Patent US1690670A successfully refreshed from Google Patents.
Patent US5834340A successfully refreshed from Google Patents.
US5834340A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic molded semiconductor package and method of manufacturing the same
Assignee: Mitsubishi Electric Corp
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Filing: 1997-11-24
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Granted: 1998-11-10
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Expires: 2017-11-24
Abstract
Abstract A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.
Inventors
- 👤 Akiyoshi Sawai
- 👤 Haruo Shimamoto
- 👤 Toru Tachikawa
- 👤 Jun Shibata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:24
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/019; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/30; H10W74/012; H10W74/016; H10W74/10; H10W74/111; H10W74/114; H10W74/129; H10W74/15; H10W90/00; H10W90/701; H10W72/01; H10W72/012; H10W72/01204; H10W72/01251; H10W72/01255; H10W72/071; H10W72/072; H10W72/07231; H10W72/07232; H10W72/07233; H10W72/07251; H10W72/07253; H10W72/073; H10W72/07331; H10W72/07337; H10W72/20; H10W72/221; H10W72/227; H10W72/231; H10W72/237; H10W72/251; H10W72/252; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
233 words
A method of manufacturing a plastic molded semiconductor package, which method comprises: preparing an insulating sheet provided with a penetration bump having ends, at least one of which is protruded from a surface of said insulating sheet; joining one end of said penetration bump to a pad electrode formed on a main surface of a semiconductor chip; encapsulating said semiconductor chip with resin while holding said insulating sheet; and cutting said insulating sheet at a predetermined portion to form an end surface of said insulating sheet which is substantially coplanar with a surface of said molding resin, wherein said penetration bump is protruded only from a surface of said insulating sheet, and said step of preparing said insulating sheet having said penetration bump includes the steps of, forming a conductive layer on a base member, deposing said insulating sheet on said conductive layer, forming a mask layer on said insulating sheet, said mask layer having a first opening which exposes a portion of a surface of said insulating sheet, etching said insulating sheet using said mask layer as a mask to form a second opening which exposes a portion of a surface of said conductive layer, effecting electroplating using said mask layer as a mask to form said penetration bump in said second opening, and removing said conductive layer and said base member from said insulating sheet and thereby removing said mask layer.
Claim 2
Independent Claim
233 words
A method of manufacturing a plastic molded semiconductor package, which method comprises: preparing an insulating sheet provided with a penetration bump having ends, at least one of which is protruded from a surface of said insulating sheet; joining one end of said penetration bump to a pad electrode formed on a main surface of a semiconductor chip; encapsulating said semiconductor chip with resin while holding said insulating sheet; and cutting said insulating sheet at a predetermined portion to form an end surface of said insulating sheet which is substantially coplanar with a surface of said molding resin, wherein said penetration bump is protruded only from a surface of said insulating sheet, and said step of preparing said insulating sheet having said penetration bump includes the steps of, forming a conductive layer on a base member, deposing said insulating sheet on said conductive layer, forming a mask layer on said insulating sheet, said mask layer having a first opening which exposes a portion of a surface of said insulating sheet, etching said insulating sheet using said mask layer as a mask to form a second opening which exposes a portion of a surface of said conductive layer, effecting electroplating using said mask layer as a mask to form said penetration bump in said second opening, and removing said conductive layer and said base member from said insulating sheet and thereby removing said mask layer.
References Cited (Backward Citations)
US3625837A
Cited
US3959874A
Cited
JPS53141576A
Cited
US4264917A
Cited
JPS58110004A
Cited
US4620215A
Cited
US4784872A
Cited
JPS62230027A
Cited
US4942140A
Cited
JPH01161724A
Cited
US5179039A
Cited
JPH01283948A
Cited
JPH0249460A
Cited
JPH02125633A
Cited
JPH02131348A
Cited
US5504035A
Cited
JPH0394438A
Cited
US5273938A
Cited
JPH03104141A
Cited
JPH03154344A
Cited
JPH03293740A
Cited
US5061657A
Cited
US5019673A
Cited
US5120678A
Cited
JPH04207046A
Cited
US5289346A
Cited
JPH053183A
Cited
US5302553A
Cited
US5565379A
Cited
US5519936A
Cited
US5663106A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-09 | 2002-05-11 | 2002-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-09 | 2006-05-11 | 2006-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-09 | 2010-05-11 | 2010-11-10 | $7700.00 | Window Closed / Lapsed |