Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die

Claim 1

An electromechanical assembly of integrated circuit die, comprising: a plurality of independent subassemblies each of which consists of just one of said die having its backside attached directly to a single plate of a single type of material and a plurality of posts which extend perpendicular from said plate around said one die; a substrate having a plurality of spaced apart holes each of which is only slightly larger than a single die and having several smaller bores around each of said holes; said subassemblies being arranged such that each die lies in a respective hole and the posts of each subassembly are fitted into the bores around said respective holes; said plate of each subassembly having a single thermal expansion coefficient which is essentially the same as the expansion coefficient of said die and substantially different than the expansion coefficient of said substrate; said posts in each subassembly being spaced by a distance which is no more than slightly larger than a single die; and said substrate having conductors which are connected by discrete bonding wires to the frontside of said die to carry signals thereto, and having another conductor connected to a respective post on each subassembly to carry a bias voltage to the backside of said die.