US5519936A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
Assignee: GlobalFoundries Inc
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Filing: 1995-02-01
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Granted: 1996-05-28
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Expires: 2015-02-01
Abstract
Abstract An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.
Inventors
- 👤 Frank E. Andros
- 👤 James R. Bupp
- 👤 Michael DiPietro
- 👤 Richard B. Hammer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 17:41
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W70/00; H10W70/40; H10W70/453; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H10W70/688; H10W72/00; H10W72/071; H10W72/075; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W90/00; H10W90/701; H10W70/682; H10W70/685; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07535; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/701; H10W72/851; H10W72/874; H10W72/884; H10W90/731; H10W90/736; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
109 words
A method of making an electronic package, said method comprising: providing a substantially rigid, thermally conductive support member; directly bonding at least one thin, circuitized substrate to said thermally conductive support member in an electrically insulative manner, said thin, circuitized substrate including a dielectric member having at least one layer of circuitry; bonding a semiconductor device to said thermally conductive support member in a thermally conductive manner at a location relative to said layer of circuitry; electrically coupling said semiconductor device to said circuitry of said thin, circuitized substrate; and substantially covering at least part of said semiconductor device and at least part of said circuitry with an encapsulant.
Claim 2
Independent Claim
109 words
A method of making an electronic package, said method comprising: providing a substantially rigid, thermally conductive support member; directly bonding at least one thin, circuitized substrate to said thermally conductive support member in an electrically insulative manner, said thin, circuitized substrate including a dielectric member having at least one layer of circuitry; bonding a semiconductor device to said thermally conductive support member in a thermally conductive manner at a location relative to said layer of circuitry; electrically coupling said semiconductor device to said circuitry of said thin, circuitized substrate; and substantially covering at least part of said semiconductor device and at least part of said circuitry with an encapsulant.
Claim 3
Dependent Claim
23 words
The method of claim 1 wherein said bonding of said thin, circuitized substrate to said thermally conductive member is accomplished using an adhesive.
Claim 4
Dependent Claim
23 words
The method of claim 1 wherein said bonding of said semiconductor device to said thermally conductive support member is accomplished using an adhesive.
Claim 5
Dependent Claim
28 words
The method of claim 1 wherein said electrical coupling of said semiconductor device to said circuitry of said thin, circuitized substrate is accomplished using a wire bonding operation.
Claim 6
Dependent Claim
28 words
The method of claim 1 wherein said electrical coupling of said semiconductor device to said circuitry of said thin, circuitized substrate is accomplished using a thermocompression bonding operation.
Claim 7
Dependent Claim
34 words
The method of claim 1 wherein said bonding of said semiconductor device to said thermally conductive support member occurs subsequent to said bonding of said thin, circuitized substrate to said thermally conductive support member.
Claim 8
Dependent Claim
41 words
The method of claim 1 further including providing an indentation in said thermally conductive support member and thereafter bonding said semiconductor device to said support member, said semiconductor device being bonded to said support member at the location of said indentation.
Claim 9
Dependent Claim
29 words
The method of claim 1 further including the step of securing a plurality of solder elements to selected portions of said layer of circuitry of said thin, circuitized substrate.
Claim 10
Dependent Claim
33 words
The method of claim 8 further including providing a second circuitized substrate and electrically coupling said thin, circuitized substrate to said second circuitized substrate, said electrical coupling being accomplished using said solder elements.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-28 | 1999-11-27 | 2000-05-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-28 | 2003-11-27 | 2004-05-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-28 | 2007-11-27 | 2008-05-28 | $7700.00 | Window Closed / Lapsed |