Method of forming closely pitched polysilicon fuses

Claim 1

A method of forming a semiconductor device comprising the steps of: forming a polysilicon fuse on a top surface of a substrate in an area having a periphery; depositing a first dielectric material on top of both the fuse and the substrate; removing the first dielectric material in barrier areas positioned on either side of the fuse and in a first ring shaped area near said periphery; filling both the barrier areas and the first ring shaped area with a first tungsten fill; depositing a second dielectric material on top of the first dielectric material and the first tungsten fill; removing the second dielectric material from above the first ring shaped area to expose the first tungsten fill, thereby forming a second ring; filling the second ring with a second tungsten fill; depositing a final passivation layer on top of the second dielectric material and the second tungsten fill; depositing a polyimide layer on top of the final passivation layer; removing the polyimide, final passivation layer, and a portion of the second dielectric material over the polysilicon fuse and the second ring; and etching the second tungsten fill and the first tungsten fill in said first ring shaped area to form a crack stop.

Claim 2

A method of forming a semiconductor device comprising the steps of: forming a polysilicon fuse on a top surface of a substrate in an area having a periphery; depositing a first dielectric material on top of both the fuse and the substrate; removing the first dielectric material in barrier areas positioned on either side of the fuse and in a first ring shaped area near said periphery; filling both the barrier areas and the first ring shaped area with a first tungsten fill; depositing a second dielectric material on top of the first dielectric material and the first tungsten fill; removing the second dielectric material from above the first ring shaped area to expose the first tungsten fill, thereby forming a second ring; filling the second ring with a second tungsten fill; depositing a final passivation layer on top of the second dielectric material and the second tungsten fill; depositing a polyimide layer on top of the final passivation layer; removing the polyimide, final passivation layer, and a portion of the second dielectric material over the polysilicon fuse and the second ring; and etching the second tungsten fill and the first tungsten fill in said first ring shaped area to form a crack stop.

Claim 4

A method for producing closely pitched polysilicon fuses in a semiconductor device comprising the steps of: forming an array of closely pitched polysilicon fuses on a top surface of a semiconductor substrate on which a semiconductor device is formed having a periphery; depositing a phosphorous silicate glass layer on top of both the fuses and the top surface of the substrate; removing the phosphorous silicate glass layer in barrier areas positioned intermediate fuses in the array of polysilicon fuses and in a first ring shaped area near the periphery of the semiconductor device; filling both the barrier areas and the first ring shaped area with a first tungsten fill; depositing an interlevel dielectric layer on top of the phosphorous silicate glass layer and the first tungsten fill; removing the interlevel dielectric layer from above the first ring shaped area to expose the first tungsten fill, thereby forming a second ring; filling the second ring with a second tungsten fill; depositing a final passivation layer on top of the interlevel dielectric layer and the second tungsten fill; depositing a polyimide layer on top of the final passivation layer; removing the polyimide and final passivation layers over the barrier areas and the second ring; and removing the second tungsten fill and the first tungsten fill in the first ring shaped area, said interlevel dielectric layer protecting the first tungsten fill in the barrier areas during said removing step.

Claim 5

A method for producing closely pitched polysilicon fuses in a semiconductor device comprising the steps of: forming an array of closely pitched polysilicon fuses on a top surface of a semiconductor substrate on which a semiconductor device is formed having a periphery; depositing a phosphorous silicate glass layer on top of both the fuses and the top surface of the substrate; removing the phosphorous silicate glass layer in barrier areas positioned intermediate fuses in the array of polysilicon fuses and in a first ring shaped area near the periphery of the semiconductor device; filling both the barrier areas and the first ring shaped area with a first tungsten fill; depositing an interlevel dielectric layer on top of the phosphorous silicate glass layer and the first tungsten fill; removing the interlevel dielectric layer from above the first ring shaped area to expose the first tungsten fill, thereby forming a second ring; filling the second ring with a second tungsten fill; depositing a final passivation layer on top of the interlevel dielectric layer and the second tungsten fill; depositing a polyimide layer on top of the final passivation layer; removing the polyimide and final passivation layers over the barrier areas and the second ring; and removing the second tungsten fill and the first tungsten fill in the first ring shaped area, said interlevel dielectric layer protecting the first tungsten fill in the barrier areas during said removing step.