US5382830A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor module with multi-plane conductive path
Assignee: Individual
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Filing: 1991-12-18
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Granted: 1995-01-17
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Expires: 2011-12-18
Abstract
Abstract For the manufacture of a power semiconductor module, one proceeds from a ceramic base board on which copper plates and copper conductor paths are fastened by a suitable method. The ceramic base plate is then scratched and broken. As a result, ceramic side boards are produced which are connected to the base board via conductive paths. The side boards are then swung up, as a result of which the conductive paths fastened on the side boards come into a plane above the base plane. By means of suitable, possibly multiple, breaking and folding of the side boards and suitable development of the ends of the conductive paths, the connecting poles of the power semiconductor chips can be directly contacted. Electronic circuits can be arranged on the side boards.
Inventors
- 👤 Altan Akyurek
- 👤 Peter Maier
- 👤 Jurgen Schulz-Harder
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:01
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0277; H05K1/0278; H10; H10W; H10W90/00; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09009; H05K2201/0909; H05K2203/00; H05K2203/30; H05K2203/302; H05K3/00; H05K3/0058; H05K3/0067
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
125 words
A semiconductor module comprising: a base board; a contact plate supported on the base board; a semiconductor chip fastened to the contact plate on the base board; a side board disposed at an angle relative to the base board and being separated therefrom by a space located between the side board and the base board; and a conductor located on the base board and the side board for defining a conductive path, the conductive path being connected with the semiconductor chip, the conductor extending from the base board, across the space to the side board, the space between the base board and the side board having a predetermined size so as to maintain a predetermined dielectric strength between the base board and the side board.
Claim 2
Dependent Claim
125 words
A semiconductor module comprising: a base board; a contact plate supported on the base board; a semiconductor chip fastened to the contact plate on the base board; a side board disposed at an angle relative to the base board and being separated therefrom by a space located between the side board and the base board; and a conductor located on the base board and the side board for defining a conductive path, the conductive path being connected with the semiconductor chip, the conductor extending from the base board, across the space to the side board, the space between the base board and the side board having a predetermined size so as to maintain a predetermined dielectric strength between the base board and the side board.
Claim 3
Dependent Claim
21 words
The semiconductor module of claim 1, wherein the base board and the side board are both formed of a ceramic material.
Claim 4
Dependent Claim
20 words
The semiconductor module of claim 1, wherein the base board is disposed to be approximately perpendicular to the side board.
Claim 5
Dependent Claim
34 words
The semiconductor module of claim 1, wherein the base board and the side board had been of one piece which was separated to define the space between the base board and the side board.
Claim 6
Dependent Claim
30 words
The semiconductor module of claim 1, wherein the semiconductor chip has a connection pole and the conductor has a part that directly contacts the connection pole of the semiconductor chip.
Claim 7
Dependent Claim
26 words
The semiconductor module of claim 5, wherein the conductor has an end that is not connected to either of the base board and the side board.
Claim 8
Dependent Claim
36 words
The semiconductor module of claim 1, wherein the conductor has a boundary region between the base board and the side board at which the conductor is not connected to the base board and the side board.
Claim 9
Dependent Claim
32 words
The semiconductor module of claim 7, further comprising a separating mask between the conductive path and at least one of the base board and the side board generally at the boundary region.
Claim 10
Dependent Claim
27 words
The semiconductor module of claim 7, wherein the conductor includes a preformed bridge shape which spans the boundary region between the base board and the side board.
Claim 11
Dependent Claim
34 words
The semiconductor module of claim 1, further comprising an electronic control unit on the side board and connected with the conductor on the side board and with the contact plate on the base board.
Claim 12
Dependent Claim
29 words
The semiconductor module of claim 1, wherein the contact plate and the conductors are comprised of materials selected from the group consisting of copper and copper with cuprous oxide.
Claim 13
Dependent Claim
28 words
The module of claim 1, wherein the base board and the side board are comprised of materials selected from the group consisting of aluminum oxide and beryllium oxide.
Claim 14
Dependent Claim
28 words
The semiconductor module of claim 12, wherein the contact plate and the conductor are connected to the base board and to the side board by a metal-gas eutectic.
Claim 15
Dependent Claim
23 words
The semiconductor module of claim 1, wherein the conductor is fixedly connected to the base and to the sideboard and supports the sideboard.
Claim 16
Dependent Claim
140 words
A semiconductor module comprising: a base board; a contact plate supported on the base board; a semiconductor chip fastened to the contact plate on the base board; a side board disposed at an angle relative to the base board and being separated therefrom by a space located between the side board and the base board; and a conductor located on the base board and the side board for defining a conductive path, the conductive path being connected with the semiconductor chip, the conductor extending from the base board, across the space to the side board, the space between the base board and the side board having a predetermined size so as to maintain a predetermined dielectric strength between the base board and the side board; wherein the base board and the side board are both formed of a ceramic material.
Claim 17
Dependent Claim
140 words
A semiconductor module comprising: a base board; a contact plate supported on the base board; a semiconductor chip fastened to the contact plate on the base board; a side board disposed at an angle relative to the base board and being separated therefrom by a space located between the side board and the base board; and a conductor located on the base board and the side board for defining a conductive path, the conductive path being connected with the semiconductor chip, the conductor extending from the base board, across the space to the side board, the space between the base board and the side board having a predetermined size so as to maintain a predetermined dielectric strength between the base board and the side board; wherein the base board and the side board are both formed of a ceramic material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-16 | 1998-07-18 | 1999-01-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-16 | 2002-07-18 | 2003-01-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-16 | 2006-07-18 | 2007-01-17 | $7700.00 | Window Closed / Lapsed |