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EP0411142A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Outer layer material of multilayer printed wiring board and production thereof

Assignee: Fanuc Corp
•
Filing: 1990-02-01
•
Granted: —
•
Expires: 2010-02-01
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Abstract

Abstract Two aluminum-copper foils are joined with their aluminum surfaces in contact for use as an outer layer material (20) of a multilayer printed wiring board. In producing this board, an outer layer material, a prepreg (2), an inner layer material (1), a prepreg (3) and an outer layer material (21) are built up in this order. Therefore, the aluminum portion of the outer layer material (20) works as a conventional mirror plate and a dummy plate. Further,the aluminum surfaces can be easily released from each other and work as conventional mold releasing films. The outer layer material (20) has aluminum surfaces tightly adhered to each other and does not permit resin scums or foreign matter to adhere thereto unlike that of the prior art, this structure further prevents scars or damage caused by impact from developing. Moreover,since no mirror plate is used, the operation steps can be simplified and the built- up operation can be easily and automatically carried out. It is also possible to use plastic metal foils of aluminum alloy, copper, brass, soft steel, lead alloy and the like instead of the aluminum foil.

Inventors

  • 👤 Katsuhiko Fujikake
  • 👤 Hidetaka 5-4-102 Sayamadaidanchi Miyama

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-08 13:41
CPC Classifications
B; B29; B29C; B29C43/00; B29C43/02; B29C43/18; B29C43/20; B29C43/203; H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K3/00; H05K3/02; H05K3/022; H05K3/025; H05K3/46; H05K3/4611; B29C43/32; B29C43/36; B29C43/3642; B29C2043/3657; B29K; B29K2105/00; B29K2105/06; B29K2105/08; B29K2105/0872; B29K2105/25; B29K2105/253; B29K2105/256; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/06; H05K2203/068; H05K2203/07; H05K2203/0703; H05K2203/0726; H05K2203/15; H05K2203/1536; H05K3/0097; H05K3/4644; H05K3/4652

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 61 words
An outer layer material for a multilayer printed wiring board, comprising first and second plastic-metal-copper foils each composed of copper and a plastic metal such as an aluminum alloy, copper, brass, soft iron, a lead alloy, or the like, said first and second plastic-metal foil sides being integrally joined together, with surfaces of the plastic metal being separable from each other.
Claim 2
Dependent Claim 61 words
An outer layer material for a multilayer printed wiring board, comprising first and second plastic-metal-copper foils each composed of copper and a plastic metal such as an aluminum alloy, copper, brass, soft iron, a lead alloy, or the like, said first and second plastic-metal foil sides being integrally joined together, with surfaces of the plastic metal being separable from each other.
Claim 3
Dependent Claim 38 words
An outer layer material according to claim 1, wherein said surfaces of the plastic metal are joined by an adhesive or under pressure with heat, with a bonding strength which weakens at a predetermined temperature, or spot welding.
Claim 4
Dependent Claim 90 words
A method of manufacturing a multilayer printed wiring board, comprising the steps of: stacking a first outer layer material according to claim 1, a first prepreg, an inner layer laminate having wiring patterns on both surfaces thereof, a second prepreg, and a second outer layer material according to claim 1, in the order named, thereby producing a stacked assembly; pressing the stacked assembly to laminate with heat; and separating said first and second outer layer materials along said surfaces of the plastic metal, thereby fabricating a multilayer printed wiring board.
Claim 5
Dependent Claim 197 words
A method of manufacturing a multilayer printed wiring board, comprising the steps of: stacking a first outer layer material according to claim 1, a first prepreg, a first inner layer laminate having wiring patterns on both surfaces thereof, a second prepreg, a second outer layer material according to claim 1, a third prepreg, a second inner layer laminate having wiring patterns on both surfaces thereof, a fourth prepreg, and a third outer layer material according to claim 1, in the order named, thereby producing a stacked assembly; pressing the stacked assembly to laminate with heat; separating said first, second, and third outer layer materials along said surfaces of the plastic metal; fabricating a multilayer printed wiring board as a first page, which is composed of a portion of said first outer layer material, said first prepreg, said first inner layer laminate, said second prepreg, and a portion of said second outer layer material; and fabricating a multilayer printed wiring board as a second layer page, which is composed of a portion of said second outer layer material, said third prepreg, said second inner layer laminate, said fourth prepreg, and a portion of said third outer layer material.

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