US4824763A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Triamine positive photoresist stripping composition and prebaking process
Assignee: EKC Technology Inc
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Filing: 1987-07-30
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Granted: 1989-04-25
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Expires: 2007-07-30
Abstract
Abstract A stripping composition for removing positive organic photoresist from a substrate, such as a semiconductor wafer, contains a triamine, such as diethylene triamine, and a nonpolar or polar organic solvent, such as N-methyl pyrrolidone. This composition will remove positive photoresist from semiconductor wafers, even after ion implantation into the wafers through the positive photo-resist. The wafers are immersed in the composition, for example, at a temperature of 110° C. for five minutes, in an ultrasonic bath after heavy ion implantation doses through the photoresist, such as 1×10 16 ions/cm 2 , for complete removal of the photoresist. Prebaking the photoresist at a temperature of between about 150° and 220° C. for a time of from about 15 minutes to about 30 minutes, prior to stripping the positive organic photoresist layer with the triamine, enhances the removal.
Inventors
- 👤 Wai M. Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 17:54
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/42; G03F7/422; G03F7/425; Y; Y10; Y10S; Y10S438/00; Y10S438/942; Y10S438/948
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
82 words
A composition for the removal of a positive organic photoresist from a substrate, which comprises a triamine having the general formula: ##STR2## wherein R 1 and R 2 are, independently in each case, a difunctional straight or branched chain hydrocarbyl or substituted hydrocarbyl group having from about 2 to about 20 carbon atoms in sufficient amounts to remove the photoresist from the substrate and a nonpolar aliphatic or aromatic hydrocarbon or chlorinated hydrocarbon or polar pyrrolidone, dimethyl formamide or butyrolactone organic solvent.
Claim 2
Dependent Claim
82 words
A composition for the removal of a positive organic photoresist from a substrate, which comprises a triamine having the general formula: ##STR2## wherein R 1 and R 2 are, independently in each case, a difunctional straight or branched chain hydrocarbyl or substituted hydrocarbyl group having from about 2 to about 20 carbon atoms in sufficient amounts to remove the photoresist from the substrate and a nonpolar aliphatic or aromatic hydrocarbon or chlorinated hydrocarbon or polar pyrrolidone, dimethyl formamide or butyrolactone organic solvent.
Claim 3
Dependent Claim
12 words
The composition of claim 1 in which the triamine is diethylene triamine.
Claim 4
Dependent Claim
16 words
the composition of claim 2 in which the organic solvent is N-methyl pyrrolidone or dimethyl formamide.
Claim 5
Dependent Claim
43 words
The composition of claim 1 in which the triamine is present in an amount of from about 40 to about 75 weight percent and the organic solvent is present in an amount of from about 60 weight percent to about 25 weight percent.
Claim 6
Dependent Claim
74 words
A composition for the removal of a positive organic photoresist from a substrate, which comprises diethylene triamine in sufficient amounts to remove the photoresist from the substrate and an N-methyl pyrrolidone or dimethyl formamide solvent, the diethylene triamine being precent in an amount from about 40 to about 75 weight percent and the N-methyl pyrrolidone or dimethyl formamide solvent being present in an amount of from about 60 weight to about 25 weight percent.
Claim 7
Dependent Claim
74 words
A composition for the removal of a positive organic photoresist from a substrate, which comprises diethylene triamine in sufficient amounts to remove the photoresist from the substrate and an N-methyl pyrrolidone or dimethyl formamide solvent, the diethylene triamine being precent in an amount from about 40 to about 75 weight percent and the N-methyl pyrrolidone or dimethyl formamide solvent being present in an amount of from about 60 weight to about 25 weight percent.
Claim 8
Dependent Claim
78 words
A process for stripping positive organic photoresist from a substrate, which comprises contacting the positive organic photoresist with a triamine having the general formula: ##STR3## wherein R 1 and R 2 are, independently in each case, a difunctional straight or branched chain hydrocarbyl or substituted hydrocarbyl group having from about 2 to about 20 carbon atoms at a temperature of at least about 80° C. for a time sufficient to remove the positive organic photoresist from the substrate.
Claim 9
Dependent Claim
78 words
A process for stripping positive organic photoresist from a substrate, which comprises contacting the positive organic photoresist with a triamine having the general formula: ##STR3## wherein R 1 and R 2 are, independently in each case, a difunctional straight or branched chain hydrocarbyl or substituted hydrocarbyl group having from about 2 to about 20 carbon atoms at a temperature of at least about 80° C. for a time sufficient to remove the positive organic photoresist from the substrate.
Claim 10
Dependent Claim
39 words
The process of claim 6, in which the positive organic photoresist is contacted with the triamine at a temperature between about 80° C. to about 120° C. for a time of from about 1 minute to about 20 minutes.
Claim 11
Dependent Claim
13 words
The process of claim 7 in which the substrate is a semiconductor wafer.
Claim 12
Dependent Claim
12 words
The process of claim 6 in which the triamine is diethylene triamine.
Claim 13
Dependent Claim
13 words
The process of claim 6 in which the positive photoresist contains dopant impurities.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-04-24 | 1992-10-24 | 1993-04-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-04-24 | 1996-10-24 | 1997-04-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-04-24 | 2000-10-24 | 2001-04-25 | $7700.00 | Window Closed / Lapsed |