Method of fabricating an electrostatic print head

Claim 1

The method of fabricating an electrostatic print head comprising the steps of: etching holes through a glass or ceramic substrate at predetermined positions; vacuum depositing a first metal layer on both surfaces of the substrate and onto the surfaces of the holes previously etched through the substrate to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; electroplating a second metal layer on the surfaces of the first metal layer to produce a planar structure of uniform composition and thickness; forming a photoresist pattern on one surface of the second metal layer defining a high resolution array of electrode lines extending along a first direction, with the ends of the electrode lines lying along an edge of the substrate and defining a high resolution array of writing styli, and a pad area on each electrode line surrounding a respective one of the holes through the substrate; forming a photoresist pattern on the opposite surface of the second metal layer to define a high resolution array of buss lines extending along a transverse direction to the first direction, with a connector area on each of the buss lines and a pad area on each of the buss lines in registration with a pad area of a respective electrode line and surrounding a respective hole through the substrate; plating a third metal layer on all exposed surfaces of said second metal layer defined by the photoresist patterns to produce a multilayered metal structure of uniform thickness and conductivity; plating the styli of the electrode lines to intended precisely configured cross-sectional shape and size; removing the photoresist material from both surfaces of the substrate; and selectively etching the exposed first and second metal layers to leave the third metal electrode line and buss line patterns on respective substrate surfaces, the electrode lines and buss lines having high resolution and uniform composition without breaks or cracks.

Claim 2

The method of fabricating an electrostatic print head comprising the steps of: etching holes through a glass or ceramic substrate at predetermined positions; vacuum depositing a first metal layer on both surfaces of the substrate and onto the surfaces of the holes previously etched through the substrate to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; electroplating a second metal layer on the surfaces of the first metal layer to produce a planar structure of uniform composition and thickness; forming a photoresist pattern on one surface of the second metal layer defining a high resolution array of electrode lines extending along a first direction, with the ends of the electrode lines lying along an edge of the substrate and defining a high resolution array of writing styli, and a pad area on each electrode line surrounding a respective one of the holes through the substrate; forming a photoresist pattern on the opposite surface of the second metal layer to define a high resolution array of buss lines extending along a transverse direction to the first direction, with a connector area on each of the buss lines and a pad area on each of the buss lines in registration with a pad area of a respective electrode line and surrounding a respective hole through the substrate; plating a third metal layer on all exposed surfaces of said second metal layer defined by the photoresist patterns to produce a multilayered metal structure of uniform thickness and conductivity; plating the styli of the electrode lines to intended precisely configured cross-sectional shape and size; removing the photoresist material from both surfaces of the substrate; and selectively etching the exposed first and second metal layers to leave the third metal electrode line and buss line patterns on respective substrate surfaces, the electrode lines and buss lines having high resolution and uniform composition without breaks or cracks.

Claim 5

The method of fabricating an electrostatic print head comprising the steps of: etching holes through a glass or ceramic substrate at predetermined positions; vacuum depositing a metal layer on both surfaces of the substrate and onto the surfaces of the holes previously etched through the substrate to provide a conductive connection through the etched holes to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; forming by photoetching and electroforming a high resolution array of electrode lines of electrically conductive material on one surface of the glass or ceramic substrate, each of the lines having uniform composition without breaks or cracks, the ends of the electrode lines lying along an edge of the substrate and defining a high resolution array of styli for contacting a writing surface, and a pad area on each electrode line surrounding a respective one of the holes through the substrate; forming by photoetching and electroforming a high resolution array of buss lines of electrically conductive material on the opposite surface of the substrate, each of the lines having uniform composition without breaks or cracks, and a pad area on each buss line in registration with a pad area of a respective electrode line and surrounding a respective hole through the substrate; plating the styli of the electrode lines to an intended precisely configured cross-sectional shape and size; and providing areas of the buss lines for connection to an electrical source for selectively applying signals to the buss lines and to associated electrode lines.

Claim 6

The method of fabricating an electrostatic print head comprising the steps of: etching holes through a glass or ceramic substrate at predetermined positions; vacuum depositing a metal layer on both surfaces of the substrate and onto the surfaces of the holes previously etched through the substrate to provide a conductive connection through the etched holes to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; forming by photoetching and electroforming a high resolution array of electrode lines of electrically conductive material on one surface of the glass or ceramic substrate, each of the lines having uniform composition without breaks or cracks, the ends of the electrode lines lying along an edge of the substrate and defining a high resolution array of styli for contacting a writing surface, and a pad area on each electrode line surrounding a respective one of the holes through the substrate; forming by photoetching and electroforming a high resolution array of buss lines of electrically conductive material on the opposite surface of the substrate, each of the lines having uniform composition without breaks or cracks, and a pad area on each buss line in registration with a pad area of a respective electrode line and surrounding a respective hole through the substrate; plating the styli of the electrode lines to an intended precisely configured cross-sectional shape and size; and providing areas of the buss lines for connection to an electrical source for selectively applying signals to the buss lines and to associated electrode lines.

Claim 7

The method of fabricating an electrostatic print head comprising the steps of: vacuum depositing a metal layer on both surfaces of a glass or ceramic substrate to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; forming by photoetching and electroforming a first high resolution array of electrode lines of electrically conductive material on one surface of the glass or ceramic substrate; forming by photoetching and electroforming a second high resolution array of electrode lines of electrically conductive material on the opposite surface of the substrate; the ends of the electrode lines of each array lying along an edge of the substrate and defining a high resolution array of styli for contacting a writing surface, the styli of the first array being in predetermined relationship with the styli of the second array; plating the styli of the first and second arrays of electrode lines to an intended precisely configured cross-sectional shape and size; providing a first high resolution array of buss lines on a second substrate which is disposed on said first array of electrode lines; providing a second high resolution array of buss lines of a third substrate which is disposed on said second array of electrode lines; and connecting the buss lines of said first and second arrays of buss lines to associated electrode lines of said first and second arrays of electrode lines.

Claim 8

The method of fabricating an electrostatic print head comprising the steps of: vacuum depositing a metal layer on both surfaces of a glass or ceramic substrate to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; forming by photoetching and electroforming a first high resolution array of electrode lines of electrically conductive material on one surface of the glass or ceramic substrate; forming by photoetching and electroforming a second high resolution array of electrode lines of electrically conductive material on the opposite surface of the substrate; the ends of the electrode lines of each array lying along an edge of the substrate and defining a high resolution array of styli for contacting a writing surface, the styli of the first array being in predetermined relationship with the styli of the second array; plating the styli of the first and second arrays of electrode lines to an intended precisely configured cross-sectional shape and size; providing a first high resolution array of buss lines on a second substrate which is disposed on said first array of electrode lines; providing a second high resolution array of buss lines of a third substrate which is disposed on said second array of electrode lines; and connecting the buss lines of said first and second arrays of buss lines to associated electrode lines of said first and second arrays of electrode lines.

Claim 9

The method of fabricating an electrostatic print head comprising the steps of: etching holes through a glass or ceramic substrate at predetermined positions; vacuum depositing a first metal layer on both surfaces of the substrate and onto the surfaces of the holes previously etched through the substrate to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; forming a photoresist pattern on one surface of the first metal layer defining a high resolution array of electrode lines extending along a first direction, with the ends of the electrode lines lying along an edge of the substrate and defining a high resolution array of writing styli, and a pad area on each electrode line surrounding a respective one of the holes through the substrate; forming a photoresist pattern on the opposite surface of the first metal layer to define a high resolution array of buss lines extending along a transverse direction to the first direction, with a connector area on each of the buss lines and a pad area on each of the buss lines in registration with a pad area of a respective electrode line and surrounding a respective hole through the substrate; plating a second metal layer on all exposed surfaces of said first metal layer defined by the photoresist patterns; plating the styli of the electrode lines to intended precisely configured cross-sectional shape and size; removing the photoresist material from both surfaces of the substrate; and selectively etching the exposed first metal layer to leave the second metal electrode line and buss line patterns on respective substrate surfaces, the electrode lines and buss lines having high resolution and uniform composition without breaks or cracks.

Claim 10

The method of fabricating an electrostatic print head comprising the steps of: etching holes through a glass or ceramic substrate at predetermined positions; vacuum depositing a first metal layer on both surfaces of the substrate and onto the surfaces of the holes previously etched through the substrate to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; forming a photoresist pattern on one surface of the first metal layer defining a high resolution array of electrode lines extending along a first direction, with the ends of the electrode lines lying along an edge of the substrate and defining a high resolution array of writing styli, and a pad area on each electrode line surrounding a respective one of the holes through the substrate; forming a photoresist pattern on the opposite surface of the first metal layer to define a high resolution array of buss lines extending along a transverse direction to the first direction, with a connector area on each of the buss lines and a pad area on each of the buss lines in registration with a pad area of a respective electrode line and surrounding a respective hole through the substrate; plating a second metal layer on all exposed surfaces of said first metal layer defined by the photoresist patterns; plating the styli of the electrode lines to intended precisely configured cross-sectional shape and size; removing the photoresist material from both surfaces of the substrate; and selectively etching the exposed first metal layer to leave the second metal electrode line and buss line patterns on respective substrate surfaces, the electrode lines and buss lines having high resolution and uniform composition without breaks or cracks.

Claim 13

The method of fabricating an electrostatic print head comprising the steps of: etching holes through a glass or ceramic substrate at predetermined positions; vacuum depositing a first metal layer on both surfaces of the substrate and onto the surfaces of the holes previously etched through the substrate to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; forming a photoresist pattern on one surface of the first metal layer defining a high resolution array of electrode lines extending along a first direction, with the ends of the electrode lines lying along an edge of the substrate and defining a high resolution array of writing styli, and a pad area on each electrode line surrounding a respective one of the holes through the substrate; forming a photoresist pattern on the opposite surface of the first metal layer to define a high resolution array of buss lines extending along a transverse direction to the first direction, with a connector area of each of the buss lines and a pad area on each of the buss lines in registration with a pad area of a respective electrode line and surrounding a respective hole through the substrate; plating a second metal layer on all exposed surfaces of said first metal layer defined by the photoresist patterns; plating the styli of the electrode lines to intended precisely configured cross-sectional shape and size; removing the photoresist material from both surfaces of the substrate; and selectively etching the exposed first metal layer to leave the second metal electrode line and buss line patterns on respective substrate surfaces, the electrode lines and buss lines having high resolution and uniform composition without breaks or cracks; providing a conformal coating of non-conductive plastic material over both substrate surfaces to produce a plate having flat upper and lower surfaces; placing two or more of such plates in laminated arrangement with the styli of each plate disposed in predetermined adjacent relation; and interposing an insulative spacer between adjacent plates to provide predetermined separation between the styli of the adjacent plates.

Claim 14

The method of fabricating an electrostatic print head comprising the steps of: etching holes through a glass or ceramic substrate at predetermined positions; vacuum depositing a first metal layer on both surfaces of the substrate and onto the surfaces of the holes previously etched through the substrate to produce a uniform conductive layer intimately adhered directly to the substrate and having the same smooth surface characteristics as the substrate surface; forming a photoresist pattern on one surface of the first metal layer defining a high resolution array of electrode lines extending along a first direction, with the ends of the electrode lines lying along an edge of the substrate and defining a high resolution array of writing styli, and a pad area on each electrode line surrounding a respective one of the holes through the substrate; forming a photoresist pattern on the opposite surface of the first metal layer to define a high resolution array of buss lines extending along a transverse direction to the first direction, with a connector area of each of the buss lines and a pad area on each of the buss lines in registration with a pad area of a respective electrode line and surrounding a respective hole through the substrate; plating a second metal layer on all exposed surfaces of said first metal layer defined by the photoresist patterns; plating the styli of the electrode lines to intended precisely configured cross-sectional shape and size; removing the photoresist material from both surfaces of the substrate; and selectively etching the exposed first metal layer to leave the second metal electrode line and buss line patterns on respective substrate surfaces, the electrode lines and buss lines having high resolution and uniform composition without breaks or cracks; providing a conformal coating of non-conductive plastic material over both substrate surfaces to produce a plate having flat upper and lower surfaces; placing two or more of such plates in laminated arrangement with the styli of each plate disposed in predetermined adjacent relation; and interposing an insulative spacer between adjacent plates to provide predetermined separation between the styli of the adjacent plates.