High-frequency wireless communication system on a single ultrathin silicon on sapphire chip

Claim 2

In combination: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said silicon layer is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said silicon layer which exposes said silicon layer to a non-oxidizing ambient environment; and a logic component fabricated in said silicon layer wherein said logic component is selected from the group including a NAND gate, a NOR gate and a transmission gate.

Claim 3

The combination defined in claim 1 wherein said insulating substrate comprises sapphire.

Claim 4

The combination defined in claim 1 wherein said layer of silicon has an areal density of electrically active states which is less than approximately 5×10 11 cm -2 .

Claim 5

The combination defined in claim 1 wherein said logic component selected from the group including a NAND gate, a NOR gate and a transmission gate further comprises P-channel transistors and N-channel transistors fabricated in said layer of silicon formed on said insulating substrate.

Claim 6

The combination defined in claim 4 wherein said logic component comprises CMOS FET transistors.

Claim 7

An electronic memory comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said layer of silicon is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; a first N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a first P-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a second N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a second P-channel transistor fabricated in said layer of silicon formed on said insulating substrate, wherein said first N-channel transistor, said first P-channel transistor, said second N-channel transistor and said second P-channel transistor are interconnected to form a cross coupled inverter; and a transmission gate electrically connected to said cross coupled inverter wherein said transmission gate comprises either one of a third P-channel transistor or a third N-channel transistor fabricated in said layer of silicon formed on said insulating substrate.

Claim 8

An electronic memory comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said layer of silicon is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; a first N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a first P-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a second N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a second P-channel transistor fabricated in said layer of silicon formed on said insulating substrate, wherein said first N-channel transistor, said first P-channel transistor, said second N-channel transistor and said second P-channel transistor are interconnected to form a cross coupled inverter; and a transmission gate electrically connected to said cross coupled inverter wherein said transmission gate comprises either one of a third P-channel transistor or a third N-channel transistor fabricated in said layer of silicon formed on said insulating substrate.

Claim 9

A microelectronic circuit comprising: an electrically insulating substrate; a semiconductive silicon layer that is formed on the substrate and has a thickness of less than approximately 110 nanometers and an areal density of electrically active states less than approximately 5×10 11 cm -2 achieved by controlling the temperature of said semiconductive silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said semiconductive silicon layer which exposes said semiconductive silicon layer to a non-oxidizing ambient environment; and a field effect transistor formed in the semiconductive silicon layer.

Claim 10

A microelectronic circuit comprising: an electrically insulating substrate; a semiconductive silicon layer that is formed on the substrate and has a thickness of less than approximately 110 nanometers and an areal density of electrically active states less than approximately 5×10 11 cm -2 achieved by controlling the temperature of said semiconductive silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said semiconductive silicon layer which exposes said semiconductive silicon layer to a non-oxidizing ambient environment; and a field effect transistor formed in the semiconductive silicon layer.

Claim 11

A circuit as in claim 7 in which the electrically insulating substrate comprises sapphire.

Claim 12

A circuit as in claim 7 in which the field effect transistor has a gate length of less than approximately 0.8 micrometers.

Claim 13

An electronic memory circuit comprising: an electrically insulating substrate; a semiconductive silicon layer that is formed on the substrate and has a thickness of less than approximately 110 nanometers and an areal density of electrically active states less than approximately 5×10 11 cm -2 achieved by controlling the temperature of said semiconductive silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said semiconductive silicon layer which exposes said semiconductive silicon layer to a non-oxidizing ambient environment; a first N-channel transistor fabricated in said semiconductive silicon layer formed on said insulating substrate; a first P-channel transistor fabricated in said semiconductive silicon layer formed on said insulating substrate; a second N-channel transistor fabricated in said semiconductive silicon layer formed on said insulating substrate; and a second P-channel transistor fabricated in said semiconductive silicon layer formed on said insulating substrate, wherein said first N-channel transistor, said first P-channel transistor, said second N-channel transistor and said second P-channel transistor are interconnected to form a flip-flop circuit element.

Claim 14

An electronic memory circuit comprising: an electrically insulating substrate; a semiconductive silicon layer that is formed on the substrate and has a thickness of less than approximately 110 nanometers and an areal density of electrically active states less than approximately 5×10 11 cm -2 achieved by controlling the temperature of said semiconductive silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said semiconductive silicon layer which exposes said semiconductive silicon layer to a non-oxidizing ambient environment; a first N-channel transistor fabricated in said semiconductive silicon layer formed on said insulating substrate; a first P-channel transistor fabricated in said semiconductive silicon layer formed on said insulating substrate; a second N-channel transistor fabricated in said semiconductive silicon layer formed on said insulating substrate; and a second P-channel transistor fabricated in said semiconductive silicon layer formed on said insulating substrate, wherein said first N-channel transistor, said first P-channel transistor, said second N-channel transistor and said second P-channel transistor are interconnected to form a flip-flop circuit element.

Claim 15

A circuit as in claim 10 in which the memory element further comprises a transmission gate electrically connected to said flip-flop circuit element wherein said transmission gate comprises either one of a third P-channel transistor or a third N-channel transistor fabricated in said semiconductive silicon layer formed on said insulating substrate.

Claim 16

A MOS device comprising: an insulating substrate; a silicon layer formed on said insulating substrate wherein said silicon layer is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said silicon layer which exposes said silicon layer to a non-oxidizing ambient environment; a source region formed in said silicon layer; a drain region formed in said silicon layer; a channel region formed in said silicon layer between said source region and said drain region; and a gate positioned adjacent said channel region.

Claim 17

A MOS device comprising: an insulating substrate; a silicon layer formed on said insulating substrate wherein said silicon layer is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said silicon layer which exposes said silicon layer to a non-oxidizing ambient environment; a source region formed in said silicon layer; a drain region formed in said silicon layer; a channel region formed in said silicon layer between said source region and said drain region; and a gate positioned adjacent said channel region.

Claim 18

A MOS device as defined in claim 12 wherein said insulating substrate comprises sapphire.

Claim 19

A MOS device as defined in claim 12 wherein said silicon layer has an areal density of electrically active states which is less than approximately 5×10 11 cm -2 .

Claim 20

A MOS device as defined in claim 12 wherein said channel has a length of less than approximately 0.8 μm.

Claim 21

A MOS device as defined in claim 12 wherein said source region and said drain region overlap said gate by less than approximately 0.06 μm.

Claim 22

A NAND gate comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said layer of silicon is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; first and second P-channel transistors fabricated in said layer of silicon formed on said insulating substrate wherein said first and second P-channel transistors have widths of less than approximately 1.3 μm and lengths of less than approximately 0.7 μm; a first N-channel transistor fabricated in said layer of silicon formed on said insulating substrate wherein said first N-channel transistor has a width of less than approximately 0.9 μm and a length of less than approximately 0.8 μm; and a second N-channel transistor fabricated in said layer of silicon formed on said insulating substrate wherein said second N-channel transistor has a width of less than approximately 1.0 μm and a length of less than approximately 0.8 μm.

Claim 23

A NAND gate comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said layer of silicon is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; first and second P-channel transistors fabricated in said layer of silicon formed on said insulating substrate wherein said first and second P-channel transistors have widths of less than approximately 1.3 μm and lengths of less than approximately 0.7 μm; a first N-channel transistor fabricated in said layer of silicon formed on said insulating substrate wherein said first N-channel transistor has a width of less than approximately 0.9 μm and a length of less than approximately 0.8 μm; and a second N-channel transistor fabricated in said layer of silicon formed on said insulating substrate wherein said second N-channel transistor has a width of less than approximately 1.0 μm and a length of less than approximately 0.8 μm.

Claim 24

A NOR gate comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said layer of silicon is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; first and second PMOS transistors fabricated in said layer of silicon formed on said insulating substrate wherein said first and second PMOS transistors have widths of less than approximately 1.5 μm and lengths of less than approximately 0.7 μm; and first and second NMOS transistors fabricated in said layer of silicon formed on said insulating substrate wherein said first and second NMOS transistors have widths of less than approximately 1.0 μm and lengths of less than approximately 0.8 μm.

Claim 25

A NOR gate comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said layer of silicon is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; first and second PMOS transistors fabricated in said layer of silicon formed on said insulating substrate wherein said first and second PMOS transistors have widths of less than approximately 1.5 μm and lengths of less than approximately 0.7 μm; and first and second NMOS transistors fabricated in said layer of silicon formed on said insulating substrate wherein said first and second NMOS transistors have widths of less than approximately 1.0 μm and lengths of less than approximately 0.8 μm.

Claim 26

A logic component comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said silicon layer is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; a first N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a first P-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a second N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; and a second P-channel transistor fabricated in said layer of silicon formed on said insulating substrate, wherein said first N-channel transistor, said first P-channel transistor, said second N-channel transistor and said second P-channel transistor are interconnected to form a flip-flop element.

Claim 27

A logic component comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said silicon layer is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; a first N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a first P-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a second N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; and a second P-channel transistor fabricated in said layer of silicon formed on said insulating substrate, wherein said first N-channel transistor, said first P-channel transistor, said second N-channel transistor and said second P-channel transistor are interconnected to form a flip-flop element.

Claim 28

A logic component as defined in claim 19 further comprising a transmission gate electrically connected to said flip-flop element wherein said transmission gate comprises either one of a third P-channel transistor or a third N-channel transistor fabricated in said layer of silicon formed on said insulating substrate.

Claim 29

A logic component comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said silicon layer is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; a first N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a first resistor fabricated in said layer of silicon formed on said insulating substrate; a second N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; and a second resistor fabricated in said layer of silicon formed on said insulating substrate, wherein said first N-channel transistor, said first resistor, said second N-channel transistor and said second resistor are interconnected to form a flip-flop element.

Claim 30

A logic component comprising: an insulating substrate; a layer of silicon formed on said insulating substrate wherein said silicon layer is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said layer of silicon to temperatures of less than or equal to approximately 950° C. during any processing of said layer of silicon which exposes said layer of silicon to a non-oxidizing ambient environment; a first N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; a first resistor fabricated in said layer of silicon formed on said insulating substrate; a second N-channel transistor fabricated in said layer of silicon formed on said insulating substrate; and a second resistor fabricated in said layer of silicon formed on said insulating substrate, wherein said first N-channel transistor, said first resistor, said second N-channel transistor and said second resistor are interconnected to form a flip-flop element.

Claim 31

A logic component as defined in claim 21 further comprising a transmission gate electrically connected to said flip-flop element wherein said transmission gate comprises either one of a first P-channel transistor or a third N-channel transistor fabricated in said layer of silicon formed on said insulating substrate.

Claim 32

A MOS device comprising: an insulating substrate; a silicon layer formed on said sapphire substrate wherein said silicon layer is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said silicon layer which exposes said silicon layer to a non-oxidizing ambient environment; a source region formed in said silicon layer, wherein a voltage V S is applied to said source region; a drain region formed in said silicon layer, wherein a voltage V D is applied to said drain region; a channel region formed in said silicon layer between said source region and said drain region; and a gate positioned adjacent said channel region, wherein a voltage V G is applied to said source region to control current flowing between said source and said drain, I DS .

Claim 33

A MOS device comprising: an insulating substrate; a silicon layer formed on said sapphire substrate wherein said silicon layer is less than approximately 1000 Å thick and is substantially free of electrically active states achieved by controlling the temperature of said silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said silicon layer which exposes said silicon layer to a non-oxidizing ambient environment; a source region formed in said silicon layer, wherein a voltage V S is applied to said source region; a drain region formed in said silicon layer, wherein a voltage V D is applied to said drain region; a channel region formed in said silicon layer between said source region and said drain region; and a gate positioned adjacent said channel region, wherein a voltage V G is applied to said source region to control current flowing between said source and said drain, I DS .

Claim 34

A MOS device as defined in claim 23 wherein said current flowing through said channel from said source to said drain, I DS , is a linear function of the voltage difference between said source and said drain, V D -V S =V DS .

Claim 35

A MOS device as defined in claim 23 wherein said channel is fully depleted.

Claim 36

A digital electronic circuit comprising: an electrically insulating substrate; a semiconductive silicon layer that is formed on the substrate and has a thickness of less than approximately 110 nanometers and an areal density of electrically active states less than approximately 5×10 11 cm -2 achieved by controlling the temperature of said semiconductive silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said semiconductive silicon layer which exposes said semiconductive silicon layer to a non-oxidizing ambient environment; and a digital field effect transistor element that is formed in the semiconductive silicon layer and includes: an N-type source; an N-type drain; and a P-type channel having a gate length of less than approximately 0.8 micrometers, negligible source-body effect and a mobility higher than approximately 180 cm/volt-second; and a gate formed over the channel.

Claim 37

A digital electronic circuit comprising: an electrically insulating substrate; a semiconductive silicon layer that is formed on the substrate and has a thickness of less than approximately 110 nanometers and an areal density of electrically active states less than approximately 5×10 11 cm -2 achieved by controlling the temperature of said semiconductive silicon layer to temperatures of less than or equal to approximately 950° C. during any processing of said semiconductive silicon layer which exposes said semiconductive silicon layer to a non-oxidizing ambient environment; and a digital field effect transistor element that is formed in the semiconductive silicon layer and includes: an N-type source; an N-type drain; and a P-type channel having a gate length of less than approximately 0.8 micrometers, negligible source-body effect and a mobility higher than approximately 180 cm/volt-second; and a gate formed over the channel.