Plastic encapsulated integrated circuit package with electrostatic shield

Claim 2

An integrated circuit package comprising: (a) an integrated circuit chip, said chip having a plurality of pins including a ground pin, (b) a thin conductive metal base having upper and lower surfaces, said chip being adhered to said upper surface of said base, (c) a plurality of leads connected to respective ones of said pins and extending laterally outwardly from said chip beyond said base, each lead having a lower surface, (d) each lead having an inner finger formed of the same material as said base, said finger being spaced from said base by a gap, and a connecting member connecting said pins to said fingers, (e) an electrostatic shield directly adhered to the bottom of said base by an adhering material, said shield having a portion extending laterally outwardly beyond said base and extending beneath at least a portion of said leads and underlying a portion of said fingers for attenuating the electromagnetic field between said leads to reduce crosstalk between said leads, said portion having an upper surface which is located in a plane below that of said lower surfaces of said leads, (f) means electrically connecting said shield to said ground pin of said chip, (g) said means electrically connecting said shield to said ground pin comprising a conductive member formed integrally with said base and extending laterally therefrom, and a conductive strip connecting said conductive member to one of said fingers, said one finger being connected to said ground pin of said chip, said conductive member being integral with said conductive strip and said one lead finger, said adhering material being electrically conductive so that said shield is electrically connected to said base; (h) and a plastic layer completely enveloping said chip, said base, said shield, and those portions of said leads adjacent said chip, to fully encapsulate the same.

Claim 3

A device according to claim 1 wherein said conductive member has an outer section located in the same plane as that of said fingers and an angled inner section connecting said outer section to said base to dispose the lower surface of said base in a plane below that of the lower surfaces of said fingers, said shield being substantially flat.

Claim 4

A device according to claim 1 wherein said lead fingers are formed as part of a lead frame having a pair of side bars and a plurality of said bases between said side bars, said conductive member extending laterally on both sides of said base between said side bars and constituting a support for said base before said device is removed from said lead frame.

Claim 5

A device according to claim 1 wherein said lead fingers are formed as part of a lead frame having a pair of side bars and a plurality of said bases between said side bars, said conductive member extending laterally on both sides of said base between said side bars and constituting a support for said base before said device is removed from said lead frame.

Claim 6

A device according to claim 1 wherein said shield is formed from material having the same thermal coefficient of expansion as said base.

Claim 7

An integrated circuit package comprising: (a) an integrated circuit chip, said chip having a plurality of pins including a ground pin, (b) a base having upper and lower surfaces, said chip being adhered to said upper surface of said base, (c) a plurality of leads connected to respective ones of said pins and extending laterally outwardly from said chip beyond said base, each lead having a lower surface, (d) an electrostatic shield adhered to the bottom of said base, said shield having a portion extending laterally outwardly beyond said base and extending beneath at least a portion of said leads for attenuating the electromagnetic field between said leads to reduce crosstalk between said leads, said portion having an upper surface which is located in a plane below that of said lower surfaces of said leads, (e) means electrically connecting said shield to said ground pin of said chip, (f) and a plastic layer enveloping said chip, said base, said shield, and those portions of said leads adjacent said chip, to encapsulate the same; (g) each lead having an inner finger formed of the same material as said base, said finger being spaced from said base by a gap, and a connecting member connecting said pins to said fingers, said portion of electrostatic shield extending laterally beyond said connecting members and underlying a portion of said fingers; (h) said means electrically connecting said shield to said ground pin comprising a conductive member formed integrally with said base and extending laterally therefrom, and a conductive strip connecting said conductive member to one of said fingers, said one finger being connected to said ground pin of said chip, said shield being electrically connected to said base; and (i) said conductive member being flat and disposing said base in the same plane as said fingers, said shield being of downwardly dished configuration having a centre portion fixed to said base and a downwardly extending rim, said portion of said shield being constituted by a flange projecting outwardly from said rim.

Claim 8

An integrated circuit package comprising: (a) an integrated circuit chip, said chip having a plurality of pins including a ground pin, (b) a base having upper and lower surfaces, said chip being adhered to said upper surface of said base, (c) a plurality of leads connected to respective ones of said pins and extending laterally outwardly from said chip beyond said base, each lead having a lower surface, (d) an electrostatic shield adhered to the bottom of said base, said shield having a portion extending laterally outwardly beyond said base and extending beneath at least a portion of said leads for attenuating the electromagnetic field between said leads to reduce crosstalk between said leads, said portion having an upper surface which is located in a plane below that of said lower surfaces of said leads, (e) means electrically connecting said shield to said ground pin of said chip, (f) and a plastic layer enveloping said chip, said base, said shield, and those portions of said leads adjacent said chip, to encapsulate the same; (g) each lead having an inner finger formed of the same material as said base, said finger being spaced from said base by a gap, and a connecting member connecting said pins to said fingers, said portion of electrostatic shield extending laterally beyond said connecting members and underlying a portion of said fingers; (h) said means electrically connecting said shield to said ground pin comprising a conductive member formed integrally with said base and extending laterally therefrom, and a conductive strip connecting said conductive member to one of said fingers, said one finger being connected to said ground pin of said chip, said shield being electrically connected to said base; and (i) said conductive member being flat and disposing said base in the same plane as said fingers, said shield being of downwardly dished configuration having a centre portion fixed to said base and a downwardly extending rim, said portion of said shield being constituted by a flange projecting outwardly from said rim.