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Process for fabricating a thin film transistor

Assignee: Seiko Epson Corp
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Filing: 1996-09-27
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Granted: 1998-09-22
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Expires: 2016-09-27
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Abstract

Abstract There is Disclosed a semiconductor device comprising a silicon film formed on a substrate having at least a surface formed of an insulative material, the silicon film being heat-treated at a temperature below 600° C. and being partially coated with a silicon oxide film formed by electronic cyclotron resonance plasma CVD.

Inventors

  • 👤 Mitsutoshi Miyasaka
  • 👤 Thomas W. Little

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 11:17
CPC Classifications
H; H10; H10D; H10D89/00; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0314; H10D30/0321; H10D30/60; H10D30/67; H10D30/6729; H10D30/673; H10D30/6731; H10D30/6737; H10D30/6739; H10D30/674; H10D30/6741; H10D30/6743; H10D30/6745; H10P; H10P95/00; H10P95/94; Y; Y10; Y10S; Y10S148/00; Y10S148/017; Y10S148/122; Y10S148/15; Y10S438/00; Y10S438/906

Claims Analysis

Total Claims: 19
Claim 1
Independent Claim 62 words
A process for fabricating a thin film transistor of a semiconductor device, comprising: a first step of forming a polycrystalline silicon film on a substrate; a second step of immersing the substrate into a solution which contains an acid; and a third step of depositing a silicon oxide film on the polycrystalline silicon film, the third step directly following the second step.
Claim 2
Dependent Claim 62 words
A process for fabricating a thin film transistor of a semiconductor device, comprising: a first step of forming a polycrystalline silicon film on a substrate; a second step of immersing the substrate into a solution which contains an acid; and a third step of depositing a silicon oxide film on the polycrystalline silicon film, the third step directly following the second step.
Claim 3
Dependent Claim 79 words
A process for fabricating a thin film transistor of a semiconductor device comprising: a first step of forming a polycrystalline silicon film on a substrate; a second step of immersing the substrate into a solution which contains an acid; and a third step of depositing a silicon oxide film on the polycrystalline silicon film immediately after the second step, wherein the second step comprises immersing the substrate into a first solution and immersing the substrate into a second solution.
Claim 4
Dependent Claim 79 words
A process for fabricating a thin film transistor of a semiconductor device comprising: a first step of forming a polycrystalline silicon film on a substrate; a second step of immersing the substrate into a solution which contains an acid; and a third step of depositing a silicon oxide film on the polycrystalline silicon film immediately after the second step, wherein the second step comprises immersing the substrate into a first solution and immersing the substrate into a second solution.
Claim 5
Dependent Claim 13 words
The process of claim 2, wherein the first solution comprises HNO 3 .
Claim 6
Dependent Claim 17 words
The process of claim 1, wherein the silicon oxide film is formed by chemical vapor deposition (CVD).
Claim 7
Dependent Claim 16 words
The process of claim 4, wherein the silicon oxide film is formed by plasma CVD (PECVD).
Claim 8
Dependent Claim 81 words
A process for fabricating a thin film transistor of a semiconductor device, comprising: a first step of forming an amorphous silicon film on a substrate; a second step of crystallizing the amorphous silicon film formed on the substrate to obtain a polycrystalline silicon film; a third step of immersing the substrate into a solution which contains an acid; and a fourth step of depositing a silicon oxide film on the polycrystalline silicon film, the fourth step directly following the third step.
Claim 9
Dependent Claim 81 words
A process for fabricating a thin film transistor of a semiconductor device, comprising: a first step of forming an amorphous silicon film on a substrate; a second step of crystallizing the amorphous silicon film formed on the substrate to obtain a polycrystalline silicon film; a third step of immersing the substrate into a solution which contains an acid; and a fourth step of depositing a silicon oxide film on the polycrystalline silicon film, the fourth step directly following the third step.
Claim 10
Dependent Claim 22 words
The process of claim 6, wherein in the second step, the amorphous silicon film is crystallized at a temperature below 600° C.
Claim 11
Dependent Claim 25 words
The process of claim 6, wherein the third step comprises immersing the substrate into a first solution and immersing the substrate into a second solution.
Claim 12
Dependent Claim 13 words
The process of claim 8, wherein the first solution comprises HNO 3 .
Claim 13
Dependent Claim 17 words
The process of claim 6, wherein the silicon oxide film is formed by chemical vapor deposition (CVD).
Claim 14
Dependent Claim 16 words
The process of claim 10, wherein the silicon oxide film is formed by plasma CVD (PECVD).
Claim 15
Dependent Claim 11 words
The process of claim 2, wherein the second solution comprises HF.
Claim 16
Dependent Claim 11 words
The process of claim 8, wherein the second solution comprises HF.
Claim 17
Dependent Claim 10 words
The process of claim 1, wherein the solution comprises HF.
Claim 18
Dependent Claim 10 words
The process of claim 6, wherein the solution comprises HF.
Claim 19
Dependent Claim 39 words
The process of claim 1 wherein the second step comprises immersing the substrate into a first solution containing a first acid, and then immersing the substrate into a second solution containing a second acid, the second acid including HF.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-09-21 2002-03-23 2002-09-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-09-21 2006-03-23 2006-09-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-09-21 2010-03-23 2010-09-22 $7700.00 Window Closed / Lapsed

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