US5480840A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-chip module with multiple compartments
Assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
•
Filing: 1994-08-18
•
Granted: 1996-01-02
•
Expires: 2014-08-18
Abstract
Abstract The present invention provides a multi-chip module having multiple compartments. Circuitry is arranged on a substrate in such a manner that circuit components requiring specific operating environments are located in discrete areas dedicated to accommodate the circuit components. A cover, having multiple chambers that align with the discrete areas on the substrate, is secured to the substrate to define the multiple compartments. The compartments are separated by material that effectively isolates the compartments relative to one another.
Inventors
- 👤 Lawrence C. Barnes
- 👤 Gary R. Thornberg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 14:29
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H10; H10W; H10W90/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49137
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
38 words
A method of making a multi-chip module, including the step of arranging the components within the module in such a manner that circuit components requiring specific thermal environments are located in discrete areas dedicated to accommodate the components.
Claim 2
Independent Claim
38 words
A method of making a multi-chip module, including the step of arranging the components within the module in such a manner that circuit components requiring specific thermal environments are located in discrete areas dedicated to accommodate the components.
Claim 3
Independent Claim
71 words
A method for heating specific components on a multichip module, the steps comprising: arranging the components within the module in such a manner that said specific components requiring heating are located in a discrete area within said module; enclosing said specific components within a cover, thereby forming a chamber including said specific components and thermally isolating said specific components from the other components within said multichip module; and heating said chamber.
Claim 4
Independent Claim
71 words
A method for heating specific components on a multichip module, the steps comprising: arranging the components within the module in such a manner that said specific components requiring heating are located in a discrete area within said module; enclosing said specific components within a cover, thereby forming a chamber including said specific components and thermally isolating said specific components from the other components within said multichip module; and heating said chamber.
Claim 5
Independent Claim
71 words
A method for cooling specific components on a multichip module, the steps comprising: arranging the components within the module in such a manner that said specific components requiring cooling are located in a discrete area within said module; enclosing said specific components within a cover, thereby forming a chamber including said specific components and thermally isolating said specific components from the other components within said multichip module; and cooling said chamber.
Claim 6
Independent Claim
71 words
A method for cooling specific components on a multichip module, the steps comprising: arranging the components within the module in such a manner that said specific components requiring cooling are located in a discrete area within said module; enclosing said specific components within a cover, thereby forming a chamber including said specific components and thermally isolating said specific components from the other components within said multichip module; and cooling said chamber.
References Cited (Backward Citations)
US4370515A
Cited
US4569000A
Cited
US4658334A
Cited
US4739453A
Cited
US4717990A
Cited
US4974317A
Cited
US5243218A
Cited
US5303121A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-01-01 | 1999-07-03 | 2000-01-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-01-01 | 2003-07-03 | 2004-01-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-01-01 | 2007-07-03 | 2008-01-02 | $7700.00 | Window Closed / Lapsed |