Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
104 words
A method of forming a porous dielectric or a semiconductor substrate, said method comprising the steps of: providing a semiconductor substrate having a wet gel thin film deposited thereon, said wet gel thin film having a pore liquid comprising a low boiling point liquid; replacing substantially all of said low boiling point liquid with water; and contacting said wet gel thin film with an atmosphere comprising saturated water vapor at a first temperature greater than the boiling temperature of said low boiling point liquid at 1 atmosphere pressure, thereby aging said thin film while maintaining said wet gel thin film in a wetted state.
Claim 2
Independent Claim
104 words
A method of forming a porous dielectric or a semiconductor substrate, said method comprising the steps of: providing a semiconductor substrate having a wet gel thin film deposited thereon, said wet gel thin film having a pore liquid comprising a low boiling point liquid; replacing substantially all of said low boiling point liquid with water; and contacting said wet gel thin film with an atmosphere comprising saturated water vapor at a first temperature greater than the boiling temperature of said low boiling point liquid at 1 atmosphere pressure, thereby aging said thin film while maintaining said wet gel thin film in a wetted state.
Claim 3
Dependent Claim
24 words
The method of claim 1, wherein said contacting step comprises increasing the pressure of said atmosphere to a first pressure greater than 1 atmosphere.
Claim 4
Dependent Claim
38 words
The method of claim 1, wherein said contacting step comprises increasing the pressure of said atmosphere to a first pressure greater than 1 atmosphere, and increasing the temperature of said atmosphere to a first temperature greater than 100°C.
Claim 5
Dependent Claim
14 words
The method of claim 1, wherein said atmosphere further comprises an aging catalyst vapor.
Claim 6
Dependent Claim
32 words
The method of claim 4, wherein said aging catalyst vapor is selected from the group consisting of ammonia, ammonium hydroxide, methylamine, hydrogen fluoride, ammonium fluoride, sodium hydroxide, potassium hydroxide, and combinations thereof.
Claim 7
Dependent Claim
38 words
The method of claim 1, wherein during at least one segment of said contacting step, said substrate is maintained at a temperature less than said first temperature of said atmosphere, thereby causing water to condense on said substrate.
Claim 8
Dependent Claim
67 words
The method of claim 1, further comprising the step of contacting said substrate with a second atmosphere comprising a solvent vapor and comprising unsaturated water vapor, thereby causing said solvent to condense on said thin film and water to evaporate from said thin film, whereby water in said wet gel thin film may be exchanged with said solvent to terminate aging of said wet gel thin film.
Claim 9
Independent Claim
163 words
A method of forming a porous dielectric or a semiconductor substrate, said method comprising the steps of: providing a semiconductor substrate having a wet gel thin film deposited thereon, said wet gel having a pore liquid comprising water and at least one alcohol that is a low boiling point liquid; contacting said thin film with an atmosphere saturated in water vapor but unsaturated in said alcohol, at a first temperature and pressure condition less than the boiling point of said alcohol; maintaining said atmosphere until substantially all of said alcohol evaporates from said thin film, thereby replacing said alcohol in said wet gel with water; adjusting said atmosphere to a second temperature and pressure condition higher than the boiling point of said alcohol and less than the boiling point of water; maintaining said atmosphere at said second temperature and pressure condition for less than 1 hour; and drying said wet gel while retaining the porous structure thereof, thereby forming an aerogel thin film.
Claim 10
Independent Claim
163 words
A method of forming a porous dielectric or a semiconductor substrate, said method comprising the steps of: providing a semiconductor substrate having a wet gel thin film deposited thereon, said wet gel having a pore liquid comprising water and at least one alcohol that is a low boiling point liquid; contacting said thin film with an atmosphere saturated in water vapor but unsaturated in said alcohol, at a first temperature and pressure condition less than the boiling point of said alcohol; maintaining said atmosphere until substantially all of said alcohol evaporates from said thin film, thereby replacing said alcohol in said wet gel with water; adjusting said atmosphere to a second temperature and pressure condition higher than the boiling point of said alcohol and less than the boiling point of water; maintaining said atmosphere at said second temperature and pressure condition for less than 1 hour; and drying said wet gel while retaining the porous structure thereof, thereby forming an aerogel thin film.
Claim 11
Dependent Claim
15 words
The method of claim 8, wherein said first pressure condition is greater than 1 atmosphere.
Claim 12
Dependent Claim
15 words
The method of claim 8, wherein said second pressure condition is greater than 1 atmosphere.
Claim 13
Independent Claim
70 words
A method of aging a wet gel thin film deposited on a semiconductor substrate, said method comprising the steps of: contacting said wet gel thin film with an atmosphere comprising saturated water vapor at a first temperature greater than 100° C. and a first pressure greater than 1 atmosphere, said first temperature and pressure less than the boiling point of water; and maintaining said contact for less than 1 hour.
Claim 14
Independent Claim
70 words
A method of aging a wet gel thin film deposited on a semiconductor substrate, said method comprising the steps of: contacting said wet gel thin film with an atmosphere comprising saturated water vapor at a first temperature greater than 100° C. and a first pressure greater than 1 atmosphere, said first temperature and pressure less than the boiling point of water; and maintaining said contact for less than 1 hour.