US4714516A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging
Assignee: Lockheed Martin Corp
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Filing: 1986-09-26
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Granted: 1987-12-22
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Expires: 2006-09-26
Abstract
Abstract A method for producing holes in a polymer film includes the steps of irradiating a spot on the film with a burst of focused laser energy at a level sufficient to damage the film without puncturing it and then subsequently plasma etching the irradiated film so as to remove the damaged portions. This method is particularly applicable to the formation of multichip integrated circuit packages in which a plurality of microcircuit chips are affixed to an underlying substrate which is coated with a polymer film covering the chips and the substrates. The holes are provided for the purpose of interconnecting the chips or making intrachip connections by means of a subsequently applied metallization layer.
Inventors
- 👤 Charles W. Eichelberger
- 👤 Robert J. Wojnarowski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 23:06
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0041; B; B23; B23K; B23K26/00; B23K26/0006; B23K26/36; B23K26/361; H05K3/0026; H05K3/0032; H05K3/0035; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H10W99/00; B23K2101/00; B23K2101/34; B23K2101/36; B23K2101/42; B23K2103/00; B23K2103/16; B23K2103/166; B23K2103/172; B23K2103/30; B23K2103/42; B23K2103/50; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2201/09818; H05K2201/09827; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0165; H05K2203/09; H05K2203/095; H05K3/0008; H05K3/0055; H05K3/46; H05K3/4644
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
60 words
A method for producing holes in a polymer film, said method comprising the steps of: irradiating a spot on said film, where said hole is desired, with a burst of focused electromagnetic energy at a level sufficient to damage said film without substantial ablation of said film; and plasma etching said irradiated film so as to remove said damaged film.
Claim 2
Independent Claim
60 words
A method for producing holes in a polymer film, said method comprising the steps of: irradiating a spot on said film, where said hole is desired, with a burst of focused electromagnetic energy at a level sufficient to damage said film without substantial ablation of said film; and plasma etching said irradiated film so as to remove said damaged film.
Claim 3
Dependent Claim
15 words
The method of claim 1 in which said electromagnetic energy is produced by a laser.
Claim 4
Dependent Claim
14 words
The method of claim 2 in which said laser is an argon ion laser.
Claim 5
Dependent Claim
14 words
The method of claim 2 in which said laser operates in the ultraviolet region.
Claim 6
Dependent Claim
17 words
The method of claim 1 in which said etching occurs at a pressure of approximately 0.5 torr.
Claim 7
Dependent Claim
21 words
The method of claim 5 in which said electromagnetic energy is focused to a spot of approximately 8 microns in diameter.
Claim 8
Dependent Claim
19 words
The method of claim 1 in which said film is from approximately 5 to approximately 50 microns in thickness.
Claim 9
Dependent Claim
15 words
The method of claim 2 in which said laser is controlled by an acousto-optical modulator.
Claim 10
Dependent Claim
27 words
The method of claim 2 in which said electromagnetic laser energy passes through a beam expander and a focusing lens respectively, prior to impingement upon said film.
Claim 11
Dependent Claim
23 words
The method of claim 1 in which said polymer film is selected from the group consisting of polysulfone, polyimide, polyethylene teraphthalate and epoxy.
Claim 12
Dependent Claim
14 words
The method of claim 1 in which said etching occurs in an oxygen atmosphere.
Claim 13
Dependent Claim
22 words
The method of claim 1 in which said etching occurs in an atmosphere comprising approximately 50% oxygen and 50% CF 4 .
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-12-21 | 1991-06-22 | 1991-12-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-12-21 | 1995-06-22 | 1995-12-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-12-21 | 1999-06-22 | 1999-12-22 | $7700.00 | Window Closed / Lapsed |