EP0235582A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Bonded press pad
Assignee: HP Inc
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Filing: 1987-01-30
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Granted: —
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Expires: 2007-01-30
Abstract
Abstract A reusable bonded press pad (1) suitable for use in the lamination of multilayer, flexible printed circuit boards is provided. The bonded press pad (1) comprises three separate layers of material bonded together: a sheet of resilient material (33) having a sheet of a release film (31, 35) bonded to each side with a suitable adhesive. The bonded press pad (1) reduces the surface adhesion between the press pad (1) and the packaging materials and minimizes static discharge encountered when breaking up the laminate package (10).
Inventors
- 👤 Martin J. Marx
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 10:41
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; B; B30; B30B; B30B15/00; B30B15/06; B30B15/061; H05K2203/00; H05K2203/06; H05K2203/068
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
70 words
A bonded press pad (1) for use in the lamination of multilayered printed circuit boards and the like having two sheets (31,35) of a release film and a planar press pad (33) of a predetermined size and shape having two flat sides, characterized in that one of said two sheets (31,35) of release film is permanently bonded to each one of said two flat sides of said press pad (33).
Claim 2
Dependent Claim
70 words
A bonded press pad (1) for use in the lamination of multilayered printed circuit boards and the like having two sheets (31,35) of a release film and a planar press pad (33) of a predetermined size and shape having two flat sides, characterized in that one of said two sheets (31,35) of release film is permanently bonded to each one of said two flat sides of said press pad (33).
Claim 3
Dependent Claim
39 words
A bonded press pad (1) according to Claim 1, characterized in that said bonded press pad (1) includes a plurality of holes (3) through said press pad (33) and through said two sheets (31,35) of release film bonded thereto.
Claim 4
Independent Claim
168 words
A method of fabricating a bonded press pad (1) for use in the lamination of printed circuit boards and the like said method comprising the steps of cutting a planar press pad (33) to a first predetermined size and shape, said planar press pad (33) having two flat sides, cutting two sheets (31,35) of a release film to a second predetermined size and shape geometrically similar to said first predetermined size and shape, characterized by pre-shrinking said planar press pad (31) and said two sheets (31,35) of release film, applying an adhesive coating to one of said two sides of the pre-shrunk press pad (31), applying one of said two sheets (31,35) of pre-shrunk release film to the coated side of the pre-shrunk press pad (31), applying an adhesive coating to the other side of the pre-shrunk press pad (31), applying the other one of said two sheets (31,35) of pre-shrunk release film to the other coated side of the pre-shrunk press pad (31), and curing said adhesive.
Claim 5
Independent Claim
168 words
A method of fabricating a bonded press pad (1) for use in the lamination of printed circuit boards and the like said method comprising the steps of cutting a planar press pad (33) to a first predetermined size and shape, said planar press pad (33) having two flat sides, cutting two sheets (31,35) of a release film to a second predetermined size and shape geometrically similar to said first predetermined size and shape, characterized by pre-shrinking said planar press pad (31) and said two sheets (31,35) of release film, applying an adhesive coating to one of said two sides of the pre-shrunk press pad (31), applying one of said two sheets (31,35) of pre-shrunk release film to the coated side of the pre-shrunk press pad (31), applying an adhesive coating to the other side of the pre-shrunk press pad (31), applying the other one of said two sheets (31,35) of pre-shrunk release film to the other coated side of the pre-shrunk press pad (31), and curing said adhesive.
Claim 6
Dependent Claim
70 words
A method according to Claim 3 characterized in that said step of pre-shrinking said planar press pad (31) comprises baking said planar press pad (31) at a first predetermined temperature for a first predetermined period of time, and said step of pre-shrinking said two sheets (31,35) of release film comprises baking said two sheets (31,35) of release film at a second predetermined temperature for a second predetermined period of time.
Claim 7
Dependent Claim
23 words
A method according to Claim 3 or 4 characterized by punching a plurality of holes (3) through said cured bonded press pad (1).
References Cited (Backward Citations)
No citation records indexed.
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