US4949158A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1988-07-12
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Granted: 1990-08-14
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Expires: 2008-07-12
Abstract
Abstract A semiconductor device provided with a film having an opening and first and second surfaces; a semiconductor chip having first and second surfaces corresponding to the first and second surfaces of the film and positioned inside the opening along the film; a plurality of first leads fixed to the first surface of the film, a tip of each first lead being electrically connected to a first electrode provided on the first surface of the semiconductor chip; at least one second lead fixed to the first surface of the film; an electroconductive member in the form of, e.g., a film, fixed to the second surface of the film and electrically connected to a second electrode provided on the second surface of the semiconductor chip; and a connection member passing through the film and electrically connecting the second lead and the electroconductive member to each other. The second electrode on the second surface of the semiconductor chip is connected to the second lead on the first surface of the film via the electroconductive member and the connection member. There is also provided a method of manufacturing this type of semiconductor device.
Inventors
- 👤 Tetsuya Ueda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 00:26
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
171 words
A semiconductor device comprising: an electrically insulating film having an opening and first and second surfaces; a semiconductor chip positioned in said opening, said semiconductor chip having first and second surfaces respectively generally parallel to said first and second surfaces of said electrically insulating film and first and second electrodes disposed on said first and second surfaces of said semiconductor chip, respectively; at least one first lead mounted on said first surface of said electrically insulating film, said first lead being electrically connected to said first electrode; at least one second lead mounted on said first surface of said electrically insulating film; an electrically conductive member mounted on said second surface of said electrically insulating film mechanically and electrically connected to said second electrode at the second side of the insulating film; and connection means passing through said electrically insulating film electrically connecting said second lead with said electrically conductive member whereby electrical access to said first and second electrodes is provided at said first surface of said electrically insulating film.
Claim 2
Dependent Claim
171 words
A semiconductor device comprising: an electrically insulating film having an opening and first and second surfaces; a semiconductor chip positioned in said opening, said semiconductor chip having first and second surfaces respectively generally parallel to said first and second surfaces of said electrically insulating film and first and second electrodes disposed on said first and second surfaces of said semiconductor chip, respectively; at least one first lead mounted on said first surface of said electrically insulating film, said first lead being electrically connected to said first electrode; at least one second lead mounted on said first surface of said electrically insulating film; an electrically conductive member mounted on said second surface of said electrically insulating film mechanically and electrically connected to said second electrode at the second side of the insulating film; and connection means passing through said electrically insulating film electrically connecting said second lead with said electrically conductive member whereby electrical access to said first and second electrodes is provided at said first surface of said electrically insulating film.
Claim 3
Dependent Claim
17 words
A semiconductor device according to claim 1 wherein said electrically conductive member is an electrically conductive film.
Claim 4
Dependent Claim
17 words
A semiconductor device according to claim 2 wherein said electrically conductive member is an electrically conductive foil.
Claim 5
Dependent Claim
20 words
A semiconductor device according to claim 2 wherein said electrically conductive member covers said opening of said electrically insulating film.
Claim 6
Dependent Claim
40 words
A semiconductor device according to claim 4 wherein said electrically conductive member has a recess for accommodating said semiconductor chip to make said first surface of said semiconductor chip and said first surface of said electrically insulating film essentially coplanar.
Claim 7
Dependent Claim
27 words
A semiconductor device according to claim 1 wherein said connection means includes a coating on the inner wall of a through hole in said electrically insulating film.
Claim 8
Dependent Claim
26 words
A semiconductor device according to claim 1 wherein said connection means includes an electrically conductive material disposed in a through hole in said electrically insulating film.
References Cited (Backward Citations)
US3390308A
Cited
US3684818A
Cited
US3972062A
Cited
JPS51112177A
Cited
US4312926A
Cited
US4538210A
Cited
JPS648130A
Cited
JPH042525A
Cited
JPH088333A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-13 | 1994-02-12 | 1994-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-13 | 1998-02-12 | 1998-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-13 | 2002-02-12 | 2002-08-14 | $7700.00 | Window Closed / Lapsed |