JPS51112177A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor equipment
Assignee: Mitsubishi Electric Corp
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Filing: 1975-03-27
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Granted: —
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Expires: 1995-03-27
Abstract
Abstract PURPOSE:In packaging the semiconductor equipment, prepare the board on which semiconductor chip is mounted, the insulator board and the radiation board on which solder is reserved. Adhere each of them after deciding the position to make the package of which radiation efficiency is superior.
Inventors
- 👤 Masanobu Obara
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-08 15:20
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701
Claims Analysis
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References Cited (Backward Citations)
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