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US6129990A Expired / Lapsed US ⏱️ 0.0 years remaining

Copper/steel laminated sheet for use in manufacturing printed circuit boards

Assignee: R E Service Co Inc
•
Filing: 1998-11-17
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Granted: 2000-10-10
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Expires: 2018-11-17
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Abstract

Abstract A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.

Inventors

  • 👤 Mark S. Frater

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 02:05
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K3/025; B; B32; B32B; B32B37/00; B32B37/14; B32B37/26; B32B2457/00; B32B2457/08; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12472; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/12917; Y10T428/12924; Y10T428/12993

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 59 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer, said substrate layer having a coefficient of thermal expansion less than approximately 9.8 μinches per °F. and a Knoop hardness between approximately 150 and approximately 850; and (b) at least one copper foil layer bonded to a surface of said substrate layer.
Claim 2
Dependent Claim 59 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer, said substrate layer having a coefficient of thermal expansion less than approximately 9.8 μinches per °F. and a Knoop hardness between approximately 150 and approximately 850; and (b) at least one copper foil layer bonded to a surface of said substrate layer.
Claim 3
Dependent Claim 22 words
A sheet laminate as recited in claim 1, wherein said substrate layer has a thickness between approximately 0.002 and approximately 0.025 inches.
Claim 4
Dependent Claim 22 words
A sheet laminate as recited in claim 1, wherein said substrate layer has a surface finish of less than approximately 12 RMS.
Claim 5
Dependent Claim 23 words
A sheet laminate as recited in claim 1, wherein said copper foil layer has a thickness between approximately 0.00025 and approximately 0.005 inches.
Claim 6
Dependent Claim 60 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer, said substrate layer having a coefficient of thermal expansion less than approximately 9.8 μinches per °F. and a surface finish of less than approximately 12 RMS; and (b) at least one foil layer of copper bonded to a surface of said substrate layer.
Claim 7
Dependent Claim 60 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer, said substrate layer having a coefficient of thermal expansion less than approximately 9.8 μinches per °F. and a surface finish of less than approximately 12 RMS; and (b) at least one foil layer of copper bonded to a surface of said substrate layer.
Claim 8
Dependent Claim 22 words
A sheet laminate as recited in claim 5, wherein said substrate layer has a thickness between approximately 0.002 and approximately 0.025 inches.
Claim 9
Dependent Claim 23 words
A sheet laminate as recited in claim 5, wherein said copper foil layer has a thickness between approximately 0.00025 and approximately 0.005 inches.
Claim 10
Dependent Claim 22 words
A sheet laminate as recited in claim 5, wherein said substrate layer has a Knoop hardness between approximately 150 and approximately 850.
Claim 11
Dependent Claim 82 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer which has a coefficient of thermal expansion less than approximately 9.8 μinches per °F., a Knoop hardness between approximately 150 and approximately 850, and a surface finish of less than approximately 12 RMS; and (b) at least one copper foil layer bonded to a surface of said substrate layer, wherein said copper foil layer has a thickness between approximately 0.00025 inches and approximately 0.005 inches.
Claim 12
Dependent Claim 82 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer which has a coefficient of thermal expansion less than approximately 9.8 μinches per °F., a Knoop hardness between approximately 150 and approximately 850, and a surface finish of less than approximately 12 RMS; and (b) at least one copper foil layer bonded to a surface of said substrate layer, wherein said copper foil layer has a thickness between approximately 0.00025 inches and approximately 0.005 inches.
Claim 13
Dependent Claim 85 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer which has a coefficient of thermal expansion less than approximately 9.8 μinches per °F., a Knoop hardness between approximately 150 and approximately 850, a surface finish of less than approximately 12 RMS, and a thickness between approximately 0.002 and approximately 0.025 inches; and (b) at least one copper foil layer having a thickness between approximately 0.00025 and approximately 0.005 inches bonded to a surface of said substrate layer.
Claim 14
Dependent Claim 85 words
A sheet laminate for use in manufacturing printed circuit boards, comprising: (a) a carbon steel substrate layer which has a coefficient of thermal expansion less than approximately 9.8 μinches per °F., a Knoop hardness between approximately 150 and approximately 850, a surface finish of less than approximately 12 RMS, and a thickness between approximately 0.002 and approximately 0.025 inches; and (b) at least one copper foil layer having a thickness between approximately 0.00025 and approximately 0.005 inches bonded to a surface of said substrate layer.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-10-10 2004-04-10 2004-10-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-10-10 2008-04-10 2008-10-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-10-10 2012-04-10 2012-10-10 $7700.00 Window Closed / Lapsed

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