US5889320A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tape application platform and processes therefor
Assignee: Individual
•
Filing: 1997-04-21
•
Granted: 1999-03-30
•
Expires: 2017-04-21
Abstract
Abstract A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry. The platform base may have conductive areas (90) on one or both sides to provide a shield or bus connected by wire bonds. Conductive bus elements (60 and 70) may be attached with tape (80). The platform may have terminals (100) for interconnection with higher level of circuitry and/or narrow leads (1220) extending over the IC. The platform base is preferably made from epoxy-glass laminate with conductive layers of a clad composite with preferred resistivity and preferred thermal expansion. Platform bases may be composite metal, stamped in a continuous strip, with platform segments excised during assembly. Another embodiment provides a lead paddle assembly in which two tape application platforms hold an IC in a rigid assembly.
Inventors
- 👤 Douglas Wallace Phelps, Jr.
- 👤 Edward John Dombroski
- 👤 William Carroll Ward
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:06
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/40; H10W70/411; H10W70/415; H10W70/464; H10W70/468; H10W72/00; H10W72/30; H10W72/50; H10W72/90; H10W90/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/381; H10W72/541; H10W72/5445; H10W72/547; H10W72/5473; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W74/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
212 words
A tape application platform for holding and interconnecting at least one integrated circuit chip having at least one row of interconnection pads, said tape application platform comprising: a) a base having first and second base sides, and having at least one slot communicating with both of said first and second base sides, said integrated circuit chip being disposed parallel to one of said first and second base sides to substantially cover said at least one slot, with said at least one row of interconnection pads being aligned with said at least one slot, said slot being co-extensive with said integrated circuit chip along at least a first direction; b) electrically-insulating tape having first and second tape sides, and having adhesive on at least one of said first and second tape sides, said tape being disposed between said base and said integrated circuit chip, and said tape being adherent to at least one of said integrated circuit chip and said base for holding said integrated circuit chip in fixed relation to said base; and c) at least one wire passing through said slot and bonded to at least one interconnection pad of said at least one row of interconnection pads of said integrated circuit chip, thereby providing interconnection of said integrated circuit chip.
Claim 2
Dependent Claim
212 words
A tape application platform for holding and interconnecting at least one integrated circuit chip having at least one row of interconnection pads, said tape application platform comprising: a) a base having first and second base sides, and having at least one slot communicating with both of said first and second base sides, said integrated circuit chip being disposed parallel to one of said first and second base sides to substantially cover said at least one slot, with said at least one row of interconnection pads being aligned with said at least one slot, said slot being co-extensive with said integrated circuit chip along at least a first direction; b) electrically-insulating tape having first and second tape sides, and having adhesive on at least one of said first and second tape sides, said tape being disposed between said base and said integrated circuit chip, and said tape being adherent to at least one of said integrated circuit chip and said base for holding said integrated circuit chip in fixed relation to said base; and c) at least one wire passing through said slot and bonded to at least one interconnection pad of said at least one row of interconnection pads of said integrated circuit chip, thereby providing interconnection of said integrated circuit chip.
Claim 3
Dependent Claim
41 words
A tape application platform as in claim 1, wherein said base has at least one recess of sufficient size to accommodate said chip on at least one of said first and second base sides, said recess including within it said slot.
Claim 4
Dependent Claim
25 words
A tape application platform as in claim 1, wherein said base has one or more of said slots for each chip to be held thereon.
Claim 5
Dependent Claim
23 words
A tape application platform as in claim 3, wherein said base has two of said slots for each chip to be held thereon.
Claim 6
Dependent Claim
23 words
A tape application platform as in claim 3, wherein said base has three of said slots for each chip to be held thereon.
Claim 7
Dependent Claim
28 words
A tape application platform as in claim 1, wherein said base has at least one electrically-conductive surface on at least one of said first and second base sides.
Claim 8
Dependent Claim
18 words
A tape application platform as in claim 6, wherein said electrically-conductive surface comprises two or more metal layers.
Claim 9
Dependent Claim
16 words
A tape application platform as in claim 7, wherein said electrically-conductive surface comprises three metal layers.
Claim 10
Dependent Claim
40 words
A tape application platform as in claim 7, wherein said metal layers comprise metals combined in proportions such that their composite thermal expansion coefficient is compatible with the thermal expansion coefficient of the integrated circuit chip to be held thereon.
Claim 11
Dependent Claim
37 words
A tape application platform as in claim 7, wherein said metal layers comprise metals combined in proportions such that their composite thermal expansion coefficient is compatible with the thermal expansion coefficient of silicon, germanium or gallium arsenide.
Claim 12
Dependent Claim
41 words
A tape application platform as in claim 7, wherein said metal layers comprise metals combined in proportions such that their composite thermal expansion coefficient is between 5 parts per million per degree Celsius and 15 parts per million per degree Celsius.
Claim 13
Dependent Claim
17 words
A tape application platform as in claim 7, wherein said metal layers comprise copper and Invar alloy.
Claim 14
Dependent Claim
22 words
A tape application platform as in claim 8, wherein at least two of said three metal layers comprise copper and Invar alloy.
Claim 15
Dependent Claim
26 words
A tape application platform as in claim 8, wherein said three metal layers comprise a first copper layer, an Invar layer, and a second copper layer.
Claim 16
Dependent Claim
15 words
A tape application platform as in claim 1, wherein said base comprises a metal material.
Claim 17
Dependent Claim
17 words
A tape application platform as in claim 15, wherein said base comprises Invar alloy or stainless steel.
Claim 18
Dependent Claim
19 words
A tape application platform as in claim 15, wherein said base comprises copper, silver, copper alloy, or silver alloy.
Claim 19
Dependent Claim
32 words
A tape application platform as in claim 6, wherein said base comprises Invar alloy, molybdenum, copper-tungsten, copper-iron alloy or stainless steel, and said conductive surfaces comprise copper, silver, or a noble metal.
Claim 20
Dependent Claim
32 words
A tape application platform as in claim 6, wherein said slot has a longer and a shorter dimension, and said conductive surface is substantially co-extensive with said slot along said longer dimension.
Claim 21
Dependent Claim
19 words
A tape application platform as in claim 6, wherein said electrically-conductive surface comprises two or more disjoint conductive surfaces.
Claim 22
Dependent Claim
20 words
A tape application platform as in claim 20, wherein one of said disjoint conductive surfaces is connected to ground potential.
Claim 23
Dependent Claim
24 words
A tape application platform as in claim 20, wherein one of said disjoint conductive surfaces is connected to a potential other than ground potential.
Claim 24
Dependent Claim
25 words
A tape application platform as in claim 1, wherein said base carries printed circuitry on at least one of said first and second base sides.
Claim 25
Dependent Claim
17 words
A tape application platform as in claim 1, wherein said base comprises glass-epoxy material or polyimide material.
Claim 26
Dependent Claim
17 words
A tape application platform as in claim 6, wherein said base comprises glass-epoxy material or polyimide material.
Claim 27
Dependent Claim
21 words
A tape application platform as in claim 1, wherein said base comprises a multiplicity of insulating layers separated by conductive layers.
Claim 28
Dependent Claim
21 words
A tape application platform as in claim 6, wherein said base comprises a multiplicity of insulating layers separated by conductive layers.
Claim 29
Dependent Claim
31 words
A tape application platform as in claim 24, wherein said glass-epoxy or polyimide material comprises a multiplicity of glass-epoxy or polyimide layers separated by layers of copper patterned as printed circuitry.
Claim 30
Dependent Claim
26 words
A tape application platform as in claim 13, wherein said base comprises a multiplicity of glass-epoxy layers separated by layers of copper patterned as printed circuitry.
Claim 31
Dependent Claim
34 words
A tape application platform as in claim 13, wherein said base comprises a multiplicity of glass-epoxy layers separated by conductive layers patterned as printed circuitry, each said conductive layer comprising two or more sub-layers.
Claim 32
Dependent Claim
36 words
A tape application platform as in claim 14, wherein said base comprises a multiplicity of glass-epoxy layers separated by conductive layers patterned as printed circuitry, each said conductive layer further comprising copper, Invar, and copper sub-layers.
Claim 33
Dependent Claim
20 words
A tape application platform as in claim 23, wherein said printed circuitry is adapted to carry and interconnect discrete components.
Claim 34
Dependent Claim
16 words
A tape application platform as in claim 32, wherein said discrete components comprise capacitors and resistors.
Claim 35
Dependent Claim
132 words
A memory card, comprising: a) a printed circuit card carrying printed conductors; b) a multiplicity of connectors connected to said printed conductors; and c) a multiplicity of integrated circuit chip platforms mating with said connectors, each of said platforms further comprising: i) a base having first and second base sides, having at least one slot communicating with both of said first and second base sides; ii) an electrically conductive surface layer on at least one of said first and second base sides; iii) tape having first and second tape sides, and having adhesive on at least one of said first and second tape sides adherent to at least one of said chip and said base, and iv) at least one wire passing through said slot and bonded to said integrated circuit chip.
Claim 36
Dependent Claim
132 words
A memory card, comprising: a) a printed circuit card carrying printed conductors; b) a multiplicity of connectors connected to said printed conductors; and c) a multiplicity of integrated circuit chip platforms mating with said connectors, each of said platforms further comprising: i) a base having first and second base sides, having at least one slot communicating with both of said first and second base sides; ii) an electrically conductive surface layer on at least one of said first and second base sides; iii) tape having first and second tape sides, and having adhesive on at least one of said first and second tape sides adherent to at least one of said chip and said base, and iv) at least one wire passing through said slot and bonded to said integrated circuit chip.
Claim 37
Dependent Claim
152 words
A shielding preform for attaching and interconnecting an integrated circuit chip to a circuit card using wire bonds, comprising: a) a base having first and second major base surfaces, at least one of said first and second major base surfaces comprising an electrically conductive surface, and having a base slot communicating between said major base surfaces, b) a first tape having adhesive on both major first tape surfaces, adhering to and substantially covering said first major base surfaces, thereby allowing attachment of said base to said integrated circuit chip, and c) a second tape having adhesive on both major second tape surfaces, adhering to a portion of said second major base surface, except for a portion adjacent to said slot, thereby allowing attachment to said circuit card, whereby wire bonds may be made through said base slot to interconnect among said circuit card, said electrically conductive surface, and said integrated circuit chip.
Claim 38
Dependent Claim
152 words
A shielding preform for attaching and interconnecting an integrated circuit chip to a circuit card using wire bonds, comprising: a) a base having first and second major base surfaces, at least one of said first and second major base surfaces comprising an electrically conductive surface, and having a base slot communicating between said major base surfaces, b) a first tape having adhesive on both major first tape surfaces, adhering to and substantially covering said first major base surfaces, thereby allowing attachment of said base to said integrated circuit chip, and c) a second tape having adhesive on both major second tape surfaces, adhering to a portion of said second major base surface, except for a portion adjacent to said slot, thereby allowing attachment to said circuit card, whereby wire bonds may be made through said base slot to interconnect among said circuit card, said electrically conductive surface, and said integrated circuit chip.
Claim 39
Dependent Claim
131 words
An integrated circuit lead paddle assembly for holding and handling an integrated circuit chip having edges, a back side and an active side with bonding pads, comprising: a) a platform base, attached to said back side of said integrated circuit chip, and having base portions extending beyond said edges of said chip, said portions carrying double-sided first tape, b) a lead frame attached to said base portions with said double-sided first tape, and having a multiplicity of lead fingers, positioned adjacent to said bonding pads, and c) insulating second tape portions between said active side of said chip and said lead fingers, but not adhering to said chip, thereby insulating said chip from said lead frame and from wires used to interconnect said lead frame fingers to said wire bond pads.
Claim 40
Dependent Claim
131 words
An integrated circuit lead paddle assembly for holding and handling an integrated circuit chip having edges, a back side and an active side with bonding pads, comprising: a) a platform base, attached to said back side of said integrated circuit chip, and having base portions extending beyond said edges of said chip, said portions carrying double-sided first tape, b) a lead frame attached to said base portions with said double-sided first tape, and having a multiplicity of lead fingers, positioned adjacent to said bonding pads, and c) insulating second tape portions between said active side of said chip and said lead fingers, but not adhering to said chip, thereby insulating said chip from said lead frame and from wires used to interconnect said lead frame fingers to said wire bond pads.
Claim 41
Dependent Claim
25 words
An integrated circuit lead paddle assembly as in claim 36, wherein said insulating second tape portions comprise a layer of adhesive or double-sided adhesive tape.
Claim 42
Dependent Claim
43 words
An integrated circuit lead paddle assembly as in claim 36, further comprising one or more conductive members adhering to said insulating second tape portions and insulated from said chip and from said lead frame, thereby providing bus interconnections when wire-bonded to said chip.
Claim 43
Dependent Claim
25 words
An integrated circuit lead paddle assembly as in claim 37, wherein said insulating second tape portions comprise a layer of adhesive or double-sided adhesive tape.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-29 | 2002-09-28 | 2003-03-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-29 | 2006-09-28 | 2007-03-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-29 | 2010-09-28 | 2011-03-30 | $7700.00 | Window Closed / Lapsed |