Semiconductor die packages having lead support frame

Claim 3

A method of forming a lead pack as in claim 1 including the additional step of die forming boding bumps or dimples on the inwardly extending ends of said leads prior to excising said foil.

Claim 4

A method of forming a lead pack as in claim 1 or 2 including the additional step of plating said inwardly extending leads.

Claim 5

A tape automated bonding, packaging and testing process for semiconductor devices comprising the steps of: forming a lead pack including the steps of: forming in a conductive foil such as copper, a plurality of elongated, spaced windows extending outwardly from a central area to define therebetween flat, spaced elongated leads having an inner end at said central area and extending outwardly from said central area; applying first ad second frame members of electrical insulating material, one to each side of said elongated leads spaced from the inner end of said leads; pressing said frame members together so that they join to imbed and support the leads; excising the foil adjacent the two ends of the leads to form a lead pack comprising a frame of electrical insulating material supporting a plurality of spaced leads extending inwardly and outwardly from said frame; attaching the outer end of the leads of the lead pack to spaced splayed conductors carried by transport tape and extending between ends which receive the lead pack leads and ends which include test pads; and electrically connecting the inner ends of the lead pack leads to the contact pads of a semiconductor device.

Claim 6

A tape automated bonding, packaging and testing process for semiconductor devices comprising the steps of: forming a lead pack including the steps of: forming in a conductive foil such as copper, a plurality of elongated, spaced windows extending outwardly from a central area to define therebetween flat, spaced elongated leads having an inner end at said central area and extending outwardly from said central area; applying first ad second frame members of electrical insulating material, one to each side of said elongated leads spaced from the inner end of said leads; pressing said frame members together so that they join to imbed and support the leads; excising the foil adjacent the two ends of the leads to form a lead pack comprising a frame of electrical insulating material supporting a plurality of spaced leads extending inwardly and outwardly from said frame; attaching the outer end of the leads of the lead pack to spaced splayed conductors carried by transport tape and extending between ends which receive the lead pack leads and ends which include test pads; and electrically connecting the inner ends of the lead pack leads to the contact pads of a semiconductor device.

Claim 7

A tape automated bonding, packaging and testing process as in claim 4 including the step of housing said semiconductor in a housing which seals to the frame material.

Claim 8

A tape automated bonding process as in claim 5 including the additional steps of excising the spaced package leads and thereafter removing the ends of said leads which are fixed to the tape transport for reception of a new lead pack.