US6121576A — Method and process of contact to a heat softened …

Claim 1

Independent Claim 83 words

A method for making temporary contact between an array of conductive solder bumps on a semiconductor device and conductive contact sites on a surface of a first member, comprising: heating said solder bumps to a softening temperature T S below a melting temperature of said solder bumps; and contacting said conductive contact sites with said solder bumps of said semiconductor device after the heating thereof, said solder bumps contacting said conductive contact sites at a pressure less than substantially 22 grams-force per bump.

Claim 2

Independent Claim 83 words

A method for making temporary contact between an array of conductive solder bumps on a semiconductor device and conductive contact sites on a surface of a first member, comprising: heating said solder bumps to a softening temperature T S below a melting temperature of said solder bumps; and contacting said conductive contact sites with said solder bumps of said semiconductor device after the heating thereof, said solder bumps contacting said conductive contact sites at a pressure less than substantially 22 grams-force per bump.

Claim 3

Dependent Claim 44 words

The method of claim 1, wherein said melting temperature of said solder bumps is T degrees C higher than an ambient temperature T O , and wherein the softening temperature T S is about 0.5 T-0.95 T above the ambient temperature T O .

Claim 4

Dependent Claim 26 words

The method of claim 1, wherein the solder bumps are contacting said conductive contact sites at a pressure not substantially exceeding about 10 grams-force per bump.

Claim 5

Dependent Claim 24 words

The method of claim 1, wherein the solder bumps are contacting said conductive contact sites at a pressure of about 2-10 grams-force per bump.

Claim 6

Dependent Claim 25 words

The method of claim 1, wherein said semiconductor device having said solder bumps is directly heated by one of hot air convection and infrared radiation.

Claim 7

Dependent Claim 30 words

The method of claim 1, wherein said first member having conductive contact sites is directly heated by one of hot air convection, conduction from a heated object, and infrared radiation.

Claim 8

Dependent Claim 31 words

The method of claim 1, wherein said semiconductor device and said first member are placed in a temperature controlled oven for heating to the softening temperature T S and BGA attach.

Claim 9

Dependent Claim 26 words

The method of claim 1, wherein said semiconductor device is held in a chuck, and said chuck is heated for heat transfer to said semiconductor device.

Claim 10

Dependent Claim 32 words

The method of claim 1, wherein said first member is held in a chuck, and said chuck is heated for heat transfer to said first member to heat said conductive contact sites.

Claim 11

Dependent Claim 41 words

The method of claim 1, wherein said solder bumps of said semiconductor device are contacting said conductive contact sites of said first member and subsequently heated under compressive force to soften said solder bumps for connection to said conductive contact sites.

Claim 12

Dependent Claim 24 words

The method of claim 1, wherein said first member having conductive contact sites is heated by electrical resistance wires attached to said first member.

Claim 13

Dependent Claim 40 words

The method of claim 1, wherein said first member and a substrate are mounted on a mounting board having an integral heater, and said integral heater is controlled to heat said first member to said softening temperature T S .

Claim 14

Dependent Claim 34 words

The method of claim 1, wherein said solder bumps comprise Sn--Pb solder having a lead content of about 40 to about 98 percent, and said softening temperature T S comprises about 140-180 degrees C.

Claim 15

Dependent Claim 34 words

The method of claim 1, wherein said step of heating comprises predetermining a heating time X to heat said solder bumps to said softening temperature T S , and heating for said time X.

Claim 16

Dependent Claim 49 words

The method of claim 1, wherein said step of heating comprises initiating said heating step, measuring the temperature of one of an insert, a die, and a substrate being heated, and stopping said heating to limit the temperature of said solder balls to said softening temperature T S .

Claim 17

Independent Claim 70 words

A method for temporary engagement of an array of conductive solder bumps on a semiconductor device to conductive contact sites on a surface of a first member, comprising: heating said solder bumps to a softening temperature T S below a melting temperature of said solder bumps; and compressing said solder bumps on said semiconductor device to said conductive contact sites at a pressure less than substantially 22 grams-force per bump.

Claim 18

Independent Claim 70 words

A method for temporary engagement of an array of conductive solder bumps on a semiconductor device to conductive contact sites on a surface of a first member, comprising: heating said solder bumps to a softening temperature T S below a melting temperature of said solder bumps; and compressing said solder bumps on said semiconductor device to said conductive contact sites at a pressure less than substantially 22 grams-force per bump.

Claim 19

Dependent Claim 48 words

The method of claim 16, wherein said melting temperature of said solder bumps is T degrees C higher than an ambient temperature T O , and wherein the solder bumps are heated to a softening temperature T S of about 0.5 T-0.95 T above the ambient temperature To.

Claim 20

Dependent Claim 26 words

The method of claim 16, wherein the solder bumps are compressed to said conductive contact sites at a pressure not exceeding about 10 grams-force per bump.

Claim 21

Dependent Claim 25 words

The method of claim 16, wherein the solder bumps are compressed to said conductive contact sites at a pressure of about 2-10 grams-force per bump.

Claim 22

Dependent Claim 25 words

The method of claim 16, wherein said semiconductor device having said solder bumps is directly heated by one of hot air convection and infrared radiation.

Claim 23

Dependent Claim 30 words

The method of claim 16, wherein said first member having conductive contact sites is directly heated by one of hot air convection, conduction from a heated object, and infrared radiation.

Claim 24

Dependent Claim 31 words

The method of claim 16, wherein said semiconductor device and said first member are placed in a temperature controlled oven for heating to the softening temperature T S and BGA attach.

Claim 25

Dependent Claim 19 words

The method of claim 16, wherein said semiconductor device is held and heated for transfer to said semiconductor device.

Claim 26

Dependent Claim 26 words

The method of claim 16, wherein said first member is held and heated for heat transfer to said first member to heat said conductive contact sites.

Claim 27

Dependent Claim 42 words

The method of claim 16, wherein said solder bumps of said semiconductor device are compressed to said conductive contact sites of said first member and subsequently heated under compressive force to soften said solder bumps for connection to said conductive contact sites.

Claim 28

Dependent Claim 24 words

The method of claim 16, wherein said first member having conductive contact sites is heated by electrical resistance wires attached to said first member.

Claim 29

Dependent Claim 40 words

The method of claim 16, wherein said first member and a substrate are mounted on a mounting board having an integral heater, and said integral heater is controlled to heat said first member to said softening temperature T S .

Claim 30

Dependent Claim 34 words

The method of claim 16, wherein said solder bumps comprise Sn--Pb solder having a lead content of about 40 to about 98 percent, and said softening temperature T S comprises about 140-180 degrees C.

Claim 31

Dependent Claim 33 words

The method of claim 16, wherein said step of heating comprises predetermining a heating time X to heat said solder bumps to said softening temperature T S , and heating for time X.

Claim 32

Dependent Claim 49 words

The method of claim 16, wherein said step of heating comprising initiating said heating step, measuring the temperature of one of an insert, a die, and a substrate being heated, and stopping said heating to limit the temperature of said solder balls to said softening temperature T S .

Claim 33

Independent Claim 116 words

An apparatus for heating a ball grid array of solder balls while subjected to a compression force against conductive contact sites for temporary electrical contact, said apparatus comprising: a first member with a surface having an array of solder balls thereon; a second member with a surface having an array of conductive contact sites; apparatus for contacting said first member against said second member for electrical contact of said solder balls with corresponding conductive contact sites said first member contacting said second member at a pressure less than substantially 22 grams-force per bump; and heating apparatus for heating said solder balls and said corresponding conductive contact sites to a submelting solder softening temperature T S .

Claim 34

Independent Claim 116 words

An apparatus for heating a ball grid array of solder balls while subjected to a compression force against conductive contact sites for temporary electrical contact, said apparatus comprising: a first member with a surface having an array of solder balls thereon; a second member with a surface having an array of conductive contact sites; apparatus for contacting said first member against said second member for electrical contact of said solder balls with corresponding conductive contact sites said first member contacting said second member at a pressure less than substantially 22 grams-force per bump; and heating apparatus for heating said solder balls and said corresponding conductive contact sites to a submelting solder softening temperature T S .

Claim 35

Dependent Claim 16 words

The apparatus of claim 31, wherein each of said conductive contact sites comprises a flat surface.

Claim 36

Dependent Claim 23 words

The apparatus of claim 31, wherein each of said conductive contact sites comprises a recess for receiving a portion of a solder ball.

Claim 37

Dependent Claim 28 words

The apparatus of claim 31, wherein each of said conductive contact sites comprises a recess having at least one projection therein for deforming a solder ball inserted therein.

Claim 38

Independent Claim 168 words

An apparatus for electrically testing a semiconductor package having a ball grid array of solder balls on a surface thereof, said apparatus comprising: an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for electrical contact with said ball grid array, and a second surface; a substrate having a first surface and a second surface, said second surface of said insert bonded to said first surface of said substrate, a pattern of conductive leads on said substrate for connection to contact leads in a socket; electrical leads connecting said conductive contact sites of said insert with said conductive leads of said substrate; a test board having said socket with said contact leads to a testing circuit, wherein said substrate and bonded insert are insertable into said socket for electrical contact of said conductive leads of said substrate with said contact leads of said socket; and heating apparatus associated with one of said substrate, said insert and said socket.

Claim 39

Independent Claim 168 words

An apparatus for electrically testing a semiconductor package having a ball grid array of solder balls on a surface thereof, said apparatus comprising: an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for electrical contact with said ball grid array, and a second surface; a substrate having a first surface and a second surface, said second surface of said insert bonded to said first surface of said substrate, a pattern of conductive leads on said substrate for connection to contact leads in a socket; electrical leads connecting said conductive contact sites of said insert with said conductive leads of said substrate; a test board having said socket with said contact leads to a testing circuit, wherein said substrate and bonded insert are insertable into said socket for electrical contact of said conductive leads of said substrate with said contact leads of said socket; and heating apparatus associated with one of said substrate, said insert and said socket.

Claim 40

Dependent Claim 17 words

The apparatus of claim 35, further comprising: power supply leads providing electrical power to said heating apparatus.

Claim 41

Dependent Claim 21 words

The apparatus of claim 36, wherein said heating apparatus, power supply leads and conductive leads are simultaneously formed on said substrate.

Claim 42

Dependent Claim 12 words

The apparatus of claim 35, wherein said heating apparatus comprises resistance conductors.

Claim 43

Dependent Claim 17 words

The apparatus of claim 35, further comprising switch apparatus for turning said heating apparatus on and off.

Claim 44

Dependent Claim 20 words

The apparatus of claim 35, further comprising temperature sensing apparatus attached to one of said substrate, insert, and semiconductor package.

Claim 45

Dependent Claim 22 words

The apparatus of claim 40, further comprising a temperature controller receiving signals from said temperature sensing apparatus and controlling said heating apparatus.

Claim 46

Dependent Claim 14 words

The apparatus of claim 40, wherein said temperature sensing apparatus comprises a thermocouple junction.

Claim 47

Dependent Claim 27 words

The apparatus of claim 35, wherein said heating apparatus includes a conductive layer of metal deposited on one of said first and second surfaces of said substrate.

Claim 48

Independent Claim 121 words

An apparatus for temporarily electrically connecting solder balls of a solder ball array on a first member to corresponding contact sites on a second member, said second member attached to a third member, said apparatus comprising: a board having a socket thereon for accepting said first, second, and third members, said board having at least two through-holes extending therethrough; an electrical resistance heating conductor mounted on an underside of said third member; a spring-loaded pogo pin mounted to project a pin portion upwardly through each of said through-holes to contact said third member; and power leads connecting said pogo pins electrically to a power supply for heating said first, second and third members including said solder balls and corresponding contact sites.

Claim 49

Independent Claim 121 words

An apparatus for temporarily electrically connecting solder balls of a solder ball array on a first member to corresponding contact sites on a second member, said second member attached to a third member, said apparatus comprising: a board having a socket thereon for accepting said first, second, and third members, said board having at least two through-holes extending therethrough; an electrical resistance heating conductor mounted on an underside of said third member; a spring-loaded pogo pin mounted to project a pin portion upwardly through each of said through-holes to contact said third member; and power leads connecting said pogo pins electrically to a power supply for heating said first, second and third members including said solder balls and corresponding contact sites.

Claim 50

Dependent Claim 26 words

The apparatus of claim 44, further comprising a temperature sensor mounted within said first, second and third members and conductively connected to a temperature measuring circuit.

Claim 51

Independent Claim 117 words

An apparatus for heating a ball grid array of solder balls while subjected to a compression force against conductive contact sites for temporary electrical contact, said apparatus comprising: a first member with a surface having an array of solder balls thereon; a second member with a surface having an array of conductive contact sites; apparatus for compressing said first member against said second member for electrical contact of said solder balls with corresponding conductive contact sites, said first member compressed against said second member at a pressure less than substantially 22 grams-force per ball; and heating apparatus for heating said solder balls and said corresponding conductive contact sites to a submelting solder softening temperature T S .

Claim 52

Independent Claim 117 words

An apparatus for heating a ball grid array of solder balls while subjected to a compression force against conductive contact sites for temporary electrical contact, said apparatus comprising: a first member with a surface having an array of solder balls thereon; a second member with a surface having an array of conductive contact sites; apparatus for compressing said first member against said second member for electrical contact of said solder balls with corresponding conductive contact sites, said first member compressed against said second member at a pressure less than substantially 22 grams-force per ball; and heating apparatus for heating said solder balls and said corresponding conductive contact sites to a submelting solder softening temperature T S .

Claim 53

Dependent Claim 16 words

The apparatus of claim 46, wherein each of said conductive contact sites comprises a flat surface.

Claim 54

Dependent Claim 23 words

The apparatus of claim 46, wherein each of said conductive contact sites comprises an indentation for receiving a portion of a solder ball.

Claim 55

Dependent Claim 29 words

The apparatus of claim 46, wherein each of said conductive contact sites comprises an indentation having at least one projection extending thereinto for puncturing a solder ball inserted therein.

Claim 56

Independent Claim 178 words

An apparatus for electrically testing a semiconductor package having a ball grid array of solder balls on a surface thereof, said apparatus comprising: an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for electrical contact with said ball grid array, and a second surface; a substrate having a first surface and a second surface, said second surface of said insert bonded to said first surface of said substrate, a pattern of conductive leads on said substrate for connection to contact leads in a socket; electrical leads connecting said conductive contact sites of said insert with said conductive leads of said substrate; a test board having said socket with said contact leads to a testing circuit, wherein said substrate and bonded insert are insertable into said socket for electrical contact of said conductive leads of said substrate with said contact leads of said socket; heating apparatus associated with one of said substrate, said insert and said socket; and power supply leads providing electrical power to said heating apparatus.

Claim 57

Independent Claim 178 words

An apparatus for electrically testing a semiconductor package having a ball grid array of solder balls on a surface thereof, said apparatus comprising: an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for electrical contact with said ball grid array, and a second surface; a substrate having a first surface and a second surface, said second surface of said insert bonded to said first surface of said substrate, a pattern of conductive leads on said substrate for connection to contact leads in a socket; electrical leads connecting said conductive contact sites of said insert with said conductive leads of said substrate; a test board having said socket with said contact leads to a testing circuit, wherein said substrate and bonded insert are insertable into said socket for electrical contact of said conductive leads of said substrate with said contact leads of said socket; heating apparatus associated with one of said substrate, said insert and said socket; and power supply leads providing electrical power to said heating apparatus.

Claim 58

Dependent Claim 12 words

The apparatus of claim 50, wherein said heating apparatus comprises resistance conductors.

Claim 59

Dependent Claim 17 words

The apparatus of claim 50, further comprising switch apparatus for turning said heating apparatus on and off.

Claim 60

Dependent Claim 20 words

The apparatus of claim 50, further comprising temperature sensing apparatus attached to one of said substrate, insert, and semiconductor package.

Claim 61

Dependent Claim 22 words

The apparatus of claim 53, further comprising a temperature controller receiving signals from said temperature sensing apparatus and controlling said heating apparatus.

Claim 62

Dependent Claim 14 words

The apparatus of claim 53, wherein said temperature sensing apparatus comprises a thermocouple junction.

Claim 63

Dependent Claim 27 words

The apparatus of claim 50, wherein said heating apparatus includes a conductive layer of metal deposited on one of said first and second surfaces of said substrate.

Claim 64

Dependent Claim 20 words

The apparatus of claim 50, wherein said heating apparatus, power supply leads and conductive leads are formed on said substrate.

Claim 65

Independent Claim 146 words

An apparatus for temporarily electrically connecting solder balls of a solder ball array on a first member to corresponding contact sites on a second member, said second member attached to a third member, said apparatus comprising: a board having a socket thereon for accepting said first, second, and third members, said board having at least two through-holes extending therethrough and having first and second through-hole axes generally perpendicular to said board; an electrical resistance heating conductor mounted on an underside of said third member, said conductor having junctions positioned to intercept said first and second through-hole axes; a spring-loaded pogo pin mounted to project a pin portion upwardly through each of said through-holes to contact said third member; and power leads connecting said pogo pins electrically to a power supply for heating said first, second and third members including said solder balls and corresponding contact sites.

Claim 66

Independent Claim 146 words

An apparatus for temporarily electrically connecting solder balls of a solder ball array on a first member to corresponding contact sites on a second member, said second member attached to a third member, said apparatus comprising: a board having a socket thereon for accepting said first, second, and third members, said board having at least two through-holes extending therethrough and having first and second through-hole axes generally perpendicular to said board; an electrical resistance heating conductor mounted on an underside of said third member, said conductor having junctions positioned to intercept said first and second through-hole axes; a spring-loaded pogo pin mounted to project a pin portion upwardly through each of said through-holes to contact said third member; and power leads connecting said pogo pins electrically to a power supply for heating said first, second and third members including said solder balls and corresponding contact sites.

Claim 67

Dependent Claim 26 words

The apparatus of claim 58, further comprising a temperature sensor mounted within said first, second and third members and conductively connected to a temperature measuring circuit.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2003-09-19	2004-03-20	2004-09-19	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2007-09-19	2008-03-20	2008-09-19	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2011-09-19	2012-03-20	2012-09-19	$7700.00	Window Closed / Lapsed

Method and process of contact to a heat softened solder ball array

Abstract

Inventors

Bibliographic Details

Claims Analysis

References Cited (Backward Citations)

USPTO Annuity & Maintenance Windows

Assigned Categories & Tags

Assign Category Tag