US4029845A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit base board and method for manufacturing same
Assignee: Sumitomo Bakelite Co Ltd
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Filing: 1975-08-12
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Granted: 1977-06-14
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Expires: 1995-08-12
Abstract
Abstract A base board for printed circuits prepared by the additive process, obtained by heating under pressure a layer comprising at least one sheet of prepreg comprising a thermosetting resin as impregnant and a layer of composition comprising a semi-cured thermosetting resin and a nitrile rubber, said layer of composition being placed on one or both sides of said prepreg layer to integrate said layers as a finished laminate. This base board is used in the additive process for manufacturing a printed circuit board having favorable properties with strong adhesion between the circuit and the base board without showing any warp or twist.
Inventors
- 👤 Hirotoshi Nomura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 10:06
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/06; H; H01; H01B; H01B5/00; H01B5/14; B32B15/00; B32B15/04; B32B15/08; B32B15/092; B32B15/098; B32B27/08; B32B27/10; B32B27/32; B32B27/36; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/036; H05K3/00; H05K3/38; H05K3/386; H05K3/387; B32B2305/00; B32B2305/07; B32B2305/076; B32B2457/00; B32B2457/08; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2203/00; H05K2203/06; H05K2203/066; H05K2203/11; H05K2203/1152; H05K3/10; H05K3/18; H05K3/181; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31515; Y10T428/31518; Y10T428/31551; Y10T428/31623; Y10T428/31627; Y10T428/31645; Y10T428/31649; Y10T428/31855; Y10T428/31859; Y10T428/31877; Y10T428/31935; Y10T428/31942
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
118 words
A base board, for printed circuits for preparation by the additive process, obtained by heating under pressure (1) a layer of prepreg comprising a thermosetting resin as impregnant, (2) adjacent to said prepreg layer one or two layers of a semi-cured composition comprising 50-300 parts by weight of a thermosetting resin and 100 parts by weight of a nitrile rubber, and (3) adjacent to said composition layer one or two layers of phospholipid, said one or two layers of composition being placed on one or both sides of the layer of prepreg, said one or two layers of phospholiped being applied to the outer side of said layer of composition, to integrate the layers as a finished laminate.
Claim 2
Dependent Claim
118 words
A base board, for printed circuits for preparation by the additive process, obtained by heating under pressure (1) a layer of prepreg comprising a thermosetting resin as impregnant, (2) adjacent to said prepreg layer one or two layers of a semi-cured composition comprising 50-300 parts by weight of a thermosetting resin and 100 parts by weight of a nitrile rubber, and (3) adjacent to said composition layer one or two layers of phospholipid, said one or two layers of composition being placed on one or both sides of the layer of prepreg, said one or two layers of phospholiped being applied to the outer side of said layer of composition, to integrate the layers as a finished laminate.
Claim 3
Dependent Claim
58 words
A base board for printed circuits according to claim 2, wherein the resin of the prepreg layer is a resin selected from the group consisting of a phenol resin, a polyimide resin, and a hardener-containing epoxy resin, and the resin of the layer of the composition is a mixed resin of a phenol resin and an epoxy resin.
Claim 4
Independent Claim
147 words
A method for manufacturing a base board, for printed circuits for preparation by the additive process, characterized by heating under pressure a layer of prepreg comprising a thermosetting resin as impregnant, and one or two second layers of a transfer sheet material coated with a semi-cured composition of 50-300 parts by weight thermosetting resin and 100 parts by weight nitrile rubber, after undercoating a phospholipid on the transfer sheet material, said one or two layers of composition and phospholipid coated transfer sheet material being placed on one or both sides of the layer of prepreg so as to make contact between the coated side of the sheet material and the prepreg, to integrate the layer of prepreg and the coated sheet material as a finished laminate, and thereafter removing said sheet material, so that a coated composition of sheet material is transferred on the layer of prepreg.
Claim 5
Independent Claim
147 words
A method for manufacturing a base board, for printed circuits for preparation by the additive process, characterized by heating under pressure a layer of prepreg comprising a thermosetting resin as impregnant, and one or two second layers of a transfer sheet material coated with a semi-cured composition of 50-300 parts by weight thermosetting resin and 100 parts by weight nitrile rubber, after undercoating a phospholipid on the transfer sheet material, said one or two layers of composition and phospholipid coated transfer sheet material being placed on one or both sides of the layer of prepreg so as to make contact between the coated side of the sheet material and the prepreg, to integrate the layer of prepreg and the coated sheet material as a finished laminate, and thereafter removing said sheet material, so that a coated composition of sheet material is transferred on the layer of prepreg.
Claim 6
Dependent Claim
23 words
A manufacturing method according to claim 3, wherein the resin in the prepreg comprising a thermosetting resin as impregnant is a phenolic resin.
Claim 7
Dependent Claim
27 words
A manufacturing method according to claim 3, wherein the resin in the prepreg comprising a thermosetting resin as impregnant is an epoxy resin containing a curing agent.
Claim 8
Dependent Claim
23 words
A manufacturing method according to claim 3, wherein the resin in the prepreg comprising a thermosetting resin as impregnant is a polyimide resin.
Claim 9
Dependent Claim
21 words
A manufacturing method according to claim 3, wherein the resin in the composition is an epoxy resin containing a curing agent.
Claim 10
Dependent Claim
18 words
A manufacturing method according to claim 3, wherein the resin in the composition is a resol-type phenolic resin.
Claim 11
Dependent Claim
14 words
A manufacturing method according to claim 3, wherein the sheet material is aluminum foil.
Claim 12
Dependent Claim
50 words
A manufacturing method according to claim 3, herein the resin in the prepreg comprising a thermosetting resin as impregnant is a phenolic resin, a polyimide resin, or a curing-agent-containing epoxy resin, and the resin in the composition is a resin mixture of a resol-type phenolic resin and an epoxy resin.
Claim 13
Dependent Claim
35 words
A manufacturing method according to claim 3, wherein the resin in the composition is a phenolic resin and the composition further contains an additive capable of scavenging water formed during condensation of the phenolic resin.
Claim 14
Dependent Claim
12 words
A method according to claim 11, wherein the additive is calcined talc.
Claim 15
Dependent Claim
12 words
A method according to claim 11, wherein the additive is a lactone.
Claim 16
Independent Claim
170 words
A method of manufacturing a base board for the preparation of printed circuits by the additive process comprising: providing a pair of caul plates each coated with a phospholipid; and heating under pressure between said coated caul plates: 1. a layer of a first prepreg comprising a thermosetting resin as impregnant, said layer becoming the core layer of the finished base board, and 2. adjacent to the prepreg layer one or two sheets of coated second prepreg comprising a semi-cured thermosetting resin and a nitrile rubber composition, in the amount of 50 to 300 parts by weight of said resin to 100 parts by weight of said nitrile rubber, coated on one or both sides of said second prepreg, said second prepreg comprising a thermosetting resin as impregnant, said coated second prepreg lying adjacent said coated caul plate, said one or two sheets of coated second prepreg thereby becoming the surface layer of the base board with the coated side outward on one or both sides of said core layer.
Claim 17
Independent Claim
170 words
A method of manufacturing a base board for the preparation of printed circuits by the additive process comprising: providing a pair of caul plates each coated with a phospholipid; and heating under pressure between said coated caul plates: 1. a layer of a first prepreg comprising a thermosetting resin as impregnant, said layer becoming the core layer of the finished base board, and 2. adjacent to the prepreg layer one or two sheets of coated second prepreg comprising a semi-cured thermosetting resin and a nitrile rubber composition, in the amount of 50 to 300 parts by weight of said resin to 100 parts by weight of said nitrile rubber, coated on one or both sides of said second prepreg, said second prepreg comprising a thermosetting resin as impregnant, said coated second prepreg lying adjacent said coated caul plate, said one or two sheets of coated second prepreg thereby becoming the surface layer of the base board with the coated side outward on one or both sides of said core layer.
Claim 18
Dependent Claim
23 words
A manufacturing method according to claim 14, wherein the resin in the prepreg comprising a thermosetting resin as impregnant is a phenolic resin.
Claim 19
Dependent Claim
27 words
A manufacturing method according to claim 14, wherein the resin in the prepreg comprising a thermosetting resin as impregnant is an epoxy resin containing a curing agent.
Claim 20
Dependent Claim
23 words
A manufacturing method according to claim 14, wherein the resin in the prepreg comprising a thermosetting resin as impregnant is a polyimide resin.
Claim 21
Dependent Claim
18 words
A manufacturing method according to claim 14, wherein the resin in the composition is a resol-type phenolic resin.
Claim 22
Dependent Claim
21 words
A manufacturing method according to claim 14, wherein the resin in the composition is an epoxy resin containing a curing agent.
Claim 23
Dependent Claim
50 words
A manufacturing method according to claim 14, wherein the resin in the prepreg comprising a thermosetting resin as impregnant is a phenolic resin, a polyimide resin, or a curing-agent-containing epoxy resin, and the resin in the composition is a resin mixture of a resol-type phenolic resin and an epoxy resin.
Claim 24
Dependent Claim
35 words
A manufacturing method according to claim 14, wherein the resin in the composition is a phenolic resin and the composition further contains an additive capable of scavenging water formed during condensation of the phenolic resin.
Claim 25
Dependent Claim
12 words
A method according to claim 21, wherein the additive is calcined talc.
Claim 26
Dependent Claim
12 words
A method according to claim 21, wherein the additive is a lactone.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-06-13 | 1980-12-13 | 1981-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-06-13 | 1984-12-13 | 1985-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-06-13 | 1988-12-13 | 1989-06-14 | $7700.00 | Window Closed / Lapsed |