Patent US5376326A successfully refreshed from Google Patents.
US5376326A
Expired / Lapsed
US
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Methods for making multilayer printed circuit boards
Assignee: JACKSON WILLARD T
•
Filing: 1989-08-23
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Granted: 1994-12-27
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Expires: 2009-08-23
Abstract
Abstract A method for making a multilayered printed circuit board including the steps of arranging two plates in spaced relation, arranging a perimetral seal between the two plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, placing the chamber under vacuum, injecting a settable matrix material into the chamber, compressing the end plates towards one another to achieve the desired outer dimensions of the board, and curing the settable matrix material.
Inventors
- 👤 Jonas Medney
- 👤 Fred E. Klimpl
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:57
CPC Classifications
B; B29; B29C; B29C70/00; B29C70/04; B29C70/28; B29C70/30; B29C70/34; B29C70/347; B32; B32B; B32B5/00; B32B5/02; B32B5/12; B29C53/00; B29C53/56; B29C53/564; B29C53/58; B29C53/76; B29C53/80; B29C53/8008; B29C53/8016; B29C70/06; B29C70/10; B29C70/16; B29C70/20; B29C70/202; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; B29C2793/00; B29C2793/009; B29C53/82; B29C53/821; B29L; B29L2031/00; B29L2031/34; B29L2031/3425; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0145; H05K2201/02; H05K2201/0275; H05K2201/0278; H05K2201/0287; H05K2203/00; H05K2203/08; H05K2203/085; H05K2203/13; H05K2203/1305; H05K2203/1327; H05K3/0011; H05K3/0044; H05K3/0047; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T29/49174; Y10T29/49176; Y10T428/00; Y10T428/24; Y10T428/24058; Y10T428/24074
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
104 words
A method of making a multilayer printed circuit board comprising arranging two end plates in spaced relation, arranging a perimetral seal between the plates with an upper opening in the seal to form an upwardly open chamber, arranging a plurality of printed circuit boards, each having a printed metal circuit thereon, between the plates in spaced relation to one another, inserting a spreader through said opening to spread the boards, injecting a settable material into said chamber between the spread boards, removing said spreader from between the boards and curing the settable material to set the same, thus forming a multilayer printed circuit board.
Claim 2
Independent Claim
104 words
A method of making a multilayer printed circuit board comprising arranging two end plates in spaced relation, arranging a perimetral seal between the plates with an upper opening in the seal to form an upwardly open chamber, arranging a plurality of printed circuit boards, each having a printed metal circuit thereon, between the plates in spaced relation to one another, inserting a spreader through said opening to spread the boards, injecting a settable material into said chamber between the spread boards, removing said spreader from between the boards and curing the settable material to set the same, thus forming a multilayer printed circuit board.
Claim 3
Dependent Claim
35 words
A method as claimed in claim 1 which further comprises placing the chamber under vacuum before the settable material is injected therein, and maintaining the vacuum until the end plates are compressed toward each other.
Claim 4
Dependent Claim
24 words
A method as claimed in claim 1 wherein the spaced relation is obtained by spacers mounted on the boards before the boards are stacked.
Claim 5
Dependent Claim
16 words
A method as claimed in claim 3 wherein the spacers are perimetrally mounted on the boards.
Claim 6
Dependent Claim
20 words
A method as claimed in claim 4 wherein the spacers are removed from the boards after the liquid has set.
Claim 7
Dependent Claim
29 words
A method as claimed in claim 5 wherein the boards are formed of a plastic matrix with reinforcing filaments therein and said settable material is compatible with said matrix.
Claim 8
Dependent Claim
18 words
A method as claimed in claim 1 comprising sandwiching a fabric between at least some of the boards.
Claim 9
Dependent Claim
15 words
A method as claimed in claim 7 wherein the fabric is woven of fiberglass filaments.
Claim 10
Dependent Claim
17 words
A method as claimed in claim 6 comprising winding filaments around the boards before stacking the boards.
Claim 11
Dependent Claim
21 words
A method as claimed in claim 6 comprising arranging stops between the end plates and at least one of the boards.
Claim 12
Dependent Claim
25 words
A method as claimed in claim 1 wherein the spaced relation is achieved using solid or porous spacers to set the distance between the boards.
Claim 13
Independent Claim
99 words
A method for making a multilayer printed circuit board which comprises: assembling a plurality of printed circuit boards in spaced relation to form an assembly; placing the assembly of printed circuit boards into a vessel comprising two outer plates which are essentially parallel and a U-shaped gasket on three marginal side portions therebetween; placing the assembly and vessel into a vacuum chamber and evacuating same; injecting a settable resin into the vessel to fill it to the desired level corresponding to the volume of the multilayer circuit board; and curing the resin to form the multilayer printed circuit board.
Claim 14
Independent Claim
99 words
A method for making a multilayer printed circuit board which comprises: assembling a plurality of printed circuit boards in spaced relation to form an assembly; placing the assembly of printed circuit boards into a vessel comprising two outer plates which are essentially parallel and a U-shaped gasket on three marginal side portions therebetween; placing the assembly and vessel into a vacuum chamber and evacuating same; injecting a settable resin into the vessel to fill it to the desired level corresponding to the volume of the multilayer circuit board; and curing the resin to form the multilayer printed circuit board.
Claim 15
Dependent Claim
18 words
The method of claim 12 wherein the spaced relation of the boards is obtained by using solid spacers.
Claim 16
Dependent Claim
18 words
The method of claim 12 wherein the spaced relation of the boards is obtained by using porous spacers.
Claim 17
Dependent Claim
19 words
The method of claim 12 wherein the spaced relation of the boards is obtained by using solid non-conductive spacers.
Claim 18
Dependent Claim
19 words
The method of claim 12 wherein the spaced relation of the boards is obtained by using porous non-conductive spacers.
Claim 19
Dependent Claim
20 words
A method as claimed in claim 12 wherein the spacers are formed of a plastic matrix with reinforcing filaments therein.
Claim 20
Dependent Claim
18 words
A method as claimed in claim 12 wherein the spacers comprise filaments in the form of a fabric.
Claim 21
Dependent Claim
29 words
A method as claimed in claim 12 which further comprises arranging stops between the outer plates and at least two of the boards and between the two outer plates.
Claim 22
Dependent Claim
34 words
A method as claimed in claim 12 which further comprises placing the chamber under vacuum before the resin is injected therein, and maintaining the vacuum until the outer plates are compressed towards each other.
Claim 23
Independent Claim
90 words
A method of making a multilayer printed circuit board comprising arranging two plates in spaced relation, arranging a perimetral seal between the plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, injecting a settable matrix material into the chamber and around the structures, compressing the end plates towards each other to achieve the desired outer dimensions of the board, and curing the settable matrix material to set the same.
Claim 24
Independent Claim
90 words
A method of making a multilayer printed circuit board comprising arranging two plates in spaced relation, arranging a perimetral seal between the plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, injecting a settable matrix material into the chamber and around the structures, compressing the end plates towards each other to achieve the desired outer dimensions of the board, and curing the settable matrix material to set the same.
Claim 25
Dependent Claim
41 words
A method as claimed in claim 21 wherein the chamber is placed under a vacuum before the settable matrix material is injected into the chamber and the vacuum is maintained at least until the end plates are compressed towards each other.
Claim 26
Dependent Claim
21 words
A method as claimed in claim 21 wherein each circuit board which includes a circuit pattern on at least one side.
Claim 27
Dependent Claim
30 words
A method as claimed in claim 23 wherein the circuit boards are fixed in relative to each other so that the circuits are in registration and in a desired spacing.
Claim 28
Dependent Claim
25 words
A method as claimed in claim 24 comprising sandwiching a fabric between at least some of the printed circuit boards to achieve the desired spacing.
Claim 29
Dependent Claim
15 words
A method as claimed in claim 25 wherein the fabric is woven of fiberglass filaments.
Claim 30
Dependent Claim
20 words
A method as claimed in claim 24 further wherein the spacing between the boards is achieved by a non-conductive separator.
Claim 31
Dependent Claim
22 words
A method as claimed in claim 24 which further comprises winding filaments around the boards before placing the boards between the plates.
Claim 32
Dependent Claim
39 words
A method as claimed in claim 21 which further comprises providing a metal on at least one of the plates and transferring the metal to the adjacent outer surface of the matrix material of the multilayer printed circuit board.
Claim 33
Dependent Claim
13 words
A method as claimed in claim 29 wherein the metal comprises copper foil.
Claim 34
Dependent Claim
29 words
A method as claimed in claim 21 which further comprises incorporating a filler into the settable matrix material prior to introducing the settable matrix material between the end plates.
References Cited (Backward Citations)
US2974284A
Cited
US307583A
Cited
US1505600A
Cited
US2406846A
Cited
US2344537A
Cited
US2569292A
Cited
US2453223A
Cited
US2589503A
Cited
US2638278A
Cited
US2912177A
Cited
US2874045A
Cited
US2936129A
Cited
US2883592A
Cited
US2964442A
Cited
US3085295A
Cited
US3041230A
Cited
US3135823A
Cited
US3143306A
Cited
GB989124A
Cited
US3194867A
Cited
US3301730A
Cited
US3258379A
Cited
US3183286A
Cited
US3230163A
Cited
US3227383A
Cited
US3112897A
Cited
US3360410A
Cited
US3212725A
Cited
US3324014A
Cited
US3325881A
Cited
US3276106A
Cited
US3348990A
Cited
US3425885A
Cited
US3440722A
Cited
US3436819A
Cited
US3698082A
Cited
US3532587A
Cited
US3480498A
Cited
US3537937A
Cited
US3492392A
Cited
US3511739A
Cited
US3425884A
Cited
US3740285A
Cited
US3751545A
Cited
US3686051A
Cited
US3681171A
Cited
US3649402A
Cited
US3607566A
Cited
US3644165A
Cited
US3565741A
Cited
US3664786A
Cited
US3960635A
Cited
US3846525A
Cited
US3990926A
Cited
US3801401A
Cited
US3756905A
Cited
US3779851A
Cited
GB1364076A
Cited
US3869563A
Cited
US3984598A
Cited
US3902944A
Cited
US4064606A
Cited
US4053370A
Cited
US4073699A
Cited
US4234553A
Cited
US4150201A
Cited
US4313995A
Cited
US4180608A
Cited
US4209482A
Cited
US4252588A
Cited
US4333900A
Cited
US4214026A
Cited
US4415403A
Cited
US4290838A
Cited
US4250616A
Cited
US4454184A
Cited
US4372499A
Cited
US4312829A
Cited
US4338070A
Cited
US4571279A
Cited
US4346516A
Cited
US4522667A
Cited
US4357395A
Cited
US4385952A
Cited
US4455181A
Cited
US4339407A
Cited
US4381852A
Cited
US4529139A
Cited
US4374080A
Cited
US4480975A
Cited
US4420359A
Cited
US4460633A
Cited
US4606787A
Cited
US4555086A
Cited
US4528214A
Cited
US4635071A
Cited
US4560138A
Cited
US4539253A
Cited
US4872825A
Cited
US4623500A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-26 | 1998-06-27 | 1998-12-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-26 | 2002-06-27 | 2002-12-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-26 | 2006-06-27 | 2006-12-27 | $7700.00 | Window Closed / Lapsed |