Patent US5688716A successfully refreshed from Google Patents.
US5688716A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fan-out semiconductor chip assembly
Assignee: Adeia Semiconductor Solutions LLC
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Filing: 1996-05-24
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Granted: 1997-11-18
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Expires: 2016-05-24
Abstract
Abstract A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques assembly may include additional circuit elements such as capacitors used in conjunction with the chip.
Inventors
- 👤 Thomas H. DiStefano
- 👤 John W. Smith
- 👤 Tony Faraci
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:33
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4084; H10W44/00; H10W44/601; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/688; H10W72/00; H10W76/00; H10W76/40; H10W76/42; H10W76/45; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/11; H05K1/118; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/0397; H05K2201/09; H05K2201/09009; H05K2201/09081; H05K2201/091; H05K2203/00; H05K2203/06; H05K2203/063; H05K3/36; H05K3/361; H10W70/65; H10W70/654; H10W70/655; H10W72/20; H10W72/261; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W72/851; H10W72/874; H10W72/877; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
262 words
A method of making a semiconductor chip assembly comprising the steps of: (a) providing a subassembly including a semiconductor chip having a front surface and having contacts on the front surface, and a package element attached to the chip so that a peripheral region of the package element projects outwardly away from the chip in horizontal directions generally parallel to the front face of the chip; (b) providing a dielectric element having top and bottom surfaces and terminals on the top surface, and positioning the dielectric element to overlie the subassembly with the top surface and terminals facing away from the chip and package element, with a central region of the dielectric element disposed adjacent the chip and with a peripheral region of the dielectric element carrying at least some of the terminals overlying the peripheral region of the package element; (c) providing first leads attached to the chip at one end thereof and to the dielectric element at the other end thereof, the first leads being electrically connected between the contacts of the chip and the terminals on the dielectric element; and (d) moving the dielectric element and chip relative to one another through a predetermined displacement so that the dielectric element moves with a vertical component of motion away from the chip, and so that the first leads are bent to a configuration in which each said first lead is flexible; and (e) injecting a curable liquid beneath the dielectric element and curing the liquid to form a compliant layer supporting the dielectric element above the chip and package element.
Claim 2
Independent Claim
262 words
A method of making a semiconductor chip assembly comprising the steps of: (a) providing a subassembly including a semiconductor chip having a front surface and having contacts on the front surface, and a package element attached to the chip so that a peripheral region of the package element projects outwardly away from the chip in horizontal directions generally parallel to the front face of the chip; (b) providing a dielectric element having top and bottom surfaces and terminals on the top surface, and positioning the dielectric element to overlie the subassembly with the top surface and terminals facing away from the chip and package element, with a central region of the dielectric element disposed adjacent the chip and with a peripheral region of the dielectric element carrying at least some of the terminals overlying the peripheral region of the package element; (c) providing first leads attached to the chip at one end thereof and to the dielectric element at the other end thereof, the first leads being electrically connected between the contacts of the chip and the terminals on the dielectric element; and (d) moving the dielectric element and chip relative to one another through a predetermined displacement so that the dielectric element moves with a vertical component of motion away from the chip, and so that the first leads are bent to a configuration in which each said first lead is flexible; and (e) injecting a curable liquid beneath the dielectric element and curing the liquid to form a compliant layer supporting the dielectric element above the chip and package element.
Claim 3
Dependent Claim
41 words
A method as claimed in claim 1 wherein said injecting step includes the step of applying pressure to said curable liquid and wherein the pressure of said curable liquid forces the dielectric element away from the chip during said moving step.
Claim 4
Dependent Claim
16 words
A method as claimed in claim 1 wherein said dielectric element is a flexible dielectric sheet.
Claim 5
Dependent Claim
38 words
A method as claimed in claim 1 further comprising the step of engaging the terminals with a fixture and forcing the terminals into substantially coplanar disposition after injection of said liquid but before the liquid is completely cured.
Claim 6
Dependent Claim
87 words
A method as claimed in claim 3 wherein said step of providing said subassembly includes the step of providing at least one peripheral support element disposed alongside of the chip in a peripheral region of the package element so that the peripheral support element defines a front face facing codirectionally with the front face of the chip, and said step of juxtaposing the dielectric element with the subassembly is performed so that the peripheral region of the dielectric element overlies the at least one peripheral support element.
Claim 7
Dependent Claim
53 words
A method as claimed in claim 5 wherein the front face of each said peripheral support element is substantially coplanar with the front face of the chip, whereby said compliant layer will have a substantially constant thickness in regions of the compliant layer underlying the central region and peripheral region of the sheet.
Claim 8
Dependent Claim
30 words
A method as claimed in claim 6 further comprising the step of testing the assembly after said curing step by engaging all of said terminals simultaneously with a test fixture.
Claim 9
Dependent Claim
52 words
A method as claimed in claim 5 wherein said at least one peripheral support element includes a unitary ring having a central opening, said step of providing said subassembly including the step of assembling the ring and the chip so that the chip is disposed in the central opening of the ring.
Claim 10
Dependent Claim
36 words
A method as claimed in claim 1 further comprising the step of positioning an electrical circuit element to confront the bottom surface of said dielectric element and electrically connecting the electrical circuit element to the chip.
Claim 11
Dependent Claim
34 words
A method as claimed in claim 9 wherein said step of connecting said circuit element to the chip includes the step of connecting said circuit element to at least one of said first leads.
Claim 12
Dependent Claim
131 words
A method as claimed in claim 10 wherein said dielectric element has conductors thereon extending from at least some of said first leads to said peripheral region, each said electrical circuit element is positioned to confront said bottom surface in said peripheral region of said dielectric element, the step of connecting the circuit element to said first leads including the steps of providing second leads disposed between the peripheral region of the dielectric element and the circuit element and connecting the second leads between the circuit element and at least some of said conductors prior to said moving step, and wherein said circuit element moves with said package element and said chip during said moving step, whereby said second leads are bent along with said first leads during said moving step.
Claim 13
Dependent Claim
89 words
A method as claimed in claim 11 wherein said step of providing said subassembly includes the step of providing said electrical circuit element as part of a peripheral support element disposed alongside of the chip in a peripheral region of the package element so that the peripheral support element defines a front face facing codirectionally with the front face of the chip, and said step of juxtaposing the dielectric element with the subassembly is performed so that the peripheral region of the dielectric element overlies the peripheral support element.
Claim 14
Dependent Claim
46 words
A method as claimed in claim 10 wherein said step of providing said circuit element includes the step of physically mounting said circuit element to said bottom surface of said dielectric element so that said circuit element moves with said dielectric element during said moving step.
Claim 15
Dependent Claim
14 words
A method as claimed in claim 9 wherein said circuit element includes a capacitor.
Claim 16
Dependent Claim
64 words
A method as claimed in claim 1 wherein said step of providing said first leads includes the steps of providing said first leads on the bottom surface of said dielectric element so that said first leads are engaged with said contacts on said chip when the dielectric element is juxtaposed with the subassembly, and bonding the first leads to the contacts on the chip.
Claim 17
Dependent Claim
60 words
A method as claimed in claim 15 wherein each lead has a first end permanently attached to said dielectric element and a second end releasably attached thereto, said bonding step including the step of bonding the second ends of the leads to the contacts of the chip, said releasable attachments of said second ends being detached during said moving step.
Claim 18
Dependent Claim
33 words
A method as claimed in claim 1 wherein said liquid is injected under pressure during said moving step so that the pressure of said liquid forces said dielectric element away from said subassembly.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-11-17 | 2001-05-19 | 2001-11-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-11-17 | 2005-05-19 | 2005-11-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-11-17 | 2009-05-19 | 2009-11-18 | $7700.00 | Window Closed / Lapsed |