US5055907A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Extended integration semiconductor structure with wiring layers
Assignee: Mosaic Inc
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Filing: 1989-01-25
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Granted: 1991-10-08
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Expires: 2009-01-25
Abstract
Abstract A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding the aligned and attached integrated substrate, and the support substrate is removed. Reach-through vias connect the decal wiring to the chips.
Inventors
- 👤 Scott L. Jacobs
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 05:53
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W70/688; H10P72/7424
Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
80 words
An extended integration structure comprising: a thin film decal having at least one wiring layer therein; a support ring attached to said decal, for maintaining said decal under tension inside said support ring; at least one integrated circuit chip attached to said decal inside said support ring, said at least one integrated circuit chip being aligned with said decal; and a plurality of electrical connections between said at least one wiring layer and said at least one integrated circuit chip.
Claim 2
Dependent Claim
80 words
An extended integration structure comprising: a thin film decal having at least one wiring layer therein; a support ring attached to said decal, for maintaining said decal under tension inside said support ring; at least one integrated circuit chip attached to said decal inside said support ring, said at least one integrated circuit chip being aligned with said decal; and a plurality of electrical connections between said at least one wiring layer and said at least one integrated circuit chip.
Claim 3
Dependent Claim
29 words
The structure of claim 1 wherein said thin film decal comprises a plurality of wiring layers insulated from one another and from said at least one integrated circuit chip.
Claim 4
Dependent Claim
25 words
The structure of claim 2 wherein said thin film decal further comprises a plurality of vias for selectively connecting said wiring planes to one another.
Claim 5
Dependent Claim
20 words
The structure of claim 1 wherein said thin film decal comprises at least one metal wiring layer in polymer insulation.
Claim 6
Dependent Claim
20 words
The structure of claim 4 wherein said metal wiring layer is selected from the group consisting of copper and aluminum.
Claim 7
Dependent Claim
11 words
The structure of claim 4 wherein said polymer insulation is polyimide.
Claim 8
Dependent Claim
14 words
The structure of claim 1 wherein said plurality of electrical connections are reach-through vias.
Claim 9
Dependent Claim
29 words
The structure of claim 7 wherein said reach-through vias are metal with said metal wiring layer and said reach-through vias being different metals to facilitate rework of said structure.
Claim 10
Dependent Claim
19 words
The structure of claim 1 wherein said support ring is selected from the group consisting of metal and ceramic.
Claim 11
Dependent Claim
13 words
The structure of claim 1 wherein said support ring includes input/output connections thereon.
Claim 12
Dependent Claim
15 words
The structure of claim 1 wherein said support ring includes at least one capacitor therein.
Claim 13
Dependent Claim
16 words
The structure of claim 1 wherein said support ring includes at least one active device therein.
Claim 14
Dependent Claim
52 words
The structure of claim 1 wherein said support ring is a semiconductor wafer aligned and attached to said decal, with said semiconductor wafer having active devices fabricated therein, and wherein said extended integration structure further comprises a plurality of electrical connections between said at least one wiring layer and said semiconductor wafer.
Claim 15
Dependent Claim
17 words
The structure of claim 1 wherein said thin film decal includes a plurality of input/output connectors thereon.
Claim 16
Dependent Claim
22 words
The structure of claim 14 wherein said input/output connectors comprise input/output connectors for tab automated bonding to a next level of packaging.
Claim 17
Dependent Claim
18 words
The structure of claim 1 wherein said extended integration structure is mounted on a second extended integration structure.
Claim 18
Dependent Claim
19 words
The structure of claim 1 further comprising means for removing heat generated by said at least one integrated circuit.
Claim 19
Dependent Claim
16 words
The structure of claim 1 wherein the wires in said wiring layers comprise a ladder structure.
Claim 20
Dependent Claim
28 words
The structure of claim 1 further comprising a thermal package connected to at least one of said thin film decal and said at least one integrated circuit chip.
Claim 21
Dependent Claim
36 words
The structure of claim 1 further comprising input/output means for connecting at least one of said thin film decal, said support ring and said at least one integrated circuit chip to a next level of packaging.
Claim 22
Dependent Claim
17 words
The structure of claim 1 wherein said at least one wiring layer comprises a ladder wiring layer.
Claim 23
Dependent Claim
83 words
An integrated circuit structure comprising: a thin film decal having at least one wiring layer therein; a support ring attached to said decal, for maintaining said decal under tension inside said support ring; an integrated circuit chip attached to said decal inside said support ring, said integrated circuit chip being aligned with said decal; and a plurality of electrical connections between said at least one wiring layer and said integrated circuit chip, to thereby provide redistributed input/output patterns from said integrated circuit chip.
Claim 24
Dependent Claim
83 words
An integrated circuit structure comprising: a thin film decal having at least one wiring layer therein; a support ring attached to said decal, for maintaining said decal under tension inside said support ring; an integrated circuit chip attached to said decal inside said support ring, said integrated circuit chip being aligned with said decal; and a plurality of electrical connections between said at least one wiring layer and said integrated circuit chip, to thereby provide redistributed input/output patterns from said integrated circuit chip.
Claim 25
Dependent Claim
26 words
The structure of claim 22 wherein said thin film decal comprises a plurality of wiring layers insulated from one another and from said integrated circuit chip.
Claim 26
Dependent Claim
25 words
The structure of claim 23 wherein said thin film decal further comprises a plurality of vias for selectively connecting said wiring planes to one another.
Claim 27
Dependent Claim
20 words
The structure of claim 22 wherein said thin film decal comprises at least one metal wiring layer in polymer insulation.
Claim 28
Dependent Claim
20 words
The structure of claim 25 wherein said metal wiring layer is selected from the group consisting of copper and aluminum.
Claim 29
Dependent Claim
11 words
The structure of claim 25 wherein said polymer insulation is polyimide.
Claim 30
Dependent Claim
14 words
The structure of claim 22 wherein said plurality of electrical connections are reach-through vias.
Claim 31
Dependent Claim
29 words
The structure of claim 28 wherein said reach-through vias are metal with said metal wiring layer and said reach-through vias being different metals to facilitate rework of said structure.
Claim 32
Dependent Claim
19 words
The structure of claim 22 wherein said support ring is selected from the group consisting of metal and ceramic.
Claim 33
Dependent Claim
13 words
The structure of claim 22 wherein said support ring includes input/output connections thereon.
Claim 34
Dependent Claim
15 words
The structure of claim 22 wherein said support ring includes at least one capacitor therein.
Claim 35
Dependent Claim
16 words
The structure of claim 22 wherein said support ring includes at least one active device therein.
Claim 36
Dependent Claim
17 words
The structure of claim 22 wherein said thin film decal includes a plurality of input/output connectors thereon.
Claim 37
Dependent Claim
22 words
The structure of claim 34 wherein said input/output connectors comprise input/output connectors for tab automated bonding to a next level of packaging.
Claim 38
Dependent Claim
19 words
The structure of claim 22 further comprising means for removing heat generated by said at least one integrated circuit.
Claim 39
Dependent Claim
16 words
The structure of claim 23 wherein the wires in said wiring layers comprise a ladder structure.
Claim 40
Dependent Claim
25 words
The structure of claim 22 further comprising a thermal package connected to at least one of said thin film decal and said integrated circuit chip.
Claim 41
Dependent Claim
33 words
The structure of claim 22 further comprising input/output means for connecting at least one of said thin film decal, said support ring and said integrated circuit chip to a next level of packaging.
Claim 42
Dependent Claim
17 words
The structure of claim 22 wherein said at least one wiring layer comprises a ladder wiring layer.
Claim 43
Dependent Claim
78 words
An electrical connection structure for an electronic device having a pad on the surface thereof comprising: a thin film structure on said surface of said electronic device, said thin film structure having a wiring layer therein, with one side of said wiring layer facing said electronic device and the opposite side of said wiring layer facing away from said electrical device; and a reach through via electrically connecting said opposite side of said wiring layer to said paid.
Claim 44
Dependent Claim
78 words
An electrical connection structure for an electronic device having a pad on the surface thereof comprising: a thin film structure on said surface of said electronic device, said thin film structure having a wiring layer therein, with one side of said wiring layer facing said electronic device and the opposite side of said wiring layer facing away from said electrical device; and a reach through via electrically connecting said opposite side of said wiring layer to said paid.
Claim 45
Dependent Claim
14 words
The structure of claim 41 wherein said reach through via comprises a deposited conductor.
Claim 46
Dependent Claim
12 words
The structure of claim 41 wherein said reach through via comprises solder.
Claim 47
Dependent Claim
38 words
The structure of claim 41 wherein said reach through via comprises: a stud in said thin film structure, electrically connected to said pad; and a strap, electrically connecting said stud with said opposite side of said wiring layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-07 | 1995-04-08 | 1995-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-07 | 1999-04-08 | 1999-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-07 | 2003-04-08 | 2003-10-08 | $7700.00 | Window Closed / Lapsed |