formed on said base material.
Claim 2
Dependent Claim 129 words
In the manufacture of base material for printed circuits comprising a resin impregnated carrier material and a chemically decomposable heat-hardenable resinous adhesive film on a surface of said carrier, the improvement comprising coating an aluminum foil with an adhesive film of an acrylonitrile-butadiene copolymer in combination with a phenolic resin as said decomposable heat-hardenable resinous adhesive film, placing the film side of the thus-coated foil on a surface of the resin impregnated carrier material, bonding said film to said carrier material by applying heat and pressure thereto to form a pressed base material having a foil which can be etched away to expose an adhesive surface which is substantially free of impurities and etching away metal foil from the film before a circuit is formed on said base material.
Claim 3
Dependent Claim 34 words
In a process for making a printed circuit, a method as claimed in claim 1, further comprising the step of decomposing at least some of said film immediately after the step of etching away.
Claim 4
Dependent Claim 26 words
The improvement as claimed in claim 1 further comprising drilling a hole through the metal foil, film and base material before the step of etching away.

References Cited (Backward Citations)

US2070596A Cited
US2318096A Cited
US2692190A Cited
US2990310A Cited
US3171756A Cited
US3212913A Cited
GB1187061A Cited
US3625758A Cited
US3689332A Cited
US3784440A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1979-04-06 1979-10-06 1980-04-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1983-04-06 1983-10-06 1984-04-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1987-04-06 1987-10-06 1988-04-06 $7700.00 Window Closed / Lapsed

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