Patent US6129990A successfully refreshed from Google Patents.
US6129990A
Expired / Lapsed
US
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Copper/steel laminated sheet for use in manufacturing printed circuit boards
Assignee: R E Service Co Inc
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Filing: 1998-11-17
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Granted: 2000-10-10
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Expires: 2018-11-17
Abstract
Abstract A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.
Inventors
- 👤 Mark S. Frater
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 04:53
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K3/025; B; B32; B32B; B32B37/00; B32B37/14; B32B37/26; B32B2457/00; B32B2457/08; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12472; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/12917; Y10T428/12924; Y10T428/12993
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
59 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer, said substrate layer having a coefficient of thermal expansion less than approximately 9.8 μinches per °F. and a Knoop hardness between approximately 150 and approximately 850; and (b) at least one copper foil layer bonded to a surface of said substrate layer.
Claim 2
Dependent Claim
59 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer, said substrate layer having a coefficient of thermal expansion less than approximately 9.8 μinches per °F. and a Knoop hardness between approximately 150 and approximately 850; and (b) at least one copper foil layer bonded to a surface of said substrate layer.
Claim 3
Dependent Claim
22 words
A sheet laminate as recited in claim 1, wherein said substrate layer has a thickness between approximately 0.002 and approximately 0.025 inches.
Claim 4
Dependent Claim
22 words
A sheet laminate as recited in claim 1, wherein said substrate layer has a surface finish of less than approximately 12 RMS.
Claim 5
Dependent Claim
23 words
A sheet laminate as recited in claim 1, wherein said copper foil layer has a thickness between approximately 0.00025 and approximately 0.005 inches.
Claim 6
Dependent Claim
60 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer, said substrate layer having a coefficient of thermal expansion less than approximately 9.8 μinches per °F. and a surface finish of less than approximately 12 RMS; and (b) at least one foil layer of copper bonded to a surface of said substrate layer.
Claim 7
Dependent Claim
60 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer, said substrate layer having a coefficient of thermal expansion less than approximately 9.8 μinches per °F. and a surface finish of less than approximately 12 RMS; and (b) at least one foil layer of copper bonded to a surface of said substrate layer.
Claim 8
Dependent Claim
22 words
A sheet laminate as recited in claim 5, wherein said substrate layer has a thickness between approximately 0.002 and approximately 0.025 inches.
Claim 9
Dependent Claim
23 words
A sheet laminate as recited in claim 5, wherein said copper foil layer has a thickness between approximately 0.00025 and approximately 0.005 inches.
Claim 10
Dependent Claim
22 words
A sheet laminate as recited in claim 5, wherein said substrate layer has a Knoop hardness between approximately 150 and approximately 850.
Claim 11
Dependent Claim
82 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer which has a coefficient of thermal expansion less than approximately 9.8 μinches per °F., a Knoop hardness between approximately 150 and approximately 850, and a surface finish of less than approximately 12 RMS; and (b) at least one copper foil layer bonded to a surface of said substrate layer, wherein said copper foil layer has a thickness between approximately 0.00025 inches and approximately 0.005 inches.
Claim 12
Dependent Claim
82 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer which has a coefficient of thermal expansion less than approximately 9.8 μinches per °F., a Knoop hardness between approximately 150 and approximately 850, and a surface finish of less than approximately 12 RMS; and (b) at least one copper foil layer bonded to a surface of said substrate layer, wherein said copper foil layer has a thickness between approximately 0.00025 inches and approximately 0.005 inches.
Claim 13
Dependent Claim
85 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer which has a coefficient of thermal expansion less than approximately 9.8 μinches per °F., a Knoop hardness between approximately 150 and approximately 850, a surface finish of less than approximately 12 RMS, and a thickness between approximately 0.002 and approximately 0.025 inches; and (b) at least one copper foil layer having a thickness between approximately 0.00025 and approximately 0.005 inches bonded to a surface of said substrate layer.
Claim 14
Dependent Claim
85 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer which has a coefficient of thermal expansion less than approximately 9.8 μinches per °F., a Knoop hardness between approximately 150 and approximately 850, a surface finish of less than approximately 12 RMS, and a thickness between approximately 0.002 and approximately 0.025 inches; and (b) at least one copper foil layer having a thickness between approximately 0.00025 and approximately 0.005 inches bonded to a surface of said substrate layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-10-10 | 2004-04-10 | 2004-10-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-10-10 | 2008-04-10 | 2008-10-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-10-10 | 2012-04-10 | 2012-10-10 | $7700.00 | Window Closed / Lapsed |