Patent US6104089A successfully refreshed from Google Patents.
US6104089A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked leads-over chip multi-chip module
Assignee: Round Rock Research LLC
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Filing: 1999-09-16
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Granted: 2000-08-15
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Expires: 2019-09-16
Abstract
Abstract A multi-chip module (MCM) and method of manufacturing is disclosed that provides for attachment of semiconductor dice to both sides of the MCM printed circuit board (PCB). Semiconductor dice attached to the top surface of the PCB may be attached by conventional wire bonding, TAB or flip chip methods whereas those semiconductor dice attached to the bottom surface of the PCB are wire bonded or TAB connected to the top surface through openings in the PCB. The openings provide a lead-over-chip (LOC) arrangement for those semiconductor dice attached to the bottom surface resulting in shortened wire bonds. The bottom surface of the PCB may be provided with die recesses into which the openings extend, to receive the dice and bring their active surfaces even closer to the top surface of the PCB for wire bonding.
Inventors
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:16
CPC Classifications
H; H10; H10W; H10W99/00; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W90/00; H10W70/682; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/075; H10W72/20; H10W72/29; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W74/15; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T408/00; Y10T408/55; Y10T408/563; Y10T408/5635
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
133 words
A multi-chip module, comprising: a carrier substrate including at least one opening therethrough having a periphery and having a surface with first and second conductive areas thereon, said first conductive area located proximate said at least one opening; a first semiconductor die including at least one bond pad, said first semiconductor die secured to another surface of said carrier substrate with said at least one bond pad exposed through said at least one opening; at least one conductive element coupled between said first conductive area and said at least one bond pad, said at least one conductive element extending through said at least one opening and spaced apart from said periphery; and a second semiconductor die with at least one bond pad disposed adjacent said surface and communicating with said second conductive area.
Claim 2
Dependent Claim
133 words
A multi-chip module, comprising: a carrier substrate including at least one opening therethrough having a periphery and having a surface with first and second conductive areas thereon, said first conductive area located proximate said at least one opening; a first semiconductor die including at least one bond pad, said first semiconductor die secured to another surface of said carrier substrate with said at least one bond pad exposed through said at least one opening; at least one conductive element coupled between said first conductive area and said at least one bond pad, said at least one conductive element extending through said at least one opening and spaced apart from said periphery; and a second semiconductor die with at least one bond pad disposed adjacent said surface and communicating with said second conductive area.
Claim 3
Dependent Claim
20 words
The multi-chip module of claim 1, wherein said first semiconductor die is partially disposed over said at least one opening.
Claim 4
Dependent Claim
19 words
The multi-chip module of claim 1, wherein said second semiconductor die is laterally adjacent said at least one opening.
Claim 5
Dependent Claim
17 words
The multi-chip module of claim 1, wherein said at least one conductive element comprises a TAB connection.
Claim 6
Dependent Claim
17 words
The multi-chip module of claim 1, wherein said at least one conductive element comprises a wire bond.
Claim 7
Dependent Claim
26 words
The multi-chip module of claim 1, wherein said at least one bond pad of said second semiconductor die is flip-chip bonded to said second conductive area.
Claim 8
Dependent Claim
21 words
The multi-chip module of claim 1, wherein said first conductive area overlies at least a portion of said first semiconductor die.
Claim 9
Dependent Claim
24 words
The multi-chip module of claim 7, wherein said at least one conductive element is selected from the group comprising bond wires and TAB connections.
Claim 10
Dependent Claim
40 words
The multi-chip module of claim 1, wherein said another surface defines at least one recess sized and shaped to receive at least a portion of said first semiconductor die and said first semiconductor die is disposed at least partially therein.
Claim 11
Dependent Claim
20 words
The multi-chip module of claim 9, wherein said first semiconductor die is disposed completely in said at least one recess.
Claim 12
Dependent Claim
19 words
The multi-chip module of claim 10, further comprising a lid disposed at least partially over said first semiconductor die.
Claim 13
Dependent Claim
20 words
The multi-chip module of claim 1, further including an adhesive bond between said first semiconductor die and said carrier substrate.
Claim 14
Dependent Claim
31 words
The multi-chip module of claim 1, wherein at least one of said first and second conductive areas is in electrical communication with an edge-connect at a periphery of said carrier substrate.
Claim 15
Dependent Claim
16 words
The multi-chip module of claim 1, wherein said at least one opening comprises an elongated opening.
Claim 16
Dependent Claim
20 words
The multi-chip module of claim 1, wherein said at least one opening comprises a plurality of elongated, mutually parallel openings.
Claim 17
Dependent Claim
26 words
The multi-chip module of claim 14, further including at least one other elongated opening oriented in non-parallel relationship to said plurality of elongated, mutually parallel openings.
Claim 18
Dependent Claim
26 words
The multi-chip module of claim 15, further including at least one other elongated opening oriented in non-parallel relationship to said plurality of elongated mutually parallel openings.
Claim 19
Dependent Claim
22 words
The multi-chip module of claim 1, wherein said second semiconductor die is positioned at least partially over said at least one opening.
Claim 20
Dependent Claim
20 words
The multi-chip module of claim 1, further including an underfill compound disposed between said second semiconductor die and said surface.
Claim 21
Dependent Claim
20 words
The multi-chip module of claim 19, wherein said underfill compound extends at least partially into said at least one opening.
Claim 22
Dependent Claim
19 words
The multi-chip module of claim 19, wherein said underfill compound substantially envelops said at least one intermediate conductive element.
Claim 23
Dependent Claim
28 words
The multi-chip module of claim 1, further comprising a wall protruding from and disposed proximate at least a portion of a perimeter of a portion of said surface.
Claim 24
Dependent Claim
21 words
The multi-chip module of claim 22, further comprising a lid disposed over said surface and spaced apart therefrom by said wall.
Claim 25
Dependent Claim
24 words
The multi-chip module of claim 23, wherein at least a portion of said lid contacts at least a portion of said second semiconductor die.
Claim 26
Dependent Claim
29 words
The multi-chip module of claim 1, further comprising a wall protruding from and disposed proximate at least a portion of a perimeter of a portion of said another surface.
Claim 27
Dependent Claim
21 words
The multi-chip module of claim 25, further comprising a lid disposed over said surface and spaced apart therefrom by said wall.
Claim 28
Dependent Claim
24 words
The multi-chip module of claim 26, wherein at least a portion of said lid contacts at least a portion of said first semiconductor die.
Claim 29
Dependent Claim
21 words
The multi-chip module of claim 1, further comprising an encapsulant disposed over at least a portion of said first semiconductor die.
Claim 30
Dependent Claim
21 words
The multi-chip module of claim 1, further comprising an encapsulant disposed over at least a portion of said second semiconductor die.
Claim 31
Dependent Claim
127 words
A semiconductor die assembly, comprising: a carrier substrate with a plurality of slots therethrough and a plurality of conductors on a first side thereof, proximate said plurality of slots, said conductors in electrical communication with at least one conductive element transversely projecting from said first side of said carrier substrate for electrically connecting said carrier substrate to a higher-level package; at least one semiconductor die secured to said carrier substrate adjacent a second side thereof and having at least one bond pad exposed through at least a corresponding slot of said plurality of slots; and at least one conductive element in communication with said at least one bond pad, extending through at least one slot of said plurality of slots and spaced apart from a periphery thereof.
Claim 32
Dependent Claim
127 words
A semiconductor die assembly, comprising: a carrier substrate with a plurality of slots therethrough and a plurality of conductors on a first side thereof, proximate said plurality of slots, said conductors in electrical communication with at least one conductive element transversely projecting from said first side of said carrier substrate for electrically connecting said carrier substrate to a higher-level package; at least one semiconductor die secured to said carrier substrate adjacent a second side thereof and having at least one bond pad exposed through at least a corresponding slot of said plurality of slots; and at least one conductive element in communication with said at least one bond pad, extending through at least one slot of said plurality of slots and spaced apart from a periphery thereof.
Claim 33
Dependent Claim
17 words
The semiconductor die assembly of claim 30, further including at least one recess in said second side.
Claim 34
Dependent Claim
24 words
The semiconductor die assembly of claim 31, wherein said at least one recess communicates with at least one slot of said plurality of slots.
Claim 35
Dependent Claim
28 words
The semiconductor die assembly of claim 31, wherein said at least one recess is configured to receive at least a portion of said at least one semiconductor die.
Claim 36
Dependent Claim
22 words
The multi-chip module of claim 33, wherein said at least one semiconductor die is disposed completely in said at least one recess.
Claim 37
Dependent Claim
21 words
The multi-chip module of claim 34, further comprising a lid disposed at least partially over said at least one semiconductor die.
Claim 38
Dependent Claim
29 words
The multi-chip module of claim 30, further comprising a wall protruding from and disposed proximate at least a portion of a perimeter of a portion of said first side.
Claim 39
Dependent Claim
22 words
The multi-chip module of claim 36, further comprising a lid disposed over said second side and spaced apart therefrom by said wall.
Claim 40
Dependent Claim
26 words
The multi-chip module of claim 37, wherein at least a portion of said lid contacts at least a portion of said at least one semiconductor die.
Claim 41
Dependent Claim
23 words
The multi-chip module of claim 30, further comprising an encapsulant disposed over at least a portion of said at least one semiconductor die.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-08-15 | 2004-02-14 | 2004-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-08-15 | 2008-02-14 | 2008-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-08-15 | 2012-02-14 | 2012-08-15 | $7700.00 | Window Closed / Lapsed |