Patent US6090702A successfully refreshed from Google Patents.
US6090702A
Expired / Lapsed
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Embedded electroconductive layer and method for formation thereof
Assignee: Fujitsu Semiconductor Ltd
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Filing: 1997-10-29
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Granted: 2000-07-18
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Expires: 2017-10-29
Abstract
Abstract An embedded electroconductive layer is disclosed which comprises an opening part or a depressed part 3 formed in an insulating film 2 on a substrate 1, a barrier layer for covering the opening part or the depressed part, a metal growth promoting layer 5 on the barrier layer, and an electroconductive layer 6 embedded in the opening part or the depressed part via the barrier layer 4 and the metal growth promoting layer 5.
Inventors
- 👤 Shigeru Okamoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:15
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/06; C23C14/0641; C23C14/58; C23C14/5846; C23C14/5853; C23C16/00; C23C16/06; C23C16/18; C23C16/22; C23C16/30; C23C16/34; H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/032; H10W20/033; H10W20/047; H10W20/048; H10W20/052; H10W20/0526; H10W20/054; H10W20/056; H10W20/40; H10W20/41; H10W20/42; H10W20/425
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
150 words
A method for the formation of an embedded electroconductive layer, comprising the steps of: forming an interlayer insulating layer for covering a lower interconnection layer having a first barrier layer as the uppermost layer; forming an opening part in said interlayer insulating layer on said lower interconnection layer; forming a second barrier layer for covering said opening part; etching said second barrier layer thereby removing a surface layer of said second barrier layer so as to result in an appearance of a new surface of said second barrier layer containing oxygen at a lower concentration than said removed layer; growing an electroconductive layer on and in contact with said new surface of said second barrier layer by a chemical vapor deposition method using a metallic precursor thereby embedding said electroconductive layer in said opening part; and forming a third barrier layer of an upper interconnection layer on said electroconductive layer.
Claim 2
Independent Claim
150 words
A method for the formation of an embedded electroconductive layer, comprising the steps of: forming an interlayer insulating layer for covering a lower interconnection layer having a first barrier layer as the uppermost layer; forming an opening part in said interlayer insulating layer on said lower interconnection layer; forming a second barrier layer for covering said opening part; etching said second barrier layer thereby removing a surface layer of said second barrier layer so as to result in an appearance of a new surface of said second barrier layer containing oxygen at a lower concentration than said removed layer; growing an electroconductive layer on and in contact with said new surface of said second barrier layer by a chemical vapor deposition method using a metallic precursor thereby embedding said electroconductive layer in said opening part; and forming a third barrier layer of an upper interconnection layer on said electroconductive layer.
Claim 3
Dependent Claim
35 words
The method according to claim 1, wherein the etching gas used on said second barrier layer is one member selected from the group consisting of ClF 3 , NF 3 , and BCl 3 .
Claim 4
Dependent Claim
15 words
The method according to claim 1, wherein said precursor is a metal complex of Cu.
Claim 5
Dependent Claim
15 words
The method according to claim 1, wherein said precursor is a metal compound of Al.
Claim 6
Dependent Claim
24 words
The method according to claim 1, wherein said precursor is a mixture of a metal complex of Cu with a metal compound of Al.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-18 | 2004-01-17 | 2004-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-18 | 2008-01-17 | 2008-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-18 | 2012-01-17 | 2012-07-18 | $7700.00 | Window Closed / Lapsed |