US4689875A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit packaging process
Assignee: Vermont Technical College
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Filing: 1986-02-13
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Granted: 1987-09-01
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Expires: 2006-02-13
Abstract
Abstract The present invention is a method for packaging and protecting an integrated circuit chip on a carrier tape. A carrier tape comprising at least two bonded layers (one layer being made of an electrically conductive material) includes small flat leads in the conductive layer. A carrier bridge or frame of nonconductive material is bonded to one surface of the leads and is connected to a nonconductive layer (or a part of) the tape. The electrical pads of an integrated circuit are bonded to the respective leads of the tape simultaneously. The leads are cut at a predetermined length from the chip and outside of the frame. The lead ends are bent to form a nest. A planar base is adehered to the surface of the chip having the electrical pads. The leads are then bent over the base to secure the base on the tape and provide electrical contact points to the chip. The chip is coated with a suitable material and to provide insulation and encapsulation of the entire packaging structure. At a desired time, the complete chip packaging structure may be removed from the tape by cutting the frame.
Inventors
- 👤 Russell V. Solstad
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 10:56
CPC Classifications
H; H10; H10W; H10W95/00; H10W72/00; H10W72/071; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49135
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
215 words
A method for packaging semiconductor chips on a carrier tape to produce a carrier tape having packaged semiconductor chips supported thereon, the method comprising: providing a carrier tape having a nonconductive substrate and a conductive layer, the tape having a plurality of chip bonding areas formed by an opening in the substrate with a chip support frame extending across the opening and a corresponding opening in the conductive layer with conductive leads extending from edges of the opening in the conductive layer to the frame to provide first free ends for bonding to a chip; aligning semiconductor chips with the chip support frames so that contact pads on a first surface of the chips are positioned opposite respective first free ends of the leads; bonding the contact pads of the semiconductor chips and the first free ends of the leads; severing the leads from the conductive layer at predetermined distance from the frames to form second free ends; bending the second free ends of the leads substantially perpendicularly to a plane of the carrier tape away from the semiconductor chips to form nests; applying an adhesive to the first surface of the semiconductor chips; positioning bases on the adhesive and within the nests; and bending the second free ends of the leads over the bases.
Claim 2
Independent Claim
215 words
A method for packaging semiconductor chips on a carrier tape to produce a carrier tape having packaged semiconductor chips supported thereon, the method comprising: providing a carrier tape having a nonconductive substrate and a conductive layer, the tape having a plurality of chip bonding areas formed by an opening in the substrate with a chip support frame extending across the opening and a corresponding opening in the conductive layer with conductive leads extending from edges of the opening in the conductive layer to the frame to provide first free ends for bonding to a chip; aligning semiconductor chips with the chip support frames so that contact pads on a first surface of the chips are positioned opposite respective first free ends of the leads; bonding the contact pads of the semiconductor chips and the first free ends of the leads; severing the leads from the conductive layer at predetermined distance from the frames to form second free ends; bending the second free ends of the leads substantially perpendicularly to a plane of the carrier tape away from the semiconductor chips to form nests; applying an adhesive to the first surface of the semiconductor chips; positioning bases on the adhesive and within the nests; and bending the second free ends of the leads over the bases.
Claim 3
Dependent Claim
19 words
The method of claim 1 and further including the step of: curing the adhesive in presence of infrared radiation.
Claim 4
Dependent Claim
35 words
The method of claim 1 and further including the step of: coating a second surface of the semiconductor chips and the adjoining portions of the frames with an encapsulating material to encapsulate the semiconductor chips.
Claim 5
Dependent Claim
20 words
The method of claim 3 and further including the step of: curing the encapusulating material in presence of infrared radiation.
Claim 6
Dependent Claim
16 words
The method of claim 1 wherein the steps of severing and bending are performed essentially simulataneously.
Claim 7
Dependent Claim
32 words
The method of claim 1 and further including the step of: removing the semiconductor chips from the carrier tape by severing the frames near points where the frames extend beyond the bases.
Claim 8
Dependent Claim
30 words
The method of claim 1 wherein the frames include a pair of parallel strips extending from a first edge of the openings in the substrate to a second opposite edge.
Claim 9
Dependent Claim
31 words
The method of claim 7 wherein the frames further includes a pair of cross bars provided between the parallel strips to define generally rectangular openings for alignment with the semiconductor chips.
Claim 10
Dependent Claim
20 words
The method of claim 8 wherein the first free ends of the leads are positioned over the generally rectangular openings.
Claim 11
Dependent Claim
31 words
The method of claim 9 wherein the leads extend from edges of the openings in the conductive layer in a direction generally perpendicular to a longitudinal direction of the parallel strips.
Claim 12
Dependent Claim
19 words
The method of claim 10 wherein the bases are generally rectangular, with first and second generally parallel major surfaces.
Claim 13
Dependent Claim
34 words
The method of claim 11 wherein the first major surface of the bases face and are generally parallel to the first surface of the semiconductor chips when the bases are positioned in the nests.
Claim 14
Dependent Claim
36 words
The method of claim 12 wherein the bases have a thickness which is less than a length of the leads so that the second free ends are bent over the second major surface of the bases.
Claim 15
Dependent Claim
12 words
The method of claim 1 wherein the bases are made of polyimide.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-08-31 | 1991-03-02 | 1991-09-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-08-31 | 1995-03-02 | 1995-09-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-08-31 | 1999-03-02 | 1999-09-01 | $7700.00 | Window Closed / Lapsed |