Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate

Claim 1

A semiconductor multi-package module comprising: a first printed circuit (PC) board material substrate having a plurality of conductive paths including bonding pads and a plurality of electrical edge connectors along one edge of the first PC board material substrate; a plurality of semiconductor dice directly mounted to the first PC board material substrate, the plurality of semiconductor dice being electrically connected to the bonding pads of the plurality of conductive paths by a plurality of wire bonds; an encapsulating material overmolding the plurality of semiconductor dice including at least the plurality of wire bonds on the first PC board material substrate, wherein the encapsulating material is dispensed directly on and adheres to the PC board material substrate to form an individualized package body for each of the plurality of semiconductor dice; and a second PC board material substrate having a plurality of conductive paths and a semiconductor die mounted, electrically coupled, and encapsulated thereon, the first PC board material substrate further having a plurality of through-hole vias and backside metallization, wherein the second PC board material substrate is physically and electrically connected to the first PC board material substrate by a plurality of solder joints connecting the plurality of conductive paths of the second PC board material substrate with the backside metallization of the first PC board material substrate.