Redox reagent-containing post-etch residue cleaning composition

Claim 1

A post-etch residue cleaner composition, comprising: (a) from about 1 to about 70% by weight of an organic polar solvent having a dipole moment of more than 3.5; (b) from about 1 to about 70% by weight of an alkanolamine compound having a boiling point higher than 150° C. at atmospheric pressure; (c) from about 0.1 to about 10% by weight of an amino acid selected from the group consisting of compounds having the formula (I): ##STR4## wherein p is an integer ranging from 1-3; R 1 and R 2 are each independently selected from the group consisting of hydrogen and compounds having the formula (II): ##STR5## wherein R 5 , R 6 , and R 7 are each independently selected from hydrogen, --OH, --CH 2 OH, alkyl, alkoxy, phenyl, and mono-, di- or tri-hydroxy-substituted phenyl groups; and R 3 and R 4 are each independently selected from the group consisting of hydroxy and compounds having the formula (III): ##STR6## wherein X', Y', and Z' are each independently selected from hydrogen, --OH, --CH 2 OH, --CH 2 CH 2 OH, alkyl, or alkoxy group, and at least one of them is --OH, --CH 2 OH or --CH 2 CH 2 OH; (d) from about 1 to about 20% by weight of a redox reagent having a redox potential in the range between +1.0 V and -2.0 V vs. SHE (at pH=7) selected from the group consisting of sugar alcohols, piperidine, aniline, o-phenylenediamine, hydrazine, 1,10-phenanthroline and benzidine; and (e) optionally, from about 0% to about 90% by weight of water; all percents based on the total weight of the cleaner composition.