US4859632A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing the same
Assignee: Siemens Corporate Research and Support Inc
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Filing: 1987-12-28
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Granted: 1989-08-22
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Expires: 2007-12-28
Abstract
Abstract A lead frame and method for processing the lead frames from a continuous strip of lead frames. A first insulation support member and a second insulative support member are first molded to the lead frame. After the support members are formed, the positioning member for supporting the leads within the lead frame is stamped from the lead frame. After an integrated circuit (IC) is connected to the leads, the IC can be tested within the lead frame since the leads are electrically isolated from the lead frame and each other. Finally the IC can be encapsulated and the leads severed from the lead frame assembly.
Inventors
- 👤 Marvin Lumbard
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 03:12
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H10W70/40; H10W70/421; H10W70/438; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
130 words
A method for processing the lead frames of a lead frame strip, wherein the lead frames provide the leads for an integrated circuit, comprising: providing a lead frame strip defining at least one lead frame, wherein the lead frame defines a support section and a plurality of leads attached to a positioning member, the positioning member being attached to the support section; attaching the integrated circuit to the leads; providing a first insulative member for connecting the leads to the support section; providing a second insulative member for interconnecting the leads; and removing the positioning member such that the insulative members, support section and leads cooperate so that the leads are supported by the support section while being electrically insulated from the support section and electrically insulated from each other.
Claim 2
Independent Claim
130 words
A method for processing the lead frames of a lead frame strip, wherein the lead frames provide the leads for an integrated circuit, comprising: providing a lead frame strip defining at least one lead frame, wherein the lead frame defines a support section and a plurality of leads attached to a positioning member, the positioning member being attached to the support section; attaching the integrated circuit to the leads; providing a first insulative member for connecting the leads to the support section; providing a second insulative member for interconnecting the leads; and removing the positioning member such that the insulative members, support section and leads cooperate so that the leads are supported by the support section while being electrically insulated from the support section and electrically insulated from each other.
Claim 3
Dependent Claim
14 words
The method of claim 1 further comprising the step of testing the integrated circuit.
Claim 4
Dependent Claim
19 words
The method of claim 2 further comprising encapsulating the integrated circuit and severing the leads from the lead frame.
Claim 5
Dependent Claim
22 words
The method of claim 2 wherein the first insulative member is molded such that it forms a molded substantially U-shaped plastic member.
Claim 6
Dependent Claim
22 words
The method of claim 4 wherein the second insulative member is molded such that it forms a molded substantially rectangular plastic member.
Claim 7
Dependent Claim
22 words
The method of claim 2 wherein the first insulative member is molded such that it forms a molded substantially rectangular plastic member.
Claim 8
Dependent Claim
22 words
The method of claim 6 wherein the second insulative member is molded such that it forms a molded substantially rectangular plastic member.
Claim 9
Independent Claim
156 words
A method for processing the lead frames of a lead frame strip, wherein the lead frames provide the leads for an integrated circuit, comprising: Providing a lead frame strip defining at least one lead frame, wherein the lead frame defines a support section and a plurality of leads attached to a positioning member, the positioning member being attached to the support section; providing a first plastic member for connecting the leads to the support section; providing a second plastic member for interconnecting the leads; removing the positioning member such that the insulative members, support section and leads cooperate so that the leads are supported by the support section while being electrically insulated from the support section and electrically insulated from each other; attaching the integrated circuit to the leads; testing the integrated circuit; encapsulating the integrated circuit after the integrated circuit is tested; and severing the leads from the lead frame after encapsulating the integrated circuit.
Claim 10
Independent Claim
156 words
A method for processing the lead frames of a lead frame strip, wherein the lead frames provide the leads for an integrated circuit, comprising: Providing a lead frame strip defining at least one lead frame, wherein the lead frame defines a support section and a plurality of leads attached to a positioning member, the positioning member being attached to the support section; providing a first plastic member for connecting the leads to the support section; providing a second plastic member for interconnecting the leads; removing the positioning member such that the insulative members, support section and leads cooperate so that the leads are supported by the support section while being electrically insulated from the support section and electrically insulated from each other; attaching the integrated circuit to the leads; testing the integrated circuit; encapsulating the integrated circuit after the integrated circuit is tested; and severing the leads from the lead frame after encapsulating the integrated circuit.
Claim 11
Dependent Claim
21 words
The method of claim 8 wherein the first plastic member is molded such that it forms a molded substantially U-shaped member.
Claim 12
Dependent Claim
21 words
The method of claim 9 wherein the second plastic member is molded such that it forms a molded substantially rectangular member.
Claim 13
Dependent Claim
21 words
The method of claim 12 wherein the first plastic member is molded such that it forms a molded substantially rectangular member.
Claim 14
Dependent Claim
21 words
The process of claim 11 wherein the second plastic member is molded such that it forms a molded substantially rectangular member.
References Cited (Backward Citations)
US3444440A
Cited
US3385426A
Cited
US3689991A
Cited
US3864820A
Cited
US3611061A
Cited
US3838984A
Cited
JPS5339866A
Cited
US4132856A
Cited
US4282544A
Cited
US4301464A
Cited
JPS5588350A
Cited
US4214364A
Cited
US4305204A
Cited
US4413404A
Cited
US4477827A
Cited
US4380042A
Cited
US4480150A
Cited
US4701781A
Cited
JPS61212031A
Cited
US4689875A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-21 | 1993-02-20 | 1993-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-21 | 1997-02-20 | 1997-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-21 | 2001-02-20 | 2001-08-22 | $7700.00 | Window Closed / Lapsed |